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CheckSum, announced that its combination of in-circuit test and boundary scan delivers test coverage equivalent to traditional "big iron" testers that can cost five times as much.

John VanNewkirk, president and CEO, said, "CheckSum's ICT plus boundary scan solution provides superior alignment between tester resources deployed and the actual fault spectrum of today's complex boards than traditional big-iron testers do."
  
CheckSum estimates that more than $250 million is wasted annually in North America alone due to the misalignment of big-iron testers with the actual faults found in today's boards. Two basic trends are converging, creating the opportunity for electronics manufacturers to use new, lower-cost approaches that provide a better alignment between test coverage and actual faults than the traditional ICT test methods used over the past two decades.

 "First, component technology and the SMT assembly process itself have shifted the fault spectrum of a typical board such that big-iron ICT test capabilities are no longer aligned to it," said VanNewkirk. "For example, ICT vector testing was designed for the straightforward static logic of the devices of the 80s and early 90s. Modern ICs are not testable with conventional ICT 'backdrive' vectors because of access, speed and device complexity issues. As a result, expensive digital vector capability remains idle in virtually every big-iron ICT.
 
"Second, increasing density of circuit boards is significantly reducing electrical access to boards -- the lifeblood of in-circuit test. To offset loss of access, there's growing and widespread use of boundary scan-equipped devices. For CheckSum, boundary scan is a natural extension of our low-cost design philosophy because it achieves equivalent or better coverage compared to traditional backdrive vectors, but is far more usable for complex chips. Low-cost ICT and boundary scan are naturally complementary, and we believe this is the future of manufacturing test," VanNewkirk continued.

 
CheckSum, checksum.com

 
Los Angeles, CA -- MS2 Technologies, a P. Kay Metal-affiliated company, has introduced a new technology to enhance wave and selective soldering. The first of the series of products eliminates dross and oxides from the soldering process without the need for nitrogen or other exotic gases. The elimination of dross provides a substantial reduction in electronic assembly material costs especially with the advent of higher priced lead-free solders. The process entered production testing this spring and will be commercially available in November.
 
The company will launch a version for use with leaded solder and another for lead-free solders, including the various SAC alloys.
 
Larry Kay, president of P. Kay Metal and MS2 Technologies, and one of the inventors of the process, said, “The use of MS2 will reduce solder purchases for through-hole assembly by 40-75% depending on production volume.”
 
For information contact: sales@ms2technologies.com

AIM will highlight its lead-free soldering materials, including the SN100C lead-free alloy, in booth 5434 at AT Expo in Rosemont, IL.  In addition, a live lead-free selective soldering demonstration with the alloy is in booth 5437.
 
SN100C, created by Nihon Superior in Japan, is comprised of tin, copper and a small amount of nickel. 

The small amount of nickel modifies its behavior so that in wave soldering it exhibits fluidity comparable with tin-lead solder. Excess solder drains easily off the joint, so bridges and icicles are avoided. Provides smooth, bright, well-formed fillets which make inspection easy.

 Does not contain silver or phosphorus, is less aggressive towards the copper of tracks and pads or the stainless steel components of soldering equipment. Has a low dross rate.
 
AIM, aimsolder.com
Polyonics introduces 1 and 2 mil color polyimide labels. The labels are coated with a permanent pressure-sensitive acrylic adhesive and a high opacity, medium gloss topcoat available in six tinted colors ¾ pink, yellow, orange, blue, green and violet. They are thermal transfer printable and scan with both visible and IR scanners. Barcode labels made from the materials reportedly demonstrate excellent performance in lead-free wave solder environments, which range from 260º to 290ºC.
 
Designed for barcode or alphanumeric identification of PCBs or electronic components, can withstand mixed circuit board processes, on either the top or bottom side of the board. Said to have excellent resistance to harsh fluxes, cleaning agents, saponifiers and wave solder environments, and resist common methods of cleaning.
 
Polyonics developed the labels, which will survive both standard and lead-free processes on top or bottom side of the board, for manufacturers looking to color code production/process lines.   Some companies choose to use the plain white polyimide labels for standard “non-compliant” subassemblies, and a color-coded label (e.g., pink, yellow, orange, blue, green or violet) for the compliant products. 
 
Polyonics Asia Ltd., polyonics.com Read more ...
Rochester, NY and Bromont (Quebec), Canada -- Hover-Davis will offer Cogiscan RFID hardware and software applications compatible with its range of component feeders, including tape feeders, label feeders, and Direct Die feeders.

 By combining the Cogiscan Smart Material Control technology with its component feeders, Hover-Davis will be able to provide a one-stop shop for Intelligent Feeding Solutions. 
 Features of intelligent feeders include:
Identify and track components and feeders with barcode and RFID
Provide real-time visibility of all materials on the shop floor
Reduce waste of time and materials
Eliminate human errors and improve productivity
Generate complete component traceability reports
Standardize data acquisition across multi-vendor lines
Enable communication between feeders, machines and systems
 
Hover-Davis, hoverdavis.com

 Cogiscan, cogiscan.com
CAT 35 ILDS (Integrated Liquid Delivery System) dual-mode spray head is an alternative to conventional air-atomizing, film coating and dispensing technologies. 
 
Consists of an ultrasonic transducer with a titanium spray forming head and integrated liquid and air applicators. Has two modes: narrow (5 mm pattern width) and wide (3 to 25 mm pattern width). Applies a thin, defect-free coating 0.5 to 5 mils in thickness, said to provide excellent uniformity.
 
Nozzle-free spray head works with urethanes, acrylics, water-based, solvent-based and 100% solids UV curable conformal coatings and is compatible with all Prism Systems.
 
Ultrasonic Systems, ultraspray.com

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