At SEMICON West booth # 9209, Adhesives Research will feature its ARclad custom PSA tape technology for the semiconductor industry, which includes several tape products for chemical mechanical polishing, as well as a heat-releasable wafer dicing tape for high-risk dies.

PSA tape technologies cover three applications within CMP, including the fabrication of stacked CMP pads, bonding CMP pads to polishing machine platens and bonding CMP textiles to stainless steel polishing heads.

ARclad 90450 is a double-faced bonding tape using one permanent adhesive chemistry for bonding to the top pad and another permanent adhesive chemistry specific to bonding to the foam sub pad.

ARclad 8904 and ARclad90334 were designed for bonding stacked pads to the platen.

Both are double-faced tapes with a permanent adhesive for bonding to the sub pad and a removable adhesive for bonding to the platen. Designed for adhesion to low surface-energy polishing tables. Contain a blue polyethylene release liner. Prevents tearing during application and improve die cutting, while promoting an easy, smooth release. 8904 employs a permanent rubber-based pressure-sensitive adhesive for bonding to the sub pad, while 90334 uses an acrylic permanent pressure-sensitive adhesive.

ARclad 90452 is a permanent/removable double-faced tape with the permanent adhesive designed to bond the polishing pad, without a sub pad, directly to the platen. The removable adhesive allows for easy, clean pad removal when polishing is completed.

ARclad 8917,a permanent/removable CMP/carrier bonding tape, provides good solvent resistance, operability in a broad functional pH range, offers a smooth adhesive surface to improve CMP yields, creates a stronger bond to CMP textiles and ensures clean removability from machine surfaces. Comes with two clear polyester liners for visual inspection of the bonding surface prior to application, has good coat weight (9.0 mils) and total thickness variation control.

Heat-releasable, pressure-sensitive adhesive tapes with a stretchable backing film and a polyester film release liner allow needle-less removal of fragile die, while reducing mechanical damage. With the application of heat, the tapes release cleanly, leaving no adhesive residue. The stretchable backing allows for easier mounting, dicing and die-removal, while enhancing visual system capabilities.

Adhesives Research Inc., www.adhesivesresearch.com

AlSiC (Aluminum Silicon Carbide) is a metal matrix composite suited for optoelectronic housings and lids.

Enables a tailored coefficient of thermal expansion, for compatibility with various electronic devices and assemblies. Unlike traditional housing materials, the isotropic CTE value can be adjusted for specific applications by modifying the Al-metal/SiC-particulate ratio. CTE matching capabilities ensure alignment and precision.

Exhibits a high thermal conductivity that results in efficient thermal dissipation and prevents the bowing and flexing of packaging and substrate material that can lead to failure. Traditional housing materials with lower thermal dissipation can cause delamination, leading to air gaps and poor reliability.

Near and net-shape fabrication process both produces the composite material and fabricates the product geometry, resulting in a cost-effective product and rapid prototyping. The un-restricted geometry enables inclusion of design features such as septums, walls and radial features. The casting process enables integration of very high thermal conductivity inserts (>1000 W/mK) or cooling tubes for more advanced thermal management solutions.

CPS Corp., www.alsic.com

Zestron America and QTS Inc., a stencil frame manufacturer, have successfully completed extensive compatibility tests. Under the direction of Zestron’s engineering team, newly developed QTS stencil frames were successfully tested with VIGON SC 200. The MPC technology removes raw solder paste and adhesive in a single process.

Tests were performed at one of a Technical Centers in accordance with Zestron’s Standard Stencil Compatibility Test Methods in ultrasonic and spray-in-air equipment. The frame structure and nylon composed buttons, for example, showed excellent compatibility with VIGON SC 200. 

To obtain a copy of the compatibility certificate, contact ZESTRON America at (888) 999-9116 or QTS at (508) 359-7800.

A new version of Assembléon’s zero-defect set-up assistance software is said to simplify set-up of its SMD placement machines, particularly in applications where the production line is configured to process a multiplicity of smaller production batches.

Two new features are available for SVS-Pro supported machines and the feeder Loading Unit.  For board family set-up, the production preparation software uses ‘dummy’ feeders so that the set-up is identical during optimization of the various process programs of the family. The use of dummy feeders implies that in the set-up of a particular process program a part number is defined but is not present, although it may be present in the process program of another board in the family. SVS-Pro 3.1 allows two different modes of operation.

In the stricter mode of operation, it checks all feeders in a process program, including those for which no mountline exists (dummies). If a feeder is not present, the software will not allow production to proceed even if the related part number is not used on the board. In a less strict mode, it does not check the dummy feeders and does not generate an error, but allows production to start. 

Placement machines and the Loading Unit can now read multiple composite barcodes and format string for quantity barcodes in combination with non-leaded barcodes.

Improves operator guidance during feeder programming, showing which feeders are needed in the selected set-up.

For AX machines, provides automatic feeder pitch programming.

Offers multi-language support, including multi-byte languages, on the AX machines and the Loading Unit.  Supported languages are English, German, Traditional Chinese and Simplified Chinese.

 Assembléon, www.assembleon.com