Rohm and Haas Electronic Materials is exhibiting at Productronica in Munich, November 15 – 18, in Hall B4, Stand 205. The company will present new processes for both the printed circuit, packaging and finishing markets. Circuposit C3 Ultra is the latest self-accelerating electroless copper process and is complemented by two additions to the electroplating portfolio with Copper Gleam Microfill copper via-filling process and Copper Gleam CuPulse pulse plating acid copper process. The final finish product line is enhanced with Duraposit SMT 88 electroless nickel for ENIG applications, and Pallamerse SMT 2000 electroless palladium. In the imaging sector, R&H will show the Lithojet UV Mask, for inkjet able phototool, and its halogen-free soldermask product, Durashield 5900HF. The company has created planarisation package for thick copper circuitry with Filler Coater DF 1122 and Durashield V42 Filler and Mask. The Packaging and Finishing markets see a new pure tin, Solderon ST-380, and high speed bright tin, Solderon BT-280, designed for the lead-free electrical connector applications.
IMPACT T22 is an intelligent camera designed as a drop-in replacement for obsolete or underpowered vision systems. An extension to the T-series, the image processing computer is contained inside the camera, enabling it to be deployed without additional image processing hardware.
Has ½-inch CCD, is interchangeable with older, camera-based vision systems, enabling manufacturers to upgrade older vision engines to achieve real-time inspection while reusing existing optical and lighting components. Suitable for analog and digital systems.
The OptiCon series AOI platform can inspect components on PCBs with an angled view by using a newly developed optics module. Can execute inspections in 45° angle from four directions. Uses telecentric imaging and high resolution.
The modular AOI platform enables individual configuration of OptiCon systems. Typical applications for Quattro angled view are the evaluation of hard to see solder joints and components (e.g. at J-lead pins of PLCC and SOJ models or SMT connectors) but major gains will be in next-generation components such as OFNs.
HARRISBURG, PA -- Tyco Electronics has introduced a low profile, single connector, microminiature RF interconnect to meet the demand for direct board-to-board connections.
Traditionally, board-to-board RF connections have been achieved with either two cable connectors or two board connectors with a third, spacer or bullet, between. Compression Coax Board-to-Board Blindmate product eliminates the need for multiple connectors – and their added cost – by offering a single connector assembly with spring-loaded contact. One side is soldered on the base circuit board surface and the other side mates directly on the opposite target board using applied spring pressure. One piece design offers an easy connection with large radial and axial misalignment, and eliminates the risk of breaking soldered connections when mating or un-mating.
Available in three different lengths for board spacing of 6.65, 10 and 14 mm, and is supplied in trays for easy pick-and-place compatibility. Has an operating temperature range of –40 to +125°C, impedance of 50 Ohms and can operate effectively at frequencies up to 6 GHz. Return loss is specified as a minimum –20 dB at frequencies up to 2.1 GHz. Tolerance against axial misalignments from the nominal board stacking height is ±1.0 mm for the 10 and 14 mm versions, and ±0.3 mm for the 6.65 mm version. Tolerance against radial misalignment is ±0.8 mm from centerline, in any direction, for all three versions. Target pads can be tin plated, or a gold-plated disc can be applied to the mating PCB.
Viscom’s high-speed S6056 AOI system will debut during Productronica in November. The system features parallel inspection of two PCBS with a double-track system.
Uses 4M sensor technology and EasyPro operating environment. Three different inspection concepts can be implemented, depending on the customers requirements. In addition to selective inspection using single or double-tracks, it also offers parallel inspection to meet very high throughput rate requirements. System configuration is fitted with a double-track and two sensor modules, permitting simultaneous inspection of two PCBs per transport lane. Has no size limitations on PCBs up to 457 x 355 mm. Integrated shuttle is available for the twin-track, on the input or output side, obviating the need for external switching points for single-line production. Has integrated switchgear cabinet with a hinged frame for ease of maintenance. Is lead-free capable – as ensured by algorithm rules-based analysis, which is capable of obtaining optimum results under even highly varying contrast conditions.
Viscom, viscom.de Productronica, Hall A2, Stand 475
Thermo Electron’s NITON Analyzers business unit has released a new version of software for its NITON XLt 797 portable XRF (x-ray fluorescence) analyzer. Version 4.4, enables users to establish thresholds for rapid screening of solder bars, circuit boards and their components, then displays pass or fail symbols for each regulated element.
Whether manufacturers are segregating Pb and Pb-free stock, performing due diligence testing to verify supplier certifications or controlling solder chemistry as part of process quality control, the analyzer and software allows companies to employ non-technical personnel for these critical tasks. Easy-to-use data entry includes a virtual keyboard and integrated barcode scanner.
Capable of storing more than 3000 legally defensible measurements for later download. All readings are encrypted to prevent accidental or intentional tampering with the analytical result, yet may be easily incorporated into database or spreadsheet packages for reference to the company’s manufacturing and/or quality control systems.