The portable USC 400 ultrasonic cleaning system can be taken directly to the stencil printer to clean stencil apertures without the need to reset and calibrate the printer. When the system is offline, it can be used in conjunction with a bench-mounted or stand-alone stencil cleaner.
Features Direct On-Contact Ultrasonic Cleaning to remove Pb-free solder paste particles trapped within stencil apertures.
Benefits include: minimal use of fluids, total aperture penetration, no risk of stencil damage and robust construction. Can be used with solder paste or SMD adhesives, is suitable for stainless and plastic stencils. Cleans pick-and-place nozzles, dispensing needles and probe test pins, and can soften solder paste.
PowerMod HP (high power) “B” series connector family features touch-safe female housings, integral positive latches and cable strain relief.
Rated over 350 amps and to 250 amps at a 30º C temperature rise. Accommodates American wire sizes from 1/0 to 4/0 AWG and metric wires from 50 to 95mm². Use Sterling contact technology to offer low electrical resistance. Provides a minimum of 500 mating cycles and is rated for circuit interruption (true hot-plug).
Latching system with distinct blue buttons for clear identification offers security and ergonomics. IP 20 rated (touch safe) for user safety, integral coding key allows unique mating of up to 6 individual connectors. Cable strain relief kit, for all applicable wire sizes, is an option.
Offered in 10 different connector housing types, including right angle, bus bar, panel mount and blindmate/float selections.
Agile 9.2, the latest release for managing the enterprise product record throughout the product lifecycle, features enhanced functionality and expands on compliance, product portfolio, product collaboration and quality management modules. Supports Linux operating systems, for flexibility, improved intellectual property security and reduced cost of ownership. Product Governance and Compliance—Provides expanded capabilities to manage Bill of Substance information and rollup compliance information using a variety of scenarios. Has improved supplier declaration capability and regulatory information for effective compliance. Includes upgraded Bill of Substance adapters for Agile partners - PartMiner, i2 technologies, Avent and Arrow.
Product Portfolio Management— Includes executive portfolio analytics and bi-directional integration with Microsoft Project, to provide tightly synchronized program and product information, maximized resource utilization and cross-program visibility and decision support. Portfolio analytics include time to market, financial, resources pool, program and issues tracking.
Product Collaboration—Has enhanced change collaboration and document management capabilities, providing each stakeholder in the extended design and supply chain secure access to critical product record data, including bills of material, attributes, manufacturers, configurations, specifications, documents, models, work instructions, revisions and more.
Improved Global Interface—PLM portfolio is completely localized in six different languages: English, French, German, Japanese, traditional Chinese and simplified Chinese.
Product Quality Management— (previously called the Product Service and Improvement solution) Includes advanced analytics capabilities to tightly integrate customer, product, quality and regulatory information within a closed-loop corrective action system. Enables companies to fulfill customer demands for higher quality, faster response and compliance with regulatory requirements.
Linux Support –Adds the Linux open source operating system to its supported environments. Supports Red Hat Linux AS version 4.0. Agile Software Corp., agile.com
‘Soft Landing’ technology on the Condor flying probe test platform addresses concerns manufacturers face over test coverage on complex and high density boards, as well as unwanted damage that can occur with conventional probe techniques.
With ‘Soft Landing,’ the test nail travels towards the component or pad at normal speed until approximately 1 to 2 mm above its target landing position. The speed of the nail is then reduced to soften its impact with the board. This protects delicate components and minimizes the ‘footprint’ where the nail touches the board. In tests, adding a soft landing to an existing nail contact reduced the visible ‘footprint’ by more than a third.
A smaller footprint means more precise positioning in highly dense areas. It also lowers the chance of shorting leads in close proximity to each other, invalidating the test and creating potential damage.
Test coverage increases as more test points can be reached without being damaged or scratched. It only affects the z-axis of travel; Digitaltest MTS system test programs can be updated to take advantage of the technique with minimal additional programming.
JPSA’s large-format laser beam switching module can quickly, accurately switch the entire beam from one path to another (i.e., between two different experiments, or between two separate processes). Has 50 x 50 mm clear aperture for passage of a larger-diameter homogenized beam without beam corner clipping. A vacuum UV (VUV) product, can be used with short-wavelength UV excimer beams including 157, 193 and 248 nm. There is no grease or oil VUV beam delivery designs, and all organic materials have been removed to prevent degradation by UV radiation and contamination of the optics and interior chamber. This switching module can be purged with high-purity gases such as nitrogen.
The industrial-grade product is designed for 24/7 service. Designed for integration into a laser beam delivery system and can deflect the beam out of production when desired to perform beam diagnostics, check beam homogeneity, pulse width or other beam characteristics, since an excimer laser beam changes characteristics over time and usage. Remote control allows the user to insert or remove a beam splitter; is magnetically pre-mounted so the beam splitter will be accurately located. It has a true gimbal design and allows either a 90-degree turn or straight-through beam path. Switching is mechanical and the unit holds accurate tolerance swing when switching from one path to the next.
Electrolock-ESD material is RoHS-compliant to meet regulatory demands for lead-free manufacturing.
Rich Reed, business unit manager, said: "When the 2006 lead-free requirements go into effect, high-temperature performance will become a more critical issue for electronic contract manufacturers. Our Electrolock-ESD material was designed to deliver consistent performance at temperatures in excess of 550°F, without deflection, which ensures a rigid, even surface and optimum machinability."
Unlike conventional material solutions, the compound reportedly yields a smooth surface without the need for sanding. Durable surface is impervious to chemical reactions and eliminates glass blooming associated with traditional solder pallet materials.
Comes in a variety of sizes to accommodate a range of applications.