The Integrated Engineering Software portfolio allows engineers and physicists to design sensors, solenoids, motors, medical equipment, antennas, circuit boards and other electromechanical devices.
 
New 2-D releases offer Finite Element and Boundary Element Methods. Designers can choose the optimal solution method for solving complex prototype design problems. Allows the designer to customize the program to meet their analysis needs, including multi-physics applications. 
 
3-D releases have added the capability of linking to other CAD packages and has made major upgrades to its geometric modeler.  GUI enhancements make the program more user-friendly.
 
IES’s 2D and 3D specialty product, Lorentz, offers a broader range of analysis tools for designing beam and particle trajectories. These include probabilistic model of secondary electron emission, high frequency fields, tetrahedral mesh for space charge calculations, hyper emittance and phase space plots.
 

OmniFlex 10 reflow oven is said to feature advanced heating and cooling transfer technologies, energy efficient design concepts and reduced maintenance requirements.
 
Speedline will also mark the European launch of its XyflexPro dispensing platform and spotlight its recently released Accela stencil printer at the show.
 
The dispensing platform features an advanced composite gantry design structure and linear drive system using the latest in motion control drive technology. The platform has the structural rigidity and control needed to attain the high performance capabilities and speed demanded by challenging manufacturing requirements while providing flexibility to accommodate applications in both the SMT and semiconductor industries.
 
The printing system’s parallel processing technology is refocusing the measurement of printer performance from base cycle time to total throughput.  The system on display will have enhanced features such as a new software release, Grid-Lok and a barcode reader option for board-level SPC data and event tracking.
 
The company will also launch the next generation of its Vectra wave soldering system. The system features UltraFill nozzles, a High-Velocity Convection Topside preheat module and ServoJet fluxing technology. 
 
Speedline Technologies, speedlinetech.com
Booth A4 250

SwifTest 5.2, the latest version of the real-time statistical sampling software suite for semiconductor testing, claims to reduce test cost and improve quality and test efficiency.
 
Includes thee primary optional modules:
· SwifTest-Monitor captures test results in real-time from the tester and preprocesses the parametric data. With support for local, real-time alerts, it is a pre-requisite for Pintail’s sampling, outlier detection and TestScape database management system (DBMS).
· SwifTest-MX, a patented, real-time, statistical sampling tool, has proven to reduce test time by up to 40% in mixed-signal production at probe and final test.
· SwifTest-AQ outlier detection tool for reducing DPM by applying parts average testing in real-time; popular for automotive electronics at probe and final test.
 
New features include: Teradyne Flex ATE support; Part Average Testing (PAT) enhancements; Geographic Wafer Analysis option; SwifTest Commander; Device Profile Designer; Agilent Data Conduit; new triggers and alerts; and Lot Classification.
 
Pintail Technologies, pintail.com

LFFR lead-free flux remover is a fast-drying solvent cleaner formulated for the quick and efficient removal of lead-free residues. Said to be effective on R, RA, RMA and no-clean flux residues, and removes residues from SnPb soldering products. Comes in a 400ml aerosol with integral brush, enabling the product to be worked into areas of stubborn contamination. Features a 100% ozone-friendly solvent, and leaves a perfectly clean, dry surface, without the greasy deposits often left by conventional solvents.

Electrolube  (A division of HK Wentworth Ltd)
www.electrolube.com 

Christopher Associates www.christopherweb.com