UV19 is a low viscosity, flexible UV-curable composition for fast, high performance laminating, sealing, bonding and casting. The optically clear, mobile liquid cures readily upon exposure to UV light at ambient temperatures to a flexible strong solid with mechanical strength properties and adhesion to different substrates, including most plastics, glasses and metals.
100% reactive; does not contain volatiles. Its cure is not inhibited by air, exhibits minimal shrinkage when cured. Said to have excellent resistance to water and other aggressive chemicals.
Viscosity of less than 300cps at 75°F enhances its utility for laminating as well as sealing, bonding and coating applications. Has a tensile strength in excess of 800 psi and high impact strength, abrasion resistance and heat stability.
Master Bond, www.masterbond.com
VIP Plus is a Windows XP-based image processor that delivers enhanced diagnostic capabilities for the visualization, measurement and analysis of PCB assemblies, components and internal electrical interconnections. Created as a x-ray diagnostic tool for the Verifier series of x-ray inspection solutions and as a standalone upgrade for virtually any other x-ray inspection used for electronics manufacturing quality assurance. The low-cost, application centric tool set focuses on high-use features facilitated by wizard-driven diagnostic helpers.
Increases inspection accuracy and productivity by enhancing x-ray image quality through image averaging and algorithm-based enhancement filters. The collective "image processing," makes it easier for operators to identify specific subtle anomalies. In addition, data collection, measurement and analysis reporting tools provide interactive diagnostics to further isolate, quantify and document faults for corrective action.Features / Tools:o Print and Save functions
o Live (real-time x-ray) image display
o Frame averaging (0-64) image integration
o Arrow and text annotation tools
o Zoom view
o Point-to-point measurement tools
o Image enhancement filters
o Pass/fail criteria (user defined)
o BGA and Bump measurement
o Void measurement
FocalSpot, focalspot.comCADSTAR, Zuken's Windows-based desktop PCB design solution, is available in promotional bundles for the Americas.
The product bundle includes the enhanced version of the desktop PCB Design Suite with a six-layer autorouter that contains the necessary tools to design a PCB from concept to final manufacturing output. The Professional product bundle, targeting high-speed PCB design applications, combines the Basic features plus the advanced tools needed for the entire PCB design to manufacturing process.
The Basic bundle includes schematics and analog/digital simulation, design and library editor functionality, the ability to create design views to share data with non CADSTAR users and Gerber file editing. Optional add-ons include variant management, 3-D editing and viewing, signal integrity simulation and Rules-by-Area and High-Speed Routing.
Functionality within the Professional bundle includes high-speed delay-constrained automatic multi-pass and interactive placement and routing, that enables the design of multi-layer boards with an unlimited number of pins, and automatic routing of differential pairs while avoiding cross talk. The bundle includes 3-D design and variant management, EMC checks and Gerber file editing standard, with optional Rules-by-Area and signal integrity verification tools.
Visit www.cadstarworld.com/americas
Zuken, www.zuken.com
ALPHA EF-8000 lead-free, no-clean wave solder flux technology is said to provide excellent first pass yields, worry free in-circuit testability and electrical reliability in both lead-free and tin lead wave soldering applications.
IPC rated ROL0, exceeds the Bellcore and JIS standards for electromigration and surface insulation resistance, as well as more stringent electromigration and bulk insulation resistance requirements from leading OEM's.
"ALPHA EF-8000...withstands the higher PWB surface temperatures required for successful lead-free soldering, but it is fully capable for use in standard tin-lead applications," said Mitch Holtzer, Global Product Manager at CEAM. "In addition, it can be qualified now for emerging lead-free requirements, and used in lead-free or tin lead production lines."
Low rosin content minimizes flux residue build up on pallets and wave soldering equipment normally associated with high (>10%) rosin flux formulas.
Cookson Electronics Assembly Materials, www.alphametals.com
New items include Variable Angle and Packing Bench Shelving, Switchable 2/4 Bulb Lamp Fixtures, Reversible Tack and White Boards, Modular Data Beams, Steel Parts Bin and Pegboard Panels; and various Swing Arm accessories. Can be used with all product families.
All are forward and backward compatible with systems installed in the field and those shipping.
Arlink, www.arlink.com
Leica INS300 fits the demands of IC manufacturers for equipment with optimized price/performance ratio.
Designed based on the field-proven INS3300 inspection and review system, successfully used in production for almost four years and takes the increased price and cost pressure in the semiconductor industry into consideration. Provides manual inspection of 300 mm wafers. Can be integrated into 300-mm facilities for complete automation of the process flow, resulting in production runs of more than 150 wafers/hr.
Leica Microsystems, www.leica-microsystems.com
Press Releases
- ViTrox Americas Doubles Capacity at Demo Center in Hutto, Texas
- Absolute EMS Earns ITAR Registration, Strengthening Manufacturing Capabilities for Military and Defense OEM Customers
- The ICAPE Group Announces the Launch of Its E-Shop at Electronica
- ESCATEC Pushes New Boundaries in Micro-Electronics with UV Enhanced Die Bonder Technology