DES PLAINES, IL — Kester will highlight SE-CURE UT-10 TIM in booth 8802 at Semicon West.
The lead-free, SMT-compatible, high-performance thermal interface material consists of a paste containing both fusible and non-fusible metals in a 100%-solids, thermosetting polymer matrix. Can be dispensed or stencil-printed and is processable on standard lead-free SMT reflow profiles. Can be used for attachment of power die to lead frames or ceramic or organic substrates. The fusible alloy is Sn96.5Ag3.0Cu0.5.
Features an advanced three-component composite system that leverages polymer and metals technology. The material costs less than silver-filled adhesives.
Reportedly provides higher performance than Ag-filled adhesives at lower material and overall process costs. Controlled-collapse bond line ensures repeatable assembly characteristics and thermal performance. In applications where over-molding is performed, it eliminates problems associated with solder squirting. The polymer component is compatible with epoxy-based over-molding chemistry.
Kester, kester.com
The 1860 Digital Megohmmeter is designed for measuring insulation resistance of components, leakage resistance measurements on capacitors and for resistivity tests on samples of insulating material.
The economical unit, with large LCD display, is said to be easy to setup and operate in all test environments. Comes standard with an RS-232 and remote control interface. Limit) Function/NO-go Display Indicator
Quick-select programming, simple controls and indicators combine for efficiency of test and productivity. Simple, intuitive front panel connection and programming. Is lightweight, portable.
Both the test voltage and resistance measuring range are readily accessible allowing an operator to make changes quickly. Provides operator programmable charge and measure times out to 999 seconds.Visual display enables a quick perception status and display of the test results as text (Digital) and bar graph (Analog).
Can be integrated into an automated manufacturing environment with remote start and GO/NO-go results output. Includes a built-in calibration function that checks the accuracy of the measuring voltage and current measure circuit.
QuadTech, quadtech.com
The Nikon ECLIPSE LV series includes the ECLIPSE LV150, LV150A (with automated nosepiece) and the ECLIPSE LV100D (episcopic/diascopic illumination) microscopes. Said to address the need for precise microscopy measuring solutions to keep up with higher performance demands in the semiconductor and medical device markets, the rapid development of new materials and the inspection requirements of components with widely varying dimensions.
The modular design allows versatility and flexibility that enables it to cover a variety of applications, from development and quality control to manufacturing inspection. Reportedly provide superb performance when inspecting semiconductors, flat panel displays, packages, electronics substrates, materials, medical devices and other samples. Can accommodate sample heights from 47 to 82mm by inserting a column riser between the main body and arm of the microscope. This feature is useful for viewing the surface of precision molds, optical materials and other thick samples.
Accepts industry-supplied stages handle samples up to 116.5 mm, for observation of fiber ends and other tools. Features a range of industrial stages and accessories, all are durable with a new triple plate design.
A variety of observation methods are available, including: first order compensator, UV polarizing and epi-fluorescence -- in addition to brightfield, darkfield, DIC and simple polarizing. Have a high- intensity, low-power consumption white halogen light source, and an adjustable high intensity mercury fiber light source.
Nikon Instruments Inc., www.nikonusa.com
MYLabel keeps track of each individual reel, stick or tray used in an SMT production line. Vital production data, such as tape pitch, orientation, batch code and quantity, are stored in a central database and used for feeder loading and complete traceability. New features include easy data extraction from the supplier’s barcode label and barcode-activated functions for ergonomics.
When registering part deliveries, the software will recognize the component supplier’s barcode label, regardless of format and coding standard, and extract the part number, quantity and batch ID. Attribute parameters, such as tape pitch and orientation, are then extracted from the part database, and a new entry is created. The risk of mislabeled parts is eliminated, since no manual data entry is involved in the registration and labeling process.
Features sound signals that alert the operator about error conditions, and barcode-activated instructions for common tasks, like Print and Discard.
Integrates with other factory software using ODBC/SQL.
MYDATA automation
W. L. Gore & Assoc. has released the GORE 100 Series Connectors, the newest addition to the GORE Blindmate/Push-on Connector family. The connectors are a high-density blindmate, microwave interconnect system offering performance through 100 GHz.
An extension of the SMP and SMPM connector families, the connectors were developed for increased packaging density, low mass and increased performance at higher frequencies. Blindmate interfaces said to be robust, durable and lightweight. A socket-to-socket bullet weighs less than 0.02 g. The connectors accommodate radial and axial misalignment with negligible VSWR change.
“The 100 Series Connector is 35% smaller than the current SMPM connectors,” said Paul Czikora, microwave connector technologist. “They offer increased electrical performance and reduced mechanical footprint, enabling designers to create thinner, lighter, smaller and more cost-effective TR modules, printed circuit boards and power dividers.”
W. L. Gore & Assoc. Inc., gore.com
CR-5000 Lightning was created to meet the demands of increased electronics design complexity resulting from the growth in density, miniaturization and multi-functionality of products.
The unique technology was born from collaboration between R&D teams in Japan, the UK and Germany. Combines PCB design and simulation for fast, efficient design that enables users to solve high-speed design issues early in the process.
Fully integrated design environment into CR-5000 Board Designer and CR-5000 System Designer ensures a fully adopted frontloading approach, allowing users to share information through a unified database within the high-speed design environment. In-depth analysis and what-if capabilities available throughout the design process enable engineers to explore design scenarios, trading off signal integrity parameters such as crosstalk, timing or EMI requirements, against mechanical and thermal constraints.
Offers:
Unified and shared design constraints, to eliminate complexities associated with separate design and provide control for activities such as circuit design, floor plans and board design;
Unification and communication between board design and system design with high-speed constraints and analysis;
Unified Analysis Engine Sharing;
and Frontloaded Verification.
Additional features include 'Trunking', H-Tree Routing and Interactive Lengthening.
Zuken, zuken.com
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