VJ Electronix will display the Model 1550 fully automated x-ray inspection system in booth 5626 at Assembly Technology Expo in Rosemont, IL.
Designed for the manufacturing floor, features large board x-ray inspection with automated motion control, measurement and analysis. Includes advanced solid-state detector-based inspection for lead-free assembly, choice of Image Intensifier and CMOS-based high-resolution detectors, full programmability with integrated motion control and image measurement analysis, and simple set up of program using 1-2-GO Interface. Low maintenance, requires minimum operator intervention.
Is part of the 15XX Series, which is built around a choice of x-ray sources from 80 to 130 kV. 1550 offers a 130 kV x-ray source, with a continuously variable field of view (up to 1.8" with zoom).
Easy to learn, use and maintain. Provides: large-board handling area (18 x 24"), magnification 700X, low-maintenance, high MTBF, fully integrated compact system and image archiving in popular file formats.
The simple set up program using 1-2-GO interface allows users to characterize the entire process with one simple solution. Onscreen representation of boards for easy maneuvering allows for maximum productivity and quality assurance based on instant and accurate information.
Incorporates key innovations necessary for high-resolution x-ray microscopy:
· A revolutionary manipulator design that provides fast, accurate, repeatable sample positioning.
· The Nexus 300 software with 1-2-GO interface and onscreen sample representation for easy maneuverability
· CMOS-based 12 bit solid-state detectors for high-contrast resolution x-ray inspection.
Comes with an advanced image processor and a complete library of measurement and analysis tools. Proprietary New ElectroniX User Software (NEXUS) is used to enhance, analyze and view real-time x-ray images. The software comes with: advanced 1-2-GO based operator interface for easy programming in minutes; automated BGA analysis module (# of balls, void size, # of voids, ball size, pitch and circularity); percent void measurement module (user definable pass/fail thresholds); onscreen representation of sample; drill offset measurement module (deviation measurements, etc.); dimensional measurement module; wire sweep measurement module; quad-view display; Advanced Defect Enhancement module; histogram analysis tools (gray-level analysis); image filtering (3-D rendering, sharpen, relief, etc.) ; and pseudo color pallet manipulation.
VJ Electronix, vjelectronix.com
Designed for the manufacturing floor, features large board x-ray inspection with automated motion control, measurement and analysis. Includes advanced solid-state detector-based inspection for lead-free assembly, choice of Image Intensifier and CMOS-based high-resolution detectors, full programmability with integrated motion control and image measurement analysis, and simple set up of program using 1-2-GO Interface. Low maintenance, requires minimum operator intervention.
Is part of the 15XX Series, which is built around a choice of x-ray sources from 80 to 130 kV. 1550 offers a 130 kV x-ray source, with a continuously variable field of view (up to 1.8" with zoom).
Easy to learn, use and maintain. Provides: large-board handling area (18 x 24"), magnification 700X, low-maintenance, high MTBF, fully integrated compact system and image archiving in popular file formats.
The simple set up program using 1-2-GO interface allows users to characterize the entire process with one simple solution. Onscreen representation of boards for easy maneuvering allows for maximum productivity and quality assurance based on instant and accurate information.
Incorporates key innovations necessary for high-resolution x-ray microscopy:
· A revolutionary manipulator design that provides fast, accurate, repeatable sample positioning.
· The Nexus 300 software with 1-2-GO interface and onscreen sample representation for easy maneuverability
· CMOS-based 12 bit solid-state detectors for high-contrast resolution x-ray inspection.
Comes with an advanced image processor and a complete library of measurement and analysis tools. Proprietary New ElectroniX User Software (NEXUS) is used to enhance, analyze and view real-time x-ray images. The software comes with: advanced 1-2-GO based operator interface for easy programming in minutes; automated BGA analysis module (# of balls, void size, # of voids, ball size, pitch and circularity); percent void measurement module (user definable pass/fail thresholds); onscreen representation of sample; drill offset measurement module (deviation measurements, etc.); dimensional measurement module; wire sweep measurement module; quad-view display; Advanced Defect Enhancement module; histogram analysis tools (gray-level analysis); image filtering (3-D rendering, sharpen, relief, etc.) ; and pseudo color pallet manipulation.
VJ Electronix, vjelectronix.com
Finetech has developed a Mobile Device Rework (MDR) System for the Fineplacer Pico for the demands of reworking mobile phones, PDAs, gaming handhelds, multimedia portables, Bluetooth and WLAN equipment, memory cards, notebooks and portable medical equipment such as pacemakers. The new system will be on display in booth 5002 at ATExpo in Rosemont, IL
Equipped with a new motorized placement module, the system achieves a degree of reproducibility unrivalled in manual rework and minimizes operator influence. WinCOMISS software controls bond force during placement and soldering, resulting in a production-compatible reflow process.
