Macromelt is a low-pressure moulding solution for packaging of vehicle sensors. By replacing conventional sensor enclosures that require potting, it reduces the complexity, time and cost to assemble the large number of sensors required by modern vehicles.

Simultaneously encapsulates the sensor's circuitry and forms the outer shell of the component to enable a self-contained and highly integrated component. The composition of the moulding material, a polyamide hotmelt, is available in a variety of formulations.

Compatible with a range of vehicle sensors and highly miniaturised door-handle electronics as well as new technologies such as intelligent battery sensors and screen-mounted antennas with integral cable stress relief. Pre-moulded connectors and sealed units plus grommets and strain relief components can also be manufactured.

Available in translucent amber or black, standard, with a variety of colors available to special order. Resistant to fluids commonly found in automotive environment such as antifreeze, petrol or diesel and hydraulic fluid. Can operate from -40 to +150 ºC.

Henkel, www.electronics.henkel.com
 

TT Electronics BI Technologies Electronic Component Division recently developed RoHS-compliant thin film resistor networks. The networks are comprised of a matte tin finish over copper lead frame.  

"We are pleased to offer RoHS-compliant thin film resistor networks that are both backward compatible with existing leaded solder profiles and forward compatible with lead free solder profiles," said Mike Torres, applications engineer and product marketing manager.

To distinguish from existing products, a suffix "LF" is added to existing part numbers. The packing labels will also identify the products as RoHS-compliant.  BI will continue to support the original lead-bearing thin film resistor networks as well.

Packaged in all-plastic molded packages, are fully compliant to RoHS Directive 2002/95/EC, with no exemptions. The devices undergo a process of anneal baking after tin-plating to reduce tin whisker growth.  

Network series available include 6XX Nichrome on ceramic and SXX Nichrome on silicon families. 
 
BI Technologies, www.bitechnologies.com

LSM-544 Series Laser Scan Micrometers offer accuracy and versatility.  Multi-face polygonal mirrors and high-speed motors make the instruments to perform up to 1,600 scans per second.  Ideal for measuring items moving on-line at high speed such as fiber extrusions or for measuring vibrating workpieces.

Available in a variety of models for use in applications ranging from measurement of ultra-fine wires (0.005 mm diameter) at very high resolution (0.01 µm) to cylindrical workpieces as large as 120 mm.  Other applications include: x- and y-axis measurement of electric cables and fibers, unevenness measurement of film and sheet, sheet thickness measurement, interval measurement of IC chip leads, gap measurement, measurement of laser disk and magnetic disk read/write head movement, pin-and-plug gage measurement and numerous similar tasks.

Available with integrated or remote displays depending upon model, accessories include adjustable workstages and fixturing blocks, calibration gage sets and air blow covers. A standard RS-232C interface and SPC output are provided on most models.  Dust- and splash-proof IP64-rated models also available.

Mitutoyo America Corp., www.mitutoyo.com 

 

 

The AirMax VS family now includes a low-profile 3-pair connector. Contains fewer pins per column than other connectors and has a slot spacing of 16.7 mm.
 
"The low profile of the AirMax VS 3-pair makes it ideal for use in blade servers and storage devices," said John Burkett, product manager. "The small slot spacing creates an open box that allows more airflow and cools the system, reducing the chances of overheating in systems such as servers."
 
VS System uses air as the dielectric between adjacent conductors, providing high signal density while exhibiting low insertion loss and crosstalk, without the use of metal shields.
 
The design of Insert Molded Leadframe Assembly (IMLA) enables the same connector to be used for Differential Pair signals, Single Ended signals or power. Combining EMI optimization with the use of air as a dielectric, designers can freely mix Differential Pair, Single Ended signals and power in one connector. Allows for any allocation of signals within one connector, so  systems can grow from 2.5Gb/s to 25Gb/s without requiring redesign of the basic platform.
 
Available in 6 IMLA or 54 positions, 8 IMLA or 72 positions and 10 IMLA or 90 positions.
 
FCI, www.fciconnect.com