ESD Drawer Storage Cabinets are certified to meet specific electrical property requirements, assuring static dissipation at a safe rate. Can be protected by static dissipative powder coat finishes in five standard colors. Drawer interiors can contain conductive plastic boxes and conductive slotted grooved trays for additional protection.
Cabinet drawers feature a 440 lb. load capacity each and are available in seven full sidewall heights for maximum cubic storage capacity. Extend 100% from the housing for complete use of the furthest corners and easy accessibility to all the contents.
Additional ergonomic and safety features include drawer handles positioned at the top of each drawer and flush with the face of the housing. Also, the one-drawer-at-a-time PrevenTip safety system prevents accidental cabinet tipping.
Lista International Corp., listaintl.com
Cabinet drawers feature a 440 lb. load capacity each and are available in seven full sidewall heights for maximum cubic storage capacity. Extend 100% from the housing for complete use of the furthest corners and easy accessibility to all the contents.
Additional ergonomic and safety features include drawer handles positioned at the top of each drawer and flush with the face of the housing. Also, the one-drawer-at-a-time PrevenTip safety system prevents accidental cabinet tipping.
Lista International Corp., listaintl.com
AlSiC (Aluminum Silicon Carbide) metal matrix composite provides lids, or heat spreaders, for the flip-chip IC packaging and optoelectronic market.
Enables a tailored coefficient of thermal expansion, offering compatibility with various electronic devices and assemblies. Unlike traditional packaging materials, the isotropic CTE value can be adjusted for specific applications by modifying the Al-metal/SiC-particulate ratio. Eliminates the need for thermal interface stacking.
Said to exhibit a high thermal conductivity for efficient thermal dissipation. Prevents the bowing and flexing of packaging and substrate material that can lead to failure.
The net-shape fabrication process produces the composite material and fabricates the product geometry. Allows rapid prototyping for high volume advanced thermal management solutions. Less dense than traditional flip-chip packaging materials.
The unrestricted geometry enables the inclusion of complex features, such as capacitor or resistor pockets, in the flip-chip lids. The cast surface supports various identification methods including laser marking, paint, ink and screen printing, as well as plating anodization and other surface metallization schemes typically applied to aluminum. Enables integration of very high thermal conductivity inserts (>1000 W/mK) or cooling tubes.
CPS Corp., alsic.com
SAC4-XM7S solder-paste provides the desired properties for lead-free applications without the use of nitrogen blanketing or extended profiles to minimize ΔTs.
Said to deliver excellent results in applications requiring extended heating profiles. Remains stable and active during extended heating at elevated temperatures and offers a robust printing window. Available in most common SAC-alloys and in several powder classes.
Cobar, cobar.com
CXInsight for Electronics, a project content management system, allows internal and external collaboration between project members across OEM and manufacturing sites with the latest web security.
Is a product-oriented content management and e-collaboration toolset for use in electronics design, NPI and production environments that require management of structured and unstructured content. Flexible, Web-based server/client system operates independent of OS or application software, and is developed specifically for OEMs and manufacturers working together on projects, regardless of geographic location, language or time zone.
Manages and supports distributed development and NPI across global supply chains via secure (SSL) Internet communication. Handles four key areas:
Development product data management system (PDM Light)
Product oriented, single point of data access for internal/external project members
Graphical product and project file browser
Full project flow control and event logging/tracking system (development and engineering)
Positioned as a PDM-light application, views and controls the complete project flow from project management, task and workload management, through to ECO modification processes, full traceability and event logging.
Adeon Technologies, adeon.nl or cxinsight.com
Is a product-oriented content management and e-collaboration toolset for use in electronics design, NPI and production environments that require management of structured and unstructured content. Flexible, Web-based server/client system operates independent of OS or application software, and is developed specifically for OEMs and manufacturers working together on projects, regardless of geographic location, language or time zone.
Manages and supports distributed development and NPI across global supply chains via secure (SSL) Internet communication. Handles four key areas:
Development product data management system (PDM Light)
Product oriented, single point of data access for internal/external project members
Graphical product and project file browser
Full project flow control and event logging/tracking system (development and engineering)
Positioned as a PDM-light application, views and controls the complete project flow from project management, task and workload management, through to ECO modification processes, full traceability and event logging.
Adeon Technologies, adeon.nl or cxinsight.com
CDS6250 can dispense up to 150 drops per second (540,000 drops/hr.). The Microjet dispensing valve produces dots of down to 2 nl. The three-axes dispensing system is said to be easily programmable.
Dispenses adhesives with and without filler, pastes, oils, lubricants, colors, lacquer, flux, solder resist or conformal coating. Almost all media with a viscosity between 50 and 200.000 mPas can be dispensed.
Unlike other needle based dispensing systems, the gap between the jet valve and the substrate can vary. Dispenser can travel at a fixed height while the substrate’s height changes.
The volume of a single drop can be as small as 2 nl. Very thin ropes can be dispensed by jetting one drop next to the other or by dispensing into a thin needle. The valve can dispense media under pressure (up to 100 bar) and at high temperatures (up to 100 °C).
ESSEMTEC AG,essemtec.com
The Di-Series family of C‑size VXI-based digital test instruments builds upon the M9‑Series by increasing performance and adding key new features for emerging applications. Features highly configurable, independently programmed channels to address a test requirements from board through subassembly test.
Four key attributes:
Compatibility with the M9-Series and other instruments is preserved ;
Flexibility is well suited to the highest levels of assembly, such as box-level LRU (Line Replaceable Units) or WRA (Weapons Replaceable Assemblies). In addition, Di-Series cards can be partitioned to form multiple autonomous “virtual” instruments, each of which can simultaneously address different portions of the test problem while interacting with the UUT;
Performance enhancements include the ability to directly test differential logic, including high-speed LVDS (Low Voltage Differential Signaling).
Usability is enhanced by the per-channel programming of signal timing and levels and by iStudio development and debugging software.
Teradyne, teradyne.com
Four key attributes:
Compatibility with the M9-Series and other instruments is preserved ;
Flexibility is well suited to the highest levels of assembly, such as box-level LRU (Line Replaceable Units) or WRA (Weapons Replaceable Assemblies). In addition, Di-Series cards can be partitioned to form multiple autonomous “virtual” instruments, each of which can simultaneously address different portions of the test problem while interacting with the UUT;
Performance enhancements include the ability to directly test differential logic, including high-speed LVDS (Low Voltage Differential Signaling).
Usability is enhanced by the per-channel programming of signal timing and levels and by iStudio development and debugging software.
Teradyne, teradyne.com
