Continuing its policy of providing a global solution for its global customers, PXI solutions provider Pickering Interfaces is improving its service in Mexico with the appointment of a local Mexican distribution partner. Aimed at serving existing electronics manufacturing sites in Mexico as well as companies who are moving into the region, LogicBus SA de CV provides sales and service around the major production areas of Mexico (Guadalajara, Tijuana and Monterrey).
LogicBus, www.logicbus.com.mx
Pickering Interfaces, www.pickeringtest.com
Tokyo, Japan -- Nihon Almit Co., Ltd., a manufacturer of solder wire and paste, has created two new Pb-free solder pastes to eliminate VOIDE. TM-HP has high preheat 200°C for 120 sec., and TM-HP (L) features high preheat 190°C for 120 sec.
The pastes are manufactured in accordance with IPC TM-650 and IPC J-STD 005. The main stream alloy in Pb-free soldering is Sn/Ag/Cu and is available in variations such as: Ag3.0% / Cu0.5%, Ag3.9% / Cu 0.6% (NEMI recommended) and Ag3.5% / Cu 0.7%.Nihon Almit will attend the CAVE Harsh Environment Workshop in Indianapolis on June to speak on various aspects of Sn/Ag/Cu alloys.
The company recently announced that leading Japanese automotive manufacturers have decided to specify Almit Pb-free solder for many of their applications.
For questions, contact ANA Trading Corp. U.S.A.: almit@anatu.com or (310) 965-8165.
Benefits include optimized wetting properties and, according to the company, the shiniest solder joints of any no-clean, solvent-based chemistry. With a typical solids content of 2.9%, the flux leaves evenly distributed residues. Contains a small percentage of rosin (0.5%), which improves solderability, heat stability and surface insulation resistance. Designed to minimize the incidence of micro-solderballs.
Can be applied to circuit boards by a spray, foam or dip process. Non-corrosive, halogen-free, Bellcore-compliant and classified ORL0 per J-STD-004. Flux residues are non-conductive and do not require removal in most applications.
Kester, www.kester.com
Utilize advanced thick film technology to provide low capacitance (typically 0.25 pF) for ESD protection in high-speed data transmission applications. The devices perform better than comparable components in transmission line pulse (TLP) testing. Offer lower trigger and clamping voltages than typical polymeric ESD devices, resulting in improved protection of sensitive electronic components. Said to perform better in IEC61000-4-2 testing, especially after multiple hits (up to 1000).
Available in standard EIA sizes 0402 and 0603, with a quad-array in 1206 coming soon. Compatible with standard surface-mount and reflow installation procedures, available in tape and reel packaging.
Raychem Circuit Protection, www.circuitprotection.com, a unit of Tyco Electronics, www.tycoelectronics.com
MMCX, MCX and SMA connectors have been added to the Samtec product line.
Micro-Mini connectors (MMCX) are available as jacks and plugs with a choice of through-hole, surface-mount and edge-mount terminations. A "ganged" variation of the through-hole option is also offered for terminating two, four, six or eight connectors to the board simultaneously (useful in board stacking applications).
Mini connectors (MCX Series) are also available as jacks and plugs with a choice of through-hole, surface-mount and edge-mount terminations. SMA jacks are available with through-hole, edge-mount and panel-mount terminations.
Cable plug terminations are available for all these interfaces, as are custom RF cable assemblies.
Samtec Inc., www.samtec.com
The MINI RF switchable connector series is intended for test and accessory use in conjunction with a range of telecommunications, consumer, automotive and industrial equipment.
Measures 2.7 x 2.7 mm and 1.6 mm high; ideal for small devices requiring verification of antenna and circuit performance. Supports signal frequencies up to 6 GHz and incorporates 3-degree misalignment, allowing for angular misalignment when mating sections are engaged.
Available in a Test Port version, to test electronic circuitry (pre-transmitting element), and an Accessory Port version, to test and redirect signals through an external transmitting element.
Durable snap-on interface allows for 100 mating cycles. The cradle interface - present in the Accessory Port version - exceeds 5,000 mating cycles. It corrects misalignment issues that are present in other products on the market.
Offers a robust interconnect, incorporating a split insulator design. With the contacts sandwiched between two insulators, the connector design minimizes the risk of solder flux contamination of the switch. Beryllium copper contacts are used with insulators made of liquid crystal polymer. The shell is copper alloy (phosphorous bronze) with an additional layer of matte tin or gold-over-nickel for the Test Port or Accessories Port versions, respectively.
Allow continuous operation at temperatures from -40 to +85°C. Weighs 0.02 grams.
ITT Industries, Electronic Components, ittcannon.com
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