Developments in the field of electronics manufacturing are characterized by growing demands on quality and throughput rate, as well as the increased use of miniaturization. Automatic optical inspection (AOI) has become one of the pre-requisites in satisfying the demand for zero-defect manufacturing concepts, particularly in small to medium-sized electronics production facilities. Viscom has responded to the requirements of the market and, with the S3088AV, now proudly offers a new AOI system with an attractive price-performance ratio.
 
S3088AV is a cost-optimised system with full reflow inspection capability. The inspection of PCBs is operated in single track mode, enabling the inspection of assemblies up to 400 x 350 mm (14.7 x 13.8"). Full program compatibility with the S6055 is guaranteed.
 
The 4M sensor technology is also used in this system, detecting defects in paste print, component placement and solder joints. The additional use of angled camera modules ensures full-depth inspection and detection of critical errors, such as lifted leads in the fine pitch range.
 
Further highlights include quick and easy program creation using EasyPro and simple program transfer. Additional modules are also available, including a rework station, post-classification station and off-line programming and SPC analysis.
 
Viscom AG, www.viscom.de

 

BP-3106 BGA Bumping Solder Paste produces large deposits of solder material in bumping and other applications using only an SMT printer with a bumping stencil.

Applied using existing equipment, increasing the BGA substrate panel size and printing speed without extra investment in equipment such as BGA ball placement hoppers.

Said to exhibit excellent release properties, robust slump resistance and ultra-low voiding. Can be used for both area array and peripheral BGAs and passes SIR before and after cleaning.

Standard packaging includes 500 g jars and 700 g Semco cartridges. Can be applied using an enclosed printhead such as DEK's ProFlow and MPM rheo pump.   

Indium Corp., www.indium.com

 

 

Multicore TTC-LF allows soldering irons to be re-tinned, even when conventional methods such as sponges, pads or rosin-cored solder wire are not effective.

 

Applicable for lead and lead-free applications, the product is a small block of electronics lead-free grade solder powder and flux formed into the shape of a thick disk. For cleaning and de-wetting soldering irons, users need only wipe the tip of the soldering iron gently across the surface to produce local melting and then wipe as normal on a damp sponge to ready the iron for re-use.

Benefits include minimal residues, activators that thermally decompose into inert components and the ability to clean heavily oxidized metal surfaces such as copper and iron plated soldering tips.

Henkel, www.electronics.henkel.com

 

Polyclad Laminates Inc., a business of Cookson Electronics, has introduced Polyclad 250HR laminate and prepreg materials. With a 150°C glass transition temperature (Tg) and 350°C decomposition temperature (Td), is suited for mid-Tg, lead-free applications. The CAF-resistant materials maintain low expansion rates while retaining FR-4 processability.
 
Used in the manufacture of automobiles, computer servers, telecommunications devices and other electronics, said to offer exceptional IST thermal performance and reliability. Contains a multifunctional epoxy resin technology for reduced CTE.
 
Compatible with all commonly used FR-4 fabrication process techniques. Mechanical, chemical and moisture resistance meet or exceed the performance of competitive FR-4 material. Is laser fluorescing and UV blocking for maximum compatibility with AOI systems, optical positioning systems and photoimageable solder mask imaging.
 
Polyclad Laminates, www.polyclad.com