The lead-free capable system provides the capability to perform the entire rework process for the smallest of devices up to RF shield cans, and for extremely high-density packages. A fully automated version is also available to process pallets of system boards through the entire rework cycle: shield can and device removal, residual solder paste removal, printing, and device and shield replacement.
Also available, but not on display, is an optional integrated solder paste dispenser module that can dispense solder paste dots small enough for 01005 rework. It can also be configured to dispense epoxy and underfill.
Finetech Inc., finetechusa.com
Equipped with a new motorized placement module, the system achieves a degree of reproducibility unrivalled in manual rework and minimizes operator influence. WinCOMISS software controls bond force during placement and soldering, resulting in a production-compatible reflow process.
The lead-free capable system provides the capability to perform the entire rework process for the smallest of devices up to RF shield cans, and for extremely high-density packages. A fully automated version is also available to process pallets of system boards through the entire rework cycle: shield can and device removal, residual solder paste removal, printing, and device and shield replacement.
Also available, but not on display, is an optional integrated solder paste dispenser module that can dispense solder paste dots small enough for 01005 rework. It can also be configured to dispense epoxy and underfill.
Finetech Inc., finetechusa.com
BP Microsystems will highlight the 2710 concurrent programming system in booth 5635 at ATExpo. The company will also display a video showing its automated device programmers.
The 2710 combines 0.24 s/Mb programming technology, FX4 socket modules and the Concurrent Programming system for higher throughput, reduced cost per device and faster turnarounds. Improved the site hardware enables programming of devices with densities up to 4 Gbits. Incorporates high-speed USB 2.0 standard bus for communications.
Designed specifically for high density devices and the associated longer programming times, including Flash. Programs a 64-Mb device in 15 sec. FX4 socket modules program up to four devices simultaneously per site. With two, four or six programming sites, the 2710 can program up to 24 devices at the same time. The programmer is compatible with all existing socket modules — standard and automated.
Supports all device packages, including but not limited to DIP, SDIP, PLCC, TSOP, SSOP, PCMCIA, SOIC, LCC, QFP, PQFP, PGA, SIMM, CSP, BGA, microBGA, TQFP and TSSOP. Guards against passing blank parts.
Supports more than 22,000 devices with very low voltage devices down to 1.5 V (Vdd), including, but not limited to, EPROM, EEPROM, Flash EPROM, Microcontrollers, PLD, CPLD, FPGA and antifuse FPGAs.
Supports more than 22,000 devices with very low voltage devices down to 1.5 V (Vdd), including, but not limited to, EPROM, EEPROM, Flash EPROM, Microcontrollers, PLD, CPLD, FPGA and antifuse FPGAs.
BP Microsystems, bpmicro.com
The Automation Group of Tyco Electronics will highlight the P350 x-y insertion machine in booth 5438 at AT Expo.
Used for the automatic insertion of reeled pin, tab and receptacle products into PCBs, can apply both through-hole solder and press-fit components.
Can be equipped with up to three product-specific insertion heads. Each incorporates a rotary insertion finger to allow products to be inserted at different angles without having to rotate the PCB.
Is SMEMA compatible for inline operation. PCBs are positioned under the insertion head by an x-y table that is driven by servo motors. A multi-tasking controller drives the motors and monitors the insertion process.
Programming can be executed through the Windows-based interface, off-line or by converting CAD data of various formats.
Features: high-speed AC servo motors for the x-y table and insertion head for reduced cycle times; automatic tool change feature for up to three insertion heads; SMEMA compatibility; optical sensors for automatic position correction; PCB thickness measurement; rotary insertion finger to apply products at various angles without reducing cycle time; and monitoring of the insertion forces of press-fit components.
Inserts up to 300 pins/min., has maximum insertion area of 450 x 450 mm and features 0.02 mm repeatability.
Tyco Electronics Automation Group (TEAG), http://automation.tycoelectronics.com
Used for the automatic insertion of reeled pin, tab and receptacle products into PCBs, can apply both through-hole solder and press-fit components.
Can be equipped with up to three product-specific insertion heads. Each incorporates a rotary insertion finger to allow products to be inserted at different angles without having to rotate the PCB.
Is SMEMA compatible for inline operation. PCBs are positioned under the insertion head by an x-y table that is driven by servo motors. A multi-tasking controller drives the motors and monitors the insertion process.
