Universal Instruments Corp. has designed a line that can assemble 2,000 microprocessors per hour (supposedly 60% to 80% faster than existing lines).

GSM Genesis platform features a twin beam gantry system and proprietary linear motors based on the company’s Variable Reluctance Motor (VRM) technology. Each beam can support one of three different heads: 30-spindle rotary Lightning head – a chip placement solution with VRM technology that is smaller than mechanical turret heads typically deployed to place small discrete components; a seven spindle Flexjet head with integrated cameras to handle a range of components; or a four spindle Pressure Enhanced (PE) head used in conjunction with a high resolution digital upward-looking Magellan camera to place challenging components that demand higher accuracy.

A chipshooter platform configured with two Lightning heads can assemble 32,000 to 37,000 capacitors/hr. Optimal tact time for the line is between 18 and 20 sec. A module comprising 16 to 20 capacitors can be addressed by a single chipshooter platform, while modules with 20 to 40 capacitors require a second chipshooter.

A flip chip platform features two PE heads. The machine’s motion control parameters – such as acceleration, settling band and stabilization time – are said to deliver higher accuracy. A special low-viscosity fluxer is integrated on the machine. With the flip chips fed in waffle packs, can assemble 2,000 flip chips/hr.

Universal Instruments, www.uic.com

Used for tracking semiconductor wafers through the manufacturing process, In-Sight 1721 offers a slimmer package and twice the speed of its predecessors, yet maintains mounting and functional compatibility with them.

“As fabs move toward full wafer traceability, they are more dependent than ever on reliable automated wafer identification,” said Justin Testa, Senior VP of ID Products. “This newest member of Cognex’s series of industry-leading wafer readers reads faster with higher yield under difficult real world process conditions.”

Advanced image formation technology and OCR, 2-D matrix and barcode recognition algorithms deliver reliable reading performance on SEMI-standard scribes. Said to provide high read rates on wafer marks that have been affected by CMP, edge beads, copper metallization, blue or green nitride coating and other process effects.

Offers flexible mounting options for easy installation on wafer sorters, ion implanters, probers and other tools. GUI simplifies set up, automatic tuning minimizes operator intervention. Built-in network and serial communications provide connectivity to other process tools and the fab network.

Available in September.

Cognex Corp., www.cognex.com.

Profiler is a technology dedicated to post-reflow inspection. Profiler technology is fully integrated into the AOI software suite and the standard model library comes equipped with preset test parameters. A user-friendly auto-setting wizard quickens the programming time and the fine-tuning of inspection programs.

Unique algorithms analyze the grey level profile of leads and joints, eliminating the need for angled camera systems which are difficult to program and give high levels of false failures. Highly robust algorithms in combination with a custom built proprietary color lighting source, enable the detection of lifted leads, total or partial lack of solder, impurities and co-planarity defects, reportedly surpassing the test coverage of a number of multiple cameras systems.

ViTechnology, vitechnology.com

CSM7100 SMD pick-and-place fulfils the requirements of a high-mix/low-volume production. The low-cost system places components from 0402 to 33 x 33 mm QFP. The narrow built feeders are intelligent and programmable to reduce changeover time and avoid setup errors.

The large number of feeders (up to 100 x 8 mm) enables manufacturing of complex PCBs in one run and allows for a broad range of standard components. Changeover effort is minimum. High feeder variety provides a wide application range and high flexibility. Tape reels, tape strips, sticks and trays of any size can be used to feed parts. Tall components (15 mm height) can be placed.

All components are aligned "on-the-fly" with a laser centring system. With this touch-less technology components are measured exactly and no damage can occur. Furthermore, the laser alignment system is self-calibrating and requires no maintenance.

Has placement rate of 4,000 cph. Footprint is 80 x 80 cm, with a placement area of 380x250 mm. LIGHTPLACER Windows-based software features a fully graphical man-machine interface. Can be programmed online or offline. Barcode labels on feeders and components guarantee the correct, quick feeder setup using a barcode reader.

The combination of the pick-and-place with a dispenser saves the cost and floor space of additional equipment. A time/pressure or screw valve dispenser can be integrated.

ESSEMTEC AG, www.essemtec.com