STOCKHOLM, SWEDEN – At Productronica booth A5:337, MYDATA automation will unveil the MY500 stencil-free printer.
The machine uses Jet Printing Technology to shoot volumes of solder paste at 500 dots/sec. (1.8 million dots/h).
Because it needs no stencils, operators can change the print program in a matter of seconds and can control the volume of solder paste deposits for each pad.
Other benefits to stencil-free production include:
• No waiting for stencils to arrive from manufacturers
• No stencil production costs
• No hazardous solvents to clean stencils
• Instant control over paste volumes on pads
• Flexible programming possibilities
• Reduction of errors associated with screen printers
• Lower consumption of solder paste.
The machine uses Jet Printing Technology to shoot volumes of solder paste at 500 dots/sec. (1.8 million dots/h).
Because it needs no stencils, operators can change the print program in a matter of seconds and can control the volume of solder paste deposits for each pad.
Other benefits to stencil-free production include:
• No waiting for stencils to arrive from manufacturers
• No stencil production costs
• No hazardous solvents to clean stencils
• Instant control over paste volumes on pads
• Flexible programming possibilities
• Reduction of errors associated with screen printers
• Lower consumption of solder paste.
To develop the jet printing technology, the company teamed up with solder paste suppliers such as NIHON ALMIT Co. and Senju Metal Industry Co.
ASHBURN, VA – Zestron America will showcase its latest lead-free cleaning process solutions at booth 5609 during ATExpo from Sept. 27-29 in Rosemont, IL. The company will also feature its recent advances in PCB, stencil/misprint and maintenance cleaning applications.
The applications technology and sales team will be available to answer precision cleaning questions.
As part of the SMTA International technical session series, Zestron’s application technology manager, Umut Tosun, will discuss “Effective Flux Removal Under Stringent Environmental Limitations.” The presentation will take place on Sept. 27 at 1:30 in Room 5 during SMT2: Post Assembly Cleaning of the Circuit Board-New Concerns, Requirements and Developments.
Zestron America, zestronusa.com
The applications technology and sales team will be available to answer precision cleaning questions.
As part of the SMTA International technical session series, Zestron’s application technology manager, Umut Tosun, will discuss “Effective Flux Removal Under Stringent Environmental Limitations.” The presentation will take place on Sept. 27 at 1:30 in Room 5 during SMT2: Post Assembly Cleaning of the Circuit Board-New Concerns, Requirements and Developments.
Zestron America, zestronusa.com
DEK will launch the VectorGuard Nickel Laser Cut stencil range at ATExpo on Sept. 27-29. The event will include DEK’s high accuracy mass imaging solutions in booth 5400.
The stencils are designed to address the challenges presented by lead-free, accommodating the effects of changing paste rheology on aperture release characteristics. Said to deliver a high level of paste volume repeatability to optimize process yield and uniformity.
DEK representatives will provide lead-free advice to delegates wanting to learn more. Clive Ashmore, global applied process engineering group manager at DEK, will also be presenting a lead-free paper - Mass Imaging of Lead-Free Material.
DEK, dek.com
Haverhill, MA – Ultrasonic Systems’ Optima Fluxing System has an Ultra-Spray head that produces a more vertical spray pattern, ensuring through-hole penetration on the wide, thick circuit boards.
Can process boards up to 24” wide, over 0.200” thick and with plated through holes of 0.020” in diameter and smaller. Said to provide complete through-hole penetration, whether using VOC-free, no-clean or highly aggressive water-soluble flux.
Ultrasonic Systems, ultraspray.com
Can process boards up to 24” wide, over 0.200” thick and with plated through holes of 0.020” in diameter and smaller. Said to provide complete through-hole penetration, whether using VOC-free, no-clean or highly aggressive water-soluble flux.
Ultrasonic Systems, ultraspray.com
FRANKLIN, MA – Speedline Technologies will showcase MPM printers, an Electrovert reflow oven and wave soldering equipment at ATExpo booth 5710.
Speedline’s exhibit at the show will spotlight the following:
MPM AccuFlex printing system will be part of the live, working electronics assembly line. The printer is for moderate volume, high-mix printing. Combines accuracy and flexibility in a compact footprint, the printer offers a range of options for future expansion or advanced processes. Designed for production of 8,000 boards/week, with two or more product changeovers per shift.
MPM Accela printing system features parallel processing technology. Said to produce the most boards/hour of any industry printer – delivering raw throughput gains of 20 to 80% over competitors and generating more quality boards per hour. Designed for ease of use, features a new design and easy-to-use operator interface. Is well positioned for the challenge of lead-free assembly and increasingly complex boards.
Electrovert OmniExcel 7 is a lead-free capable, seven-zone, forced convection reflow oven. Features an advanced chamber design for balanced airflow with minimal turbulence, to improve heat transfer and reduce power and N2 consumption. Compared to other platforms, reportedly consumes up to 50% less power and 35% less nitrogen. Can be equipped with self-cleaning Flux Extraction Systems (FES), delivering a drop in maintenance intervals to once per month. OmniCheck monitoring system delivers a redundant check on process temperatures and conveyor belt, and provides both extensive data tracking and monitoring capabilities of the process parameters.
In addition Speedline will exhibit its Electrovert Quick-Change Solder Module equipped with the new UltraFill Nozzle.
Speedline Technologies, speedlinetech.com
Speedline’s exhibit at the show will spotlight the following:
MPM AccuFlex printing system will be part of the live, working electronics assembly line. The printer is for moderate volume, high-mix printing. Combines accuracy and flexibility in a compact footprint, the printer offers a range of options for future expansion or advanced processes. Designed for production of 8,000 boards/week, with two or more product changeovers per shift.
MPM Accela printing system features parallel processing technology. Said to produce the most boards/hour of any industry printer – delivering raw throughput gains of 20 to 80% over competitors and generating more quality boards per hour. Designed for ease of use, features a new design and easy-to-use operator interface. Is well positioned for the challenge of lead-free assembly and increasingly complex boards.
Electrovert OmniExcel 7 is a lead-free capable, seven-zone, forced convection reflow oven. Features an advanced chamber design for balanced airflow with minimal turbulence, to improve heat transfer and reduce power and N2 consumption. Compared to other platforms, reportedly consumes up to 50% less power and 35% less nitrogen. Can be equipped with self-cleaning Flux Extraction Systems (FES), delivering a drop in maintenance intervals to once per month. OmniCheck monitoring system delivers a redundant check on process temperatures and conveyor belt, and provides both extensive data tracking and monitoring capabilities of the process parameters.
In addition Speedline will exhibit its Electrovert Quick-Change Solder Module equipped with the new UltraFill Nozzle.
Speedline Technologies, speedlinetech.com
EFD introduces SN89/SB10.5/CU0.5 high-temperature, lead-free solder paste with a solidus temperature of 242ºC, 22°C delta above SAC. May be used for multiple-step component assembly where the component will later be attached to a PCB using SAC alloy.
With the lead-free deadline rapidly approaching, an alloy with a higher reflow temperature is necessary. Additional advantages include high tensile strength (~12,000 PSI), improved wetting properties compared to other lead-free alloys and a pasty range of 21ºC from 263º to 242ºC.
Available in all flux systems and alloy types II, III, IV and V.
EFD, efdsolder.com
With the lead-free deadline rapidly approaching, an alloy with a higher reflow temperature is necessary. Additional advantages include high tensile strength (~12,000 PSI), improved wetting properties compared to other lead-free alloys and a pasty range of 21ºC from 263º to 242ºC.
Available in all flux systems and alloy types II, III, IV and V.
EFD, efdsolder.com