Programming can be executed through the Windows-based interface, off-line or by converting CAD data of various formats.
Features: high-speed AC servo motors for the x-y table and insertion head for reduced cycle times; automatic tool change feature for up to three insertion heads; SMEMA compatibility; optical sensors for automatic position correction; PCB thickness measurement; rotary insertion finger to apply products at various angles without reducing cycle time; and monitoring of the insertion forces of press-fit components.
Inserts up to 300 pins/min., has maximum insertion area of 450 x 450 mm and features 0.02 mm repeatability.
Tyco Electronics Automation Group (TEAG), http://automation.tycoelectronics.com
Essemtec will highlight CSM7100, a flexible pick-and-place system with intelligent feeders for high-mix/low-volume production, in booth 5800 at the upcoming AT Expo.
Standard laser alignment is accurate, reliable and maintenance-free. Every component is measured and aligned on-the-fly. Also, tape reels, tape strips, sticks and trays of any size can be used to feed parts. Components as tall as 15 mm can be placed.
Fulfills the requirements of high-mix/low-volume SMT production with a wide application range. Benefits include a feeder capacity of 100 x 8 mm, intelligent tape feeders from 8 to 56 mm, 4000 placements per hour, optical on-the-fly alignment, easy graphical operation system, integrated dispensing system, barcode-based feeder setup and a universal CAD data input filter.
Lightplacer Windows-based software features a fully graphical man-machine interface. Large feeder capacity and automatic recognition of intelligent feeders ensure minimum changeover times and error-free placement. Tape feeders are electrically driven and the pitch is programmable. Can be programmed on- or offline. Barcode labels on feeders and components guarantee correct feeder setup using a barcode reader.
Has a footprint of 80 x 80 cm.
Standard laser alignment is accurate, reliable and maintenance-free. Every component is measured and aligned on-the-fly. Also, tape reels, tape strips, sticks and trays of any size can be used to feed parts. Components as tall as 15 mm can be placed.
Fulfills the requirements of high-mix/low-volume SMT production with a wide application range. Benefits include a feeder capacity of 100 x 8 mm, intelligent tape feeders from 8 to 56 mm, 4000 placements per hour, optical on-the-fly alignment, easy graphical operation system, integrated dispensing system, barcode-based feeder setup and a universal CAD data input filter.
Lightplacer Windows-based software features a fully graphical man-machine interface. Large feeder capacity and automatic recognition of intelligent feeders ensure minimum changeover times and error-free placement. Tape feeders are electrically driven and the pitch is programmable. Can be programmed on- or offline. Barcode labels on feeders and components guarantee correct feeder setup using a barcode reader.
Has a footprint of 80 x 80 cm.
Essemtec, essemtec.com
Rohm and Haas Electronic Materials is exhibiting at Productronica in Munich, November 15 – 18, in Hall B4, Stand 205.
The company will present new processes for both the printed circuit, packaging and finishing markets.
Circuposit C3 Ultra is the latest self-accelerating electroless copper process and is complemented by two additions to the electroplating portfolio with Copper Gleam Microfill copper via-filling process and Copper Gleam CuPulse pulse plating acid copper process.
The final finish product line is enhanced with Duraposit SMT 88 electroless nickel for ENIG applications, and Pallamerse SMT 2000 electroless palladium.
In the imaging sector, R&H will show the Lithojet UV Mask, for inkjet able phototool, and its halogen-free soldermask product, Durashield 5900HF.
The company has created planarisation package for thick copper circuitry with Filler Coater DF 1122 and Durashield V42 Filler and Mask.
The Packaging and Finishing markets see a new pure tin, Solderon ST-380, and high speed bright tin, Solderon BT-280, designed for the lead-free electrical connector applications.
The company will present new processes for both the printed circuit, packaging and finishing markets.
Circuposit C3 Ultra is the latest self-accelerating electroless copper process and is complemented by two additions to the electroplating portfolio with Copper Gleam Microfill copper via-filling process and Copper Gleam CuPulse pulse plating acid copper process.
The final finish product line is enhanced with Duraposit SMT 88 electroless nickel for ENIG applications, and Pallamerse SMT 2000 electroless palladium.
In the imaging sector, R&H will show the Lithojet UV Mask, for inkjet able phototool, and its halogen-free soldermask product, Durashield 5900HF.
The company has created planarisation package for thick copper circuitry with Filler Coater DF 1122 and Durashield V42 Filler and Mask.
The Packaging and Finishing markets see a new pure tin, Solderon ST-380, and high speed bright tin, Solderon BT-280, designed for the lead-free electrical connector applications.
Rohm and Haas, rohmhaas.com
