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A new conveyor chain is gentle to soft products and is said to offer increased efficiency and service life, even in environments where dust and particulates are a problem. Features smooth surfaces and link interfaces for improved gentleness and minimum dust generation in product handling. Link interfaces are designed to minimize dust intrusion to the conveyors. Chain and slide rail contact optimised to enhance service life and minimize friction.

FlexLink, flexlink.com

 

Textool brand BGA Open Top Test and Burn-In Socket 1.0 mm pitch, Type III is now available.

Using modular, injection-molded bodies and stamp-and-form contacts, this burn-in socket for high-end logic, programmable BGA (PBGA), MCM and system-in-package devices is designed for packages up to 47.5 x 47.5 mm, with matrices of up to 45 x 45 and lead counts to 2025. Is RoHS compliant.

Nest comb design allows full matrix array applications with minimal z-axis warp. By separating the socket nest into dual, interlocking combs, withstands the high contact force loads inherent in high lead count sockets.

Micro-Wiping contact scrubs device leads with each engage and disengage cycle, removing the oxide layer from solder balls, as well as removing contaminants from the contact surface. Contributes to improved contact resistance and reduces the need for cleaning sockets prior to the end of their rated life cycle.

Dual beam contact motion equalizes wear on the contact blades, maximizing mechanical reliability and durability. Facilitates pick-and-place operations by maintaining ball position throughout the actuation cycle. Package shift during loading and unloading is minimal.

3M, www.3M.com

DEK has developed wafer bumping and ball placement solutions for packaging applications by using efficient screen printing techniques and enabling technologies such as enclosed print head material deposition.

“Customers are looking for reduced costs on several levels,” says Richard Heimsch, president. “Manufacturers want lower initial equipment investment, long-term ownership and tooling costs. DEK has responded to these requirements by delivering a flexible platform that can deposit paste and place solder flux and solder balls, while handling devices in different input formats.”

For bumping at the wafer and substrate levels, a simple print and reflow method allows for single stroke, unlimited bump quantity with bump height targets of 80 to150 microns on pitches of 150 to 500 microns. This technique requires strict application of design rules when creating the stencil, which is generally electroformed.  The design of the bond pads must allow sufficient contact area to achieve good solder joint strength for a given stand-off.  The technologies that allow printing platforms to meet these semiconductor packaging requirements include automated wafer handing systems, Vortex clean-room compatible paperless cleaning systems and ProFlow enclosed print head technology which is said to deliver paste volume transfer and uniformity.

When pitch and bump size is appropriate, placing instead of forming solder bumps at the wafer and substrate levels is an alternative. DirEKt Ball Placement places solder balls as small as 0.3 mm in diameter onto substrates or wafers, with fine-pitch accuracy and first-pass yields reportedly better than 99%. Flux is deposited at each interconnect site. Then, the fully enclosed ProFlow ball transfer head guides each solder ball directly to the surface of the stencil and a controlled placement force seats each ball into the flux. Cycle time is fast and completely independent of I/O count.

DEK, www.dek.com

 

 

 

 

AVX Corp. has released an updated capability guide covering a range of RoHS-compliant, lead-free passive and interconnect components. Includes leaded radial, axial ceramic capacitors and radial tantalum capacitors.

Lead-free product offerings include multilayer ceramic capacitors, Tantalum capacitors, Niobium Oxide (OxiCap) capacitors, circuit protection, filtering, frequency control devices as well as standard and custom interconnects in addition to many other product lines. 

A full RoHS compliant product listing is available at http://www.avx.com/docs/catalogs/RoHS_Status.pdf.

The 6000 Plus Series instruments can perform five 5 major electrical safety tests (AC Hipot, DC Hipot, Insulation Resistance, Ground Bond, Open/Short) with Twin-Port technology for simultaneous hipot and ground bond testing. The Guardian 6100 Plus also performs leakage current and functional run tests.

Automate the production line with CaptivATE Software; has a global database to archive data and print test reports on demand. Filter and plot test data to analyze historical trends. Achieve paperless testing and create electronic signatures.

Features include:

AC Hipot to 5000V; DC Hipot to 6000V

Insulation Resistance to 1000VDC and 50G

Ground Bond to 30A (40A with optional transformer)

Leakage Current & Functional Run Tests

Open/Short Circuit (OSC) Detection Mode

Programmable Trip Current; Ramp & Test Times

Storage & Recall of 100 Setups, 50 Steps each

RS-232 and Remote I/O Interfaces, Standard

IEEE-488 and Printer Interfaces, Optional

Built-in 8-Channel Scanner, Optional

Earth, Enclosure and  Patient Leakage Tests are measured with a simulated impedance of the human body, five different models as specified by the various product standards. The Leakage Current mode has a 20A input current capability and multiple display mode (Voltage, Current, VA).  Likewise, tests performed under normal conditions, reverse power line or fault conditions, open ground and open neutral are implemented automatically, without operator intervention.

To accommodate automated production lines, test sequences can be programmed to “Pause”,  “Continue on Fail” or “Fail Retest.”  Test results are indicated on the large front panel LCD display during test and an overall go/no-go indication is provided based on programmed limits.  6000 Plus offers password protected front panel lockout.

QuadTech, quadtech.com/6000Plus

 

 

 

IMS’ family of partial wrap termination resistors offers an exposed solder fillet to facilitate visual inspection of the termination joint of the flip-chip resistor.

The flip-chip resistor delivers high frequency performance to 40 GHz, from 10 Ohms to 2 KOhms. The partial wrap around termination is available in Platinum Silver, or with a SAC solder coating.

Resistors are great for high frequency radio communications, microwave and radar applications. Offer stable ohmic value well into millimeter wave frequencies. Other applications include medical devices, test instrumentation and sensors.

Available in the following package sizes: 0302, 0402, 0502, 0603 and 0805.

IMS; sales@ims-resistors.com

 

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