Goepel electronic has developed a boundary scan option for the Digitaltest In-Circuit Tester series MTS 180, MTS 300 and MTS 888. The solution integrates the recently launched hardware architecture Scanflex in combination with the boundary scan system software Cascon Galaxy, and also involves the ICT digital pin electronics.
“The result of the development cooperation is a completely integrated solution with interaction of the test resources of both systems,” said Bettina Becker, marketing and international sales manager for Goepel. “In particular, the direct control of the ICT pin electronics by the Boundary Scan environment has the advantage of each nail acting as additional virtual scan pin in a Boundary Scan test. Applying our philosophy of ‘Extended Boundary Scan’, the user now is able to dramatically increase the test coverage.”
The hardware is based on the Scanflex PCI controller models SFX/PCI1149-x with programmable TCK frequencies up to 20 MHz (A type) and 50 MHz (B type), respectively. The connection to the UUT uses transceiver model SFX-TAP4/C, which provides four programmable TAP for the optimal adaptation to the UUT. The UUT is contacted by means of the standard interface of the ICT. Also, 32 dynamic I/O are available on the hardware.
In terms of software, the complete Cascon Galaxy development and execution environment was integrated into the CITE operating system by Digitaltest via the CAPI interface. All Cascon software editions can run on the ICT.
The ICT pin electronics' control is managed with Hyscan technology implemented in the software. It enables the synchronisation of serial JTAG/Boundary Scan test vectors with parallel test vectors through a special emulation process. The parallel vectors are linked to the physical I/O interface at run time, providing tester hardware independence. The manual or automated generation of test vectors, debugging and fault diagnostic are executed by the native JTAG/Boundary Scan tools, whereby each ICT channel acts as a bi-directional Boundary Scan pin at the contacted net, completely transparent to the user.
GÖPEL electronic, goepel.com
“The result of the development cooperation is a completely integrated solution with interaction of the test resources of both systems,” said Bettina Becker, marketing and international sales manager for Goepel. “In particular, the direct control of the ICT pin electronics by the Boundary Scan environment has the advantage of each nail acting as additional virtual scan pin in a Boundary Scan test. Applying our philosophy of ‘Extended Boundary Scan’, the user now is able to dramatically increase the test coverage.”
The hardware is based on the Scanflex PCI controller models SFX/PCI1149-x with programmable TCK frequencies up to 20 MHz (A type) and 50 MHz (B type), respectively. The connection to the UUT uses transceiver model SFX-TAP4/C, which provides four programmable TAP for the optimal adaptation to the UUT. The UUT is contacted by means of the standard interface of the ICT. Also, 32 dynamic I/O are available on the hardware.
In terms of software, the complete Cascon Galaxy development and execution environment was integrated into the CITE operating system by Digitaltest via the CAPI interface. All Cascon software editions can run on the ICT.
The ICT pin electronics' control is managed with Hyscan technology implemented in the software. It enables the synchronisation of serial JTAG/Boundary Scan test vectors with parallel test vectors through a special emulation process. The parallel vectors are linked to the physical I/O interface at run time, providing tester hardware independence. The manual or automated generation of test vectors, debugging and fault diagnostic are executed by the native JTAG/Boundary Scan tools, whereby each ICT channel acts as a bi-directional Boundary Scan pin at the contacted net, completely transparent to the user.
GÖPEL electronic, goepel.com
Second-generation Condor 500 is now reportedly 30 % faster - with integrated boundary scan and implemented soft landing tool. Flying prober has unique drive technology via linear motor, to ensure high speed and accuracy. The complete software allows fast test program development directly out of the CAD data and the parts-lists. Off-line simulation, panels and different versions of PCBs are also supported. Allows ICT and functional test, opens check, memory test/and programming, boundary scan and vision. Boundary-scan integration allows the heads and further pins to be driven parallel to boundary-scan.Said to improve throughput 3 to 5X over conventional flying prober systems. Software has an integrated quality management system and paperless repair, statistics and fault coverage reports.
MTS300 Hybrid Combi Test System offers PXI functional test enhancement as well as a fixture lifting mechanism for ICT and functional test. Modular concept with up to 3456 “non multiplexed" pins and numerous functional test modules for automotive, telecom and flash on-board programming. Allows transfer of existing test programs and fixturing from other test systems.
Lambda In-Circuit Test System offers concurrent inline ICT/functional test. Parallel testing ensures throughput increases for high-volume PCB manufacturers.
Digitaltest GmbH, digitaltest.de or digitaltest.net
Booth A1, 365
MTS300 Hybrid Combi Test System offers PXI functional test enhancement as well as a fixture lifting mechanism for ICT and functional test. Modular concept with up to 3456 “non multiplexed" pins and numerous functional test modules for automotive, telecom and flash on-board programming. Allows transfer of existing test programs and fixturing from other test systems.
Lambda In-Circuit Test System offers concurrent inline ICT/functional test. Parallel testing ensures throughput increases for high-volume PCB manufacturers.
Digitaltest GmbH, digitaltest.de or digitaltest.net
Booth A1, 365
Customization options are available for 300L and 400L selective soldering machines. Features include combination mini-wave and full-wave soldering, dual pot systems, xy fluxers and endoscope process cameras. Additional options include custom nozzles, rotating landing tables, stamp soldering and batch conveyors. Both are compatible with lead-free alloys. 300L is the economical solution for selective soldering of through-hole components after reflow and includes bare board or mask grippers, internal spray or drop jet fluxers, and installation of various soldering nozzles ranging from 4 to 30 mm in diameter. The high-end 400L offers a three-stage inline system for a high-speed, automated soldering process.
Juki Automation Systems Inc., jas-smt.com
Assembléon will introduces new capabilities at Productronica, from enhanced machine multifunctionality to full-functioned remote operation of multiple production lines making ‘lights-out’ manufacturing in the mid-volume sector a reality.
New capabilities on the AX machine expand the component range from fine-pitch down to 01005s, with no decrease in speed. The machine features output scalability from 45 to 150k cph in 5k cph increments on the same footprint. Features supporting processing of a wide range of components include new digital vision systems, feeder options and z-force control. High feeder count allows a fixed set-up for production in many manufacturing environments; off-line set-up and verification using quick-change trolleys can also enable fast changeovers. Has on-line program editing and robot-level modularity.
AQ-2 ultra fine-pitch and oddform placer has an optimal output of 5.3k cph. Aligns with the AX for demanding component capabilities at any output. It places flip chips at 3.1 k cph, and large connectors or oddform component sat 3.9k cph.
With the same look and feel as the MG-1 (introduced at Apex), the MG-8 is equipped with a high-precision placement beam carrying three FNC heads, each carrying six nozzles, to handle components from 01005 to 55 x 100mm, with max. component height 25.5 mm. Precision z-force control delivers snap-in force for connectors and the delicate handling required to avoid cracking 01005s. Achieves accuracy ratings of 50 micron for chips and 30 micron for QFPs, and placement speed for ICs and QFPs of 7.5k cph. Accommodates 90 smart feeders along with stick, bulk and tray feeding solutions. A large component sequencer contains 60 pallets, with two in-line loading heads doubling the rate of delivery of components to the machine. An automatic tray stacker holds up to 30 trays in quick-change containers. Coplanarity system checks three components simultaneously, a e side viewing camera option verifies 01005 or 0201 presence at the nozzle. Has a nozzle cleaning system.
AMS 2.0 Advanced Manufacturing Suite for mid-volume manufacturers is designed to integrate the placement function into the production environment. It is focused on maximizing total production efficiency and providing connectivity to other machines and software used in the factory. Controls one or many production lines containing standalone or multiple mid-volume machines. Provides a comprehensive set of hardware and software tools. Manufacturers can choose their entry level and build as their requirements develop.
New capabilities on the AX machine expand the component range from fine-pitch down to 01005s, with no decrease in speed. The machine features output scalability from 45 to 150k cph in 5k cph increments on the same footprint. Features supporting processing of a wide range of components include new digital vision systems, feeder options and z-force control. High feeder count allows a fixed set-up for production in many manufacturing environments; off-line set-up and verification using quick-change trolleys can also enable fast changeovers. Has on-line program editing and robot-level modularity.
AQ-2 ultra fine-pitch and oddform placer has an optimal output of 5.3k cph. Aligns with the AX for demanding component capabilities at any output. It places flip chips at 3.1 k cph, and large connectors or oddform component sat 3.9k cph.
With the same look and feel as the MG-1 (introduced at Apex), the MG-8 is equipped with a high-precision placement beam carrying three FNC heads, each carrying six nozzles, to handle components from 01005 to 55 x 100mm, with max. component height 25.5 mm. Precision z-force control delivers snap-in force for connectors and the delicate handling required to avoid cracking 01005s. Achieves accuracy ratings of 50 micron for chips and 30 micron for QFPs, and placement speed for ICs and QFPs of 7.5k cph. Accommodates 90 smart feeders along with stick, bulk and tray feeding solutions. A large component sequencer contains 60 pallets, with two in-line loading heads doubling the rate of delivery of components to the machine. An automatic tray stacker holds up to 30 trays in quick-change containers. Coplanarity system checks three components simultaneously, a e side viewing camera option verifies 01005 or 0201 presence at the nozzle. Has a nozzle cleaning system.
AMS 2.0 Advanced Manufacturing Suite for mid-volume manufacturers is designed to integrate the placement function into the production environment. It is focused on maximizing total production efficiency and providing connectivity to other machines and software used in the factory. Controls one or many production lines containing standalone or multiple mid-volume machines. Provides a comprehensive set of hardware and software tools. Manufacturers can choose their entry level and build as their requirements develop.
Assembléon, assembleon.com
ArctiCore module technology, designed for thermal, mechanical and electrical performance, enables OEMs to cost-effectively increase available memory capacity to meet expanding application performance requirements.
Use a double-sided, multi-layer flexible circuit with embedded interconnect technology folded around a rigid thermal core to increase the available area for mounting devices while enhancing thermal management, reliability and thinness.
Aluminum core acts as a heat sink and mechanical stiffener to provide rigid foundation support and increase the contact area for dissipating heat away from the devices. Heat reductions range from 4 to 25°C, said to minimize BGA ball stress cracking and reduce wear and tear through the use of a tapered connector edge that lessens system insertion stress.
Complements all types of standard memory devices, from DDR1 and DDR2 to dual-die, stacked or planar packages. Also has applications in mixed environments that use various chip technologies, such as DSPs, controllers and ASIC processors.
Staktek, staktek.com
IFS-X (Intelligent Feeder System - next generation) uses Cogiscan’s RFID Smart Feeder technology to provide feeder set-up validation.
The IFS-X system eliminates human errors while reducing machine set-up and changeover time. It provides real-time inventory of components, feeders and trolleys, both on and off the placement machine. It can also gather detailed component traceability reports.
Juki Automation Systems, jas-smt.com
Cogiscan, cogiscan.com
The IFS-X system eliminates human errors while reducing machine set-up and changeover time. It provides real-time inventory of components, feeders and trolleys, both on and off the placement machine. It can also gather detailed component traceability reports.
Can be retrofitted to existing machines, trolleys and feeders.
Juki Automation Systems, jas-smt.com
Cogiscan, cogiscan.com
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