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Ashburn, VA - Sanmina SCI recently replaced IPA in their existing underside cleaning process with Zestron SW.  The switch was prompted by the New Product Introduction Center to reduce the number of solder balls per board to comply with the IPC-610 standard. Various process optimizations with IPA failed which led to the search for a new cleaning agent. Process advantages achieved with the switch include the prevention of solder balls on the boards, a reduction in the consumption of the cleaner, a shorter process time and a higher flash point which led to increased operational safety.
 
Zestron, zestron.com

 

As the deadline for lead-free compliance looms, Grayline Inc. has announced that their manufactured flexible tubing products meet these standards. The EU directives apply to a wide range of products, including electrical and electronic equipment in which much of the tubing Grayline manufactures is used.

Grayline uses non-hazardous compounds to produce its PVC flexible tubing and can supply customers with certification of compliance if needed to verify that the compounds used in the manufacturing process are free of hazardous chemicals banned in the standards.

"Companies seeking to give their product the CE mark can feel confident that Grayline manufactured tubing will meet these standards," said Michael A. Mason, president.

Grayline Inc., graylineinc.com

 

FRANKLIN, MA -- Speedline Technologies will showcase various solutions and technologies in Booth 4D29 at Nepcon Thailand on June 16-19 in Bangkok.

Exhibits and demonstrations include:

The MPM AccuFlex stencil printer, suited for moderate volume high-mix printing. Combines accuracy and flexibility in a compact footprint. Offers a full range of options for future expansion. Designed for production of 8,000 boards per week with two or more product changeovers per shift, the system easily handles boards from 3 x 2" to 23 x 20" and is capable of printing 12-mil pitch devices with consistent accuracy. 

The accurate, flexible and configurable Camalot XyflexPro dispensing system features a calibration-free linear gantry drive system, small footprint and ability to meet any application need through easy-to-add options. Whether dispensing micro dots of silver epoxy, solder paste for high-frequency devices and wafer-level packages, adhesive for 0201 components, or underfill for flip-chip packages or flip- chip-on-board, the system provides the accuracy to maintain process control.

The MPM Gel-Flex Tooling System is a cost-effective answer to the challenge of supporting the circuit board during the stencil printing process. Consisting of non-conductive polyurethane elastomer gel enclosed within a durable membrane shell and mounted to a magnetic base, is a true conformal board-support system.

Compressible gel provides gentle compliance to delicate bottom-side components and leads while providing firm support for the entire board surface. Available for AccuFlex, AP Excel, Ultraprint 2000, and UltraFlex BBP printers. Available as an upgrade for those printers as well as the AP Series, Ultraprint 400 and Ultraprint 500 platforms.

Speedline Technologies, http://www.speedlinetech.com

 

 

The Smart Tweezer is an exciting answer to the old problem of testing and troubleshooting SMD components. With the use of only one hand, the lightweight unit can quickly evaluate all types of SMD components. Can automatically identify and measure inductance, capacitance and resistance.

Has two display modes: primary and secondary. The primary display, located in the middle of the display, is the larger of the two available. It shows the present reading, while a secondary display (on top) shows the present reading of additional parameters or measurement conditions when the primary display shows some other feature (L,C).  When multiple features are present, the secondary display shows one of the values.  

A bar graph located at the bottom of the display that provides an analog indication of the measured input. Can measure DC voltage from 100uV to 800mV, has an oscilloscope-like picture of AC voltage. Designed to measure continuity, has a beeper for resistance reading below threshold, or to indicate a momentary open circuit.

Performs fully automatic auto range measurement for resistance, inductance and capacitance. Most measurement functions also have a manual mode, which can be selected by using the jog dial button. The manual setting is used to measure a specific parameter or when better accuracy is required.

Combines an R-L-C meter in a pair of tweezers. Designed for production line component evaluation, on-board impedance testing and SMD components sorting.

Operates on three 1.5V batteries and comes with a 1 year warranty. 

Excelta Corp.

QuikLaze 50ST2 Laser Cutting System for quick, easy removal of a variety of materialsfeatures multiple wavelength coverage and user-selectable repetition rates from single shot to 50-Hz continuous. Suited for semiconductor design verification, failure analysis and LCD repair. Specific applications include removal of ITO shorts in LCD panels, removal of polyimide prior to FIB edits and color-filter repairs.

Enables precise cutting on a microscopic level. Selectable repetition rates facilitate fast throughput. Multiple user-selectable wavelengths (1064, 532, 355 and/or 266 nm) provide the ability to cut a variety of materials and selectively remove certain materials while leaving others unaffected. A standard, motorized X-Y aperture or high-resolution X-Y aperture allows for accurate cutting control.

The system's intuitive, microprocessor-based remote control panel is optimized for simple, straightforward operation. Alternately, the device can be controlled through an RS-232 interface.
 
Compact laser head mounts on high-volume production gantries as well as on most major-brand FA microscopes. Available with a wide range of options including microscopes, stages and accessories.
 
New Wave Research, www.new-wave.com 

 

MYDATA automation AB announces a new version of its machine control software: TPSys 2.4.3. Designed for high-mix production with sophisticated vision technology and networking capabilities. New features include faster assembly speed and a new calibration method (patent pending).

 
 
Placement area calibration methods tend to depend on large, dot-matrix calibration boards that are difficult to manufacture accurately, and are very sensitive to heat and moisture. The new calibration method utilizes a much smaller calibration device that is automatically moved to a number of predefined positions within the placement area. An advanced mathematical algorithm then combines the measurements from each position and calculates the correction data for the entire area. The result is more accurate calibration, using a calibration device that is insensitive to handling and storage conditions.
 
A number of functions for faster assembly speed have also been implemented. Improvements such as faster tool changes, faster conveyor board changes and faster board level measurement, along with improved optimization, can reportedly boost actual throughput by up to 15%.
Features a simplified user interface for operators, and auto-teach of components up to 132 x 26 mm

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