Panel-mount pressure sensors, such as Model AST4200, were designed to provide a hermetic seal against the media without the use of adapters. The one-piece bulkhead design mounts through the panel to keep hazardous media out of the control box.  The solid one-piece 17-4PH or 316L high strength stainless steel design is free of welds, internal O-rings or fluid-filled cavities. Requires a minimal mounting configuration that uses a standard panel punch. A locknut holds the sensor to the panel and leaves room for a gasket. Two wrench flats on the nose of the sensor allow the user to tighten the external pressure tubing to the sensor without turning the part.
 
Units offer outputs of 10mV/V, 4-20 mA or 1-5V.  Said to provide long life and resistance to media corrosion as well as over range and burst protection. Offers wetted material such as titanium and nickel alloys to produce strain gauge sensors that yield a high output with low thermal errors.
 
Provide gauge, sealed gauge or compound gauge pressure measurement in ranges up to 10,000 PSI.  Sensors are calibrated and temperature compensated to ensure stability over specified ranges. Units offer accuracy of < +0.5% BFSL at 25ºC (77º F) and long-term stability of +0.25% full-scale output per annum. Exhibiting resistance to high vibration, shock and temperature extremes, and high levels of EMI/RFI filtrations, units perform in demanding environments.

American Sensor Technologies, www.astsensors.com

Magnet Wire Stripping Pot strips film insulations from wires of all sizes and configurations. The wires are dipped into the stripping solution to quickly remove the insulation. Will not cause mechanical stress or abrasion to the conductor. Available in two models: DSP1 with basic temperature control and DSP2 with programmable temperature control. Both are available in 115V 60Hz or 220/240V 50/60Hz. Custom sized pots can be quoted.
 
The Eraser Co., www.eraser.com

ERSA IR / PL 650 A third-generation IR rework system offers three new technological innovations: DynamicIR, Multi True Closed Loop Control and IntelligentIRS. Designed to handle rework applications on heavy mass PCBs and large-format SMT assemblies (18 x 20" / 460 x 560 mm) in a lead-free environment.
 
The safe and proven medium wavelength IR heating technology allows uniform heat distribution from the top and bottom side across the PCB and component. DynamicIR allows fully automatic dynamic control of the top (1400W / 60 x 120 mm) and bottom (3200W / 350 x 450 mm) IR heaters depending on the actual temperature of the component and where it is in the temperature profile. Total available power to the selective reflow system is spread across four separately switchable heating zones on the top and five zones on the bottom. Depending on board size, the thermal mass of the substrate and component size, the required heat energy is delivered at the precise time and location to ensure that component and board follow the prescribed temperature profile. Can run an extended or flat peak, reduces PCB warpage.
 
True Closed Loop Control means that the actual component temperature is acquired, using the non-contact Infrared sensor, and is used as the primary control mechanism for the heating system. IntelligentIRS allows for precise temperature measurement by choosing from a component table or by component-specific IRS calibration.  Either the IRS or a TC sensor of choice can be chosen to drive the heating technology. Multi True Closed Loop Control uses up to four additional TC sensors. By assigning threshold values to these additional sensors, they prevent the fully automatic heating system from undesired overheating of adjacent or bottom side components.
 
Affords a high level of rework safety by y making it impossible to heat over an assigned threshold value. Thus, it is impossible to work outside a specified lead-free process window.
 
The system is broken down into four modules: the IR650 Selective Reflow module, the RPC Reflow Process Camera module, the PL650 Precision Placement module and the IRSoft software module.
 
ERSA, ersa.de/en/

 

Delivering electrical conductivity for attachment of ICs and components to metallic lead frames, Loctite QMI529HT is a highly silver filled conductive adhesive designed to provide high thermal conductivity. Hydrophobic and high-temperature stability characteristics produce void-free bond lines with adhesive strength, enabling adhesion to a variety of metals and ceramic surfaces, including copper, silver-plated copper and pre-plated leadframes. The bismaleimide (BMI) formulation also said to have particularly robust adhesion to NiPdAu leadframes.
 
Designed as a soft-solder replacement or for applications that require high thermal or electrical conductivity, reportedly achieves UPHs that are higher than conventional oven cured adhesives.  With e fast cure kinetics and very low volatiles, can be SkipCured on the diebonder or wirebonder preheater. 
 
To control bondlines and fillet heights, can also be converted into a controlled collapse spacer paste. 
 
Henkel, www.henkelelectronics.com