caLogo

Calumet Electronics, manufacturing PCBs in the U.S. for over 35 years, announces a line of RoHS-compliant PCBs.

These boards are produced using a base material designed to withstand the higher assembly process temperatures related to lead-free materials and are available with an electroless nickel/immersion gold or immersion silver surface coating. They feature:

  • Verification of compliance for all base materials and additive processes
  • Process temperatures UL recognized to 260° C
  • 100% traceability.

Calumet Electronics Corp., cec-up.com

High Performance Socket (HPS) Adapters are available for the Pro-LINE RoadRunner and PS-FlashCORE automated programming systems, and for the FlashPAK engineering desktop programmer.

Said to combine longer life/high yield programming sockets with fast delivery time.

Designed for low to medium volume production environments, where continuous uptime and high programming yields are required. Contact pins deliver low noise programming signals for maximum cell charge. Stainless steel/gold plated spring probe contact provides accurate repeatability for longer insertion life, up to 6 times that of low performance burn-in test sockets (using manufacturers’ performance specifications) with decreased maintenance schedules.

Can be delivered within days of customer order receipt. This applies to most existing or new semiconductor vendor-designed 0.8 mm pitch BGA packages up to 15 x 15mm and 216 pin grid.

Data I/O Corp., dataio.com 

 

 

The latest addition to Schurter’s range of RoHS-compliant products is the UMT 250 SMD fuse. It offers a breaking capacity of 200 Amps at 250 VAC, 277 VAC or 100 Amps at 125 VDC over a current range of 315 mA to 4 A.

Measures 10 x 3 x 3 mm, maximizes circuit protection while enabling miniaturization. Can replace axial or radial lead through-hole fuses. Provides similar performance, yet occupies approximately 80% less volume than a typical microfuse or 5 x 20 mm cartridge fuse. Is solder immersion-compatible according to IEC 60068-2-58.  Markings are clear, and visual identification of rated currents is easy for pick-and-place.

Meets IEC 60127-4 and its equivalent UL 248-14.  It is cURus and VDE approved. Its time-lag characteristics are suited for applications with inrush currents that require sustained fuse performance (power supplies, battery chargers, AC/DC converters, IT equipment, health care devices and consumer electronics).

Schurter Inc.,  www.schurterinc.com

Go-Trace electronic assembly component verification and material traceability system enables materials management, part verification and exact material traceability.

Benefits include:

Real-time tracking of material location and quantity;

Automatic component cycle counting through real-time interfaces with pick-and-place machines;

Automatic feedback to the ERP system for on-hand inventory adjustments;

Capabilities for capturing traceability data and creating reports that assign correct material ID, date code, lot code, manufacturing part number and vendor to each reference designator on each board;

Supermarket management to minimize storage space on the floor and issue timely and accurate material replenishment signals;

Designed for lean manufacturing;

Duty Cycle based feeder maintenance to maximize reliability and minimize maintenance;

Moisture-sensitive material management;

Advance component outage warning;

Elimination of non-value added activities such as material chasing and manual cycle counting.


 Optimal Electronics Corp., optelco.com

Zestron America will exhibit at the SMTA Upper Midwest Vendor Show on Wednesday, June 8, 2005 at the 3M Corporate Campus in St. Paul, MN.

The one day show will feature over 50 exhibitors and several technical sessions. 

Zestron will showcase solutions for PCB, Stencil/Misprint and Maintenance cleaning applications. The technical and sales teams will be available at the booth to answer the latest questions on lead-free cleaning.

Zestron, zestronusa.com

Read more ...

Machine Capability Analysis (MCA) testing helps improve yields and reduce soldering and missing-component defects by improving dispense accuracy. By running a capability test, the basic settings and functions of the dispenser are checked (clamping, sensors, nozzles, camera, robot, etc.) so that the dispenser is once again operating within the manufacturer’s specifications.

Machine capability for an automated dispenser of adhesives or solder pastes is measured by dispensing dots of material onto a patterned glass test plate and then evaluating it in CeTaQ’s CmController5, which measures the positional accuracy of the dots. The glass plate minimizes the dimensional errors associated with an FR-4 board, for accurate, relevant measurements.

The controller measures the positioning accuracy (x,y) of the dispense gantry, and evaluates deposit accuracy as well as diameter consistency. Measurements are calculated, taking into consideration the impact of placement order, type of head, single dot versus double dot, needle configuration and other parameters.

Provides measurement technology for equipment and process capability analysis for dispensers and other production equipment; the data and measurement results obtained provide the base for stable and controlled dispensing and processing. Special vision algorithms, accurate glass plates and components allow for independent measurement of Cp and Cpk indices on production equipment. All brands and models of SMT printers, dispensers, placement and semiconductor machines are validated. Certification reports validate performance. Does not require a controlled cleanroom environment.

CeTaQ Americas, www.cetaq.com 

Page 956 of 999

Don't have an account yet? Register Now!

Sign in to your account