Vitrox 510XL inspects defects in PCBAs with a max. board size of 610mm x 610mm .Throughput post-reflow is 5.5 in2/sec and pre-reflow is 6.9 in2/sec. Post-reflow inspection includes missing, offset, skewed, polarity, billboard, tombstone, lifted/bent leads, excess/insufficient solder, bridging, wrong parts, and traceability. Pre-reflow coverage also includes extra part inspection. 2-D paste inspection includes paste registration, bridging, and other defects.
Vitrox, www.vitrox.com
Vigon N 600 pH-neutral defluxing agent is compatible with aluminum, copper, brass, nickel, polymers, and barcode labels. Is water-based and reportedly demonstrates excellent cleaning performance in spray-in-air equipment and dip tank processes. Can be used at short contact times and application concentrations of 15% to 20%.
Zestron, www.zestron.com
BPC-SX2 2D/3D solder paste inspection system is for printing quality analysis and production status control. Features high accuracy; no blind spots; automatic resolution switch; automatic program creation; double speed inspection by quick scanning; 2D/3D normal mode: 4,750mm2/sec.; 2D/3D high-speed mode: 8,200mm2/sec.; optical 2D/3D/axis real-time control; special lighting for green/blue PC boards; multiple slit lighting, and no pixel shift or ghost image. Inspects PCBs from 50 x 50mm to 510 x 460mm. Inspection time in standard mode is 4,750mm2/sec.
DJTECH, http://www.djtech.co.jp/
Quattro Peak L Plus is a full convection reflow soldering system. Uses newly developed Quattro-Peak-Plus concept for complex assemblies in large-batch manufacturing. Reportedly guarantees maximum process stability with high throughput.
SMT-Wertheim, http://www.smt-wertheim.com/en.html
X-Plane x-ray inspection system views individual 2D slices within a sample from top-to-bottom, front-to-back, left-to-right, and any plane in between. Can use anywhere in an 18" x 16" inspection area. No need to cut or destroy the board. Works at high magnifications. Available on Diamond FP, Diamond, Ruby FP, and Ruby x-ray systems. Shows position and size of voids at joint interfaces and other locations within BGA, CSP, QFN, LGA, etc.; identifies Head in Pillow and open joints; inspects different layers within package on package or MCM; identifies tilted components and board warpage.
Nordson Dage, www.nordsondage.com
MUNICH – Initial thoughts from Productronica, where the weather was brisk outside, but starting to heat up inside.
Traffic was a bit slow relative to past years. The show itself seems smaller – and again, this is relative, as it remains bigger than almost all the other major electronics assembly trade shows combined – with traditional powerhouses like Siemens, Universal Instruments and other placement companies occupying booths that, while they would still qualify as monstrous at any other show, no longer fill entire halls on their own. (This is a good thing.)
Press Releases
- OKI Develops Ultracompact Photonic Integrated Circuit Chip Using Silicon Photonics Technology to Realize Various Optical Sensors
- AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Silicon Valley Expo & Tech Forum
- Occam Strengthens Leadership Team with Addition of PCB Expert Dana Korf
- ITW EAE Expands Partnership with Etek Europe to Represent Despatch Products in the UK and Ireland.