Multicore MF390HR halogen-free, no-clean flux is said to offer high activity for wave soldering. Reportedly has good through-hole penetration, minimal residues and sustained performance for a broad process window. Compatible with automotive processes and consumer electronics handheld applications.
Henkel, www.henkel.com/electronics
Ablestik ICP-3535M1 is a single component ECA for use with tin-terminated components. Reportedly has excellent electrical and adhesion stability, no bleeding or wicking on miniaturized components, and cures quickly at low temperature.
Henkel, www.henkel.com/electronics
Ablestik ICP-4000 is a high-end conductive silicone adhesive technology for automotive applications. Has been qualified for automotive sensor products where components are bonded to metal leadframes inside plastic housings. Absorbs CTE stresses, maintains bond and delivers electrical interconnect between component and leadframe.
Henkel, www.henkel.com/electronics
TR7550 SII inline AOI offers a dual-lane configuration and has a 64-bit operating environment; permits multi-core processing technology. Has expanded memory capacity. Image FOV has doubled in size, reducing the number of scans required and reportedly cutting inspection times in half. Linear motor and linear scale create a stable X-Y table motion system. Includes digital 3 CCD full-color camera at the top and four angle cameras; RGB 3-color LED color lighting system and multi-angle lighting control system. Inspection is suitable for Pb-free manufacturing and fine-pitch/01005 components. Repair station system has graphical interface. Provides SPC calculations and reports.
TRI, www.tri.com.tw
ESLE-10 one-part silver-loaded epoxy resin for conductive bonding offers mechanical bonds and electrical conductivity. Reportedly has excellent adhesion; can be used as a conductive bond between solder-free surface mount connections, solder repairs, static discharge and grounding or general conductive adhesions. Operating temperature is -30 to +130°C. Has an electrical resistivity value of <0.0005 ohm-cm.
ES501 underfill resin is said to improve adhesion