A Mobile Device Rework (MDR) package with integrated solder paste dispenser has been developed to rework mobile phones, PDAs, gaming handhelds, multimedia portables, Bluetooth and WLAN equipment, memory cards, notebooks and portable medical equipment. The new package will be on display at booth 8715 at SEMICON West

The fully integrated rework system can dispense solder paste dots small enough for 0201 rework. Can also dispense additional materials including epoxy and underfill.

Equipped with a motorized placement module, WinCOMISS software controls bond force during placement and soldering.

Provides rework capability for the smallest of devices up to RF shield cans, and for the challenge of  extremely high-density packages.  The “cycle” includes device removal, residual solder clean-up, fresh paste dispense and component replacement. A fully automated version (Auto-MDR) is also available.

Finetech Inc., www.finetechusa.com

The Optoelectronics Division of Bivar Inc. introduces a new surface-mount RGB-based device for optimized control of color and brightness, including a brilliant white, packaged in a low-profile, industry standard PLCC- 4 (plastic leaded chip carrier) device with a 120º viewing angle. Applications include high-contrast video displays (such as LCD monitors, backlighting in automotive dash clusters and exterior automotive lighting), instrument panel backlighting, navigation and switching systems, and medical instrumentation.

Features an internal tri-chip circuit, employing three individually addressable LED die. Lens appearance when off is water clear. Comprised of a single AllnGaP and two InGaN/SIC chip dies, featuring peak wavelengths of 625, 568 and 430 nm respectively. The result is a programmable white or brilliant full color display that can meet specific display needs. Absolute maximum rating of forward current drive is 200mA (Peak If). Other models in the product family include single and bi-color chip available in red, green, blue and yellow, including ultra and HE colors such as 395 UV– 525nm pure green.

The PLCC-4 configuration, including a four-pad metal heat dissipating base, measures 0.075” high, with a footprint of 0.110” x 0.138”.

Bivar Inc., www.bivar.com

BEAVERTON, OR— Tamura H.A. System Inc. will highlight TPD6-25F, a lead-free selective soldering system, in booth 8551 at SEMICON West in July.

The stand-alone system features cost-efficient application, a selective spray fluxer with precision needlepoint and six individual FLIP units ¾ individually programmable on soldering time and soldering height.

Top clearance of parts is 150 mm and maximum bottom clearance is 25 mm. Features a 60 second throughput tact time per board/panel, as well as touch-panel operation with up to 20 PCA memories. The system’s preheater uses solder bath temperature, and the spray fluxer is a precision needle spray nozzle that is position programmable.

Tamura H.A. System Inc., www.tamura-ha.com

Ashburn, VA – Zestron announced that it is fully prepared to meet the hazardous substances (RoHS) and waste disposal (WEEE) guidelines.  For over 15 years, the company has actively avoided the use of any hazardous or dangerous raw materials that might be considered harmful. 

Zestron’s cleaning agents are free of all hazardous materials including lead.  The cleaning media therefore fulfills all environmental requirements and exceeds most workers’ safety standards. 

The company’s cleaning technologies (i.e. MPC Technology) are designed to be used in a closed loop system which enables long bath life and little to no waste water generation.  Therefore, the cleaning agents claim to offer more economically and ecologically sound solutions, especially when compared to traditional surfactant based products.