GÖPEL electronic announces the availability of the first products for extended JTAG/boundary scan solutions based on the hardware platform Scanflex. Add new capabilities for analog and mixed-signal test.

Three PCI-based boundary scan controllers (SFX Controller) of various performance classes will be available, with six different TAP-Transceivers (SFX Transceiver) and an I/O module (SFX Module) for parallel, digital I/O. The product family will be expanded to include USB, PXI, VXI and fire wire controllers as well as TAP 8 and TAP 16 gang tranceivers.

A Scanflex system is controlled by a SFX controller. The PCI-based SFX/PCI1149 is available in three performance classes: A, B and C, with a max. TCK frequency of 20, 50 or 80 MHz, respectively. Integrated Fastscale technology allows upgrades “on the fly” through software while it is inside the host PC. Controllers include the ADYCS II feature to compensate for signal propagation delay, as well as HYSCAN for  data synchronization of serial and parallel vectors.

The portfolio transceivers includes desktop solutions for 2, 4, 6 and 8 TAP configurations, as well as compact versions with 2 and 4 TAP for more rugged environments. Include 32 dynamic, parallel digital I/O, two analog I/O channels, three static digital I/O and trigger lines. Have removable TAP Interface Cards (TIC). The first available TIC – a single ended interface with line drivers supporting TAP cable up to 5 feet long – provides programmability for input threshold, output voltage, input and output impedance, TCK frequency, delay compensation, a relay controlled power signal and read-back capability of TAP output signals.

SFX5296 provides 96 parallel I/O channels. Each is individually configurable as input, output, bi-directional or Tri-State. Feature Unstress protection and voltage programmability for groups of 32 I/O. 

GÖPEL electronic GmbH, goepel.com

FEINFOCUS, a business unit of COMET, announces the HDX-ray 16-bit Imaging Chain for FOX x-ray inspection systems. Captures high-resolution images with film-like quality, even in real-time. Provides sharp digital images for thorough inspection of applications requiring high magnifications, such as MEMS/MOEMS, semiconductor packages, high-density interconnects, hybrids and encapsulants.

Fully-integrated 2.6 mega pixel imaging subsystem features more than 65,000 grey scales with freely-selectable frame rates from 1 to 30 fps, for imaging of low-contrast, low-density and high-contrast, high-density structures and materials at the same time.  Powered by the Feinfocus GUI.

FOX nanofocus x-ray inspection system provides xy feature recognition of 300 nm (0.3 µm) and asmallest focal spot size (less than 1 µm). Employs a modular concept, available in multiple configurations. Offers geometric magnification up to 2,720x (total magnification up to 8,120x).

COMET, comet.ch

Xpert3 kit works with the SuperM.O.L.E. Gold thermal profiler to automate convection reflow oven process development. Distills recipe development into three steps: Create Signature; Plan Target; and Set & Verify.

Signature Wizard helps create an oven signature file for your reflow oven at a given convection rate. With that oven selection in place you plan robust target profiles, choosing from the 400 solder paste formulations in the database. Entering Assembly Properties information completes the planning stage and Set & Verify delivers the oven recipe.

A solder paste specification may be set to your choice of Ramp-Soak-Spike or a Ramp-to-Spike profile. Converting an existing process to a Pb-free paste is quick and easy. Qualify your oven's Pb-free capability by observing if the required zone setpoints per conveyor speed exceed the oven's maximum capability. The Transpose command immediately converts a profile to your new oven, and the system works with any reflow oven.

ECD, www.ecd.com

ProFlow enclosed print head is a key element of the lead-free portfolio DEK has created to help the transition to high-quality, repeatable lead-free processing. When implementing lead-free assembly, high accuracy mass imaging using the print head reportedly maximises the process window, compared to conventional squeegee blades.

Reduces the number of variables – such as paste rheology and ambient humidity – that need to be controlled for lead-free utilisation. The result is a simplified paste evaluation process and confident vendor selection, supported by repeatable results to justify procurement decisions.

In operational use, the greater transfer force maximises stencil aperture fill and paste release efficiency. Has repeatable aperture filling, low paste wastage and high throughput.

DEK, www.dek.com/lead-free