Speedline Technologies has announced several lead-free upgrades for its line of Electrovert Wave Soldering Systems.

40% wider than the traditional tin/lead nozzle, the UltraFill Nozzle increases both contact length and dwell time. The nozzles are placed closer together to reduce the temperature drop between the nozzles – so less superheat is needed to reflow solder joints in the second wave. As a result, hole fill is improved and bridging is reduced. There’s no requirement to slow the conveyor and dross generation is reduced.  The nozzles are available in Melonite Corrosion Resistant Stainless Steel or Titanium Material. 

An optional Nitrogen shroud is available for use with the Nozzle. Allows for either air or nitrogen operation, as determined by the desired recipe, without the need to change nozzles. The shroud both encompasses the nozzles in the pot and reduces dross formation in nitrogen environments. Lifts for easy maintenance and dedrossing without nozzle removal. 

Quick Change Solder Pot provides the capability to easily switch between two alloys, such as between tin/lead and lead-free solders.  The unit includes a second solder pot with motors, pumps, flow ducts, nozzle and two trolleys.

Both upgrades are available as an option on new or existing, installed Electrovert EconoPak Gold, Electra and Vectra systems.

Other available upgrades include:

• High Velocity Convention (HVC) Topside Preheater, for even topside preheating and tighter Delta T’s across the board;

• Reciprocating Spray Fluxing Technology, featuring UltraSpray technology for precise flux deposition, improved through-hole penetration and low maintenance requirements;

• Vectaheat Bottomside Preheater, providing efficient, even high thermal mass heating.

Speedline Technologies, speedlinetech.com

Version 10 of Ansoft's HFSS high-frequency/high-speed electromagnetic design product introduces capabilities for design-flow efficiency that allow users to easily share CAD models and results across existing CAD/CAE products. Offers dynamic-link technology  to co-simulate with other Ansoft products and extends applications to include RF/analog IC co-design, EMI/EMC and microwave heating.

The ability to reuse third-party CAD models and EDA layouts saves engineering time and allows designers to spend more time optimizing performance. Includes new model healing, meshing technology and model-resolution techniques that simplify the model translation and meshing process.

Expands  dynamic-link technology from Ansoft Designer to also include dynamic links to Nexxim(, SIwave, Maxwell and ePhysics for a range of end-user applications, including RF/analog IC, EMI/EMC, chip-package-board co-design and microwave heating. New features include optical incident wave sources, analysis prioritization, queuing and distributed network processing, user-constructed convergence criteria and support for Linux and Windows XP Professional.

Ansoft, ansoft.com or hfss.com

SP200-AV is an easy-to-operate semiautomatic stencil printer. The only manual task is placing the PCB into the machine. All other operations – including the positioning of the PCB – are fully automatic. Reportedly produces precise reproducible printing results. Designed for serial production, but can also be used for small batches due to the simple changeover.

Fast two-point-vision system provides a precise alignment of every PCB. To guarantee exact positioning for printing, two cameras look straight through the stencil onto the PCB. The cleanliness of the stencil and the alignment are checked simultaneously; misalignment is corrected automatically.

Control software is based on Windows, has built-in mouse and keyboard. All printing parameters are programmable with unlimited storage capacity for printing programs.

Side drawer provides simple loading and unloading. Frames of 584 x 584 mm can be mounted; maximum printing area is 400 x 360 mm.

ESSEMTEC, essemtec.com

353M Double-Coated Acrylic Adhesive Tape System combines quick-stick properties similar to rubber-based systems with the temperature performance of an acrylic system. Engineered for numerous substrate-bonding applications involving low energy surfaces, and challenging foams such as cross-linked polyethylene, low perms, ethers and esters.

Incorporates a differential caliper coating of 1.7 mils on the exposed side and 1.3 mils on the liner side, with typical peel values of 72 oz./in. width on the exposed side and 64 oz.. in. width on the liner side. Features a formaldehyde-free composition, RoHS complient. Several liner options, including 55 lb. densified Kraft, 74 lb. polycoated paper, 12 pt. board and a 2-mil PET liner are available.

Adchem Corp., adchem.com