Version 4.2.1 of the boundary scan environment System Cascon includes integrated support for the hardware platform Scanflex, as well as new ways of handling test vectors.

In addition to the Scanflex interface, numerous software features have been implemented, including support of eight independent, parallel TAPs and a hardware configuration tool with AutoDetect functionality to automatically recognize and manage all connected hardware – SFX-Controller, SFX-Transceiver and TAP Interface Cards (TIC), and SFX I/O Modules. Supports other Scanflex features, such as the controller architecture Space II, the Fastscale principle for controller upgrades on-the-fly, the improved ADYCS II for compensation of signal propagation delay independently for each TAP, and Hyscan technology for separated but synchronized handling of parallel and serial vectors.

The project database can handle level groups for nets and pins. Level group assignments allow external I/O channels to be set up automatically with appropriate parameters to match the voltage family of pins on the UUT they are connected to.

Improvements include new commands for the integrated boundary scan programming language Caslan, capability to import IBIS models into the graphical Device Library and new functions in the Component Explorer for intelligent UUT CAD data management.

Backwards compatible to earlier versions, supports VXI, PXI, PCI, USB, GPIB, Parallel Port, RS232, and Fast Ethernet boundary scan controllers.

GÖPEL electronic GmbH, www.goepel.com

AL Series optical inspection and defect review system delivers wafer edge and bevel inspection.  Full bevel inspection allows user to see the top, side and bottom of the wafer from various angles using  continuous angle adjustment.  Detects particles, pits and residues that lead to hot spots on the front side, chips, cracks and scratches that cause wafer breakage, and edge bead removal issues harm the individual wafer and can result in equipment and wafer cross contamination.  Defect information and images are stored in a common defect format for tracking and yield analysis.

"A 300-mm wafer has 942 mm of edge, giving you nearly one meter of edge die on every wafer," said Greg Baker, COO. "Edge die yield remains one of the big challenges in IC manufacturing with a variety of edge defects contributing to loss. If edge defects are reduced, wafer yield improves. Olympus's new edge and bevel inspection technology enables semiconductor manufacturers to detect these defects early in the manufacturing process and track them through the process."

Perform a range of inspection and defect review tasks, including macro and micro inspection, automated image capture, operator or automated defect review, and automated defect classification.

Include a variety of visible light imaging methods using Universal Infinity Systems (UIS) corrected optics. Can integrate 248-nm Deep-UV Air Gap optics for optical resolution of 80 nm.   

Available with GEM and GEM300 factory automation software. A variety of SEMI compliant load ports (FOUP, FOSB, SMIF, open cassette) can be attached in various configurations (front, rear, or side load).

Olympus Integrated Technologies America, olympus-ita.com

Print-and-Apply Module is a self-contained, fully-automated system designed to streamline and automate label printing and application in bar code, RFID or hybrid ID environments.

Using existing bar code information, it queries a facility's WMS or other control system for the data needed for label printing. The system can take product data from receiving or pick-and-pass operations and print a shipping label that routes the box through a facility to its final destination. Ideal when throughput requirements demand the automation of the print-and-apply function, operates at over 30 cartons/min.

Typically implemented using the BOSS control system, which handles the interaction of machine and transactional data from the PLC level to the WMS level on one PC.

Standard hardware components include the underlying conveyor, a bar code scanner and printer. Options include a weighing scale and verification scanner. An optional divert unit can redirect rejected product for manual handling. A second optional printer can be added for increased throughput and system redundancy. Can top-apply or side-apply labels.

FKI Logistex North America, www.fkilogistex.com

NORTH BILLERICA, MA --BTU International has announced a number of upgrades to its wafer bump reflow production line.

The addition of an integrated three-axes robot from Brooks Automation enhances wafer handling and the system's capability for 24x7 applications, helping to maximize equipment uptime.

A new, simplified control system that uses a single operator interface provides more precise and flexible control throughout the system, including the reflow oven and flux coater. The control system enables the use of 300-mm standards including E40, E84, E87, E90, E94 and standard SECSII/GEM interface.

Designed to be easily scalable for use in future 300-mm fabrication. Can be used as a 200-mm to 300-mm bridge tool with FOUP inserts; features Brooks Automation FixLOAD loadports for use with 300-mm FOUPs.

 
BTU International, www.btu.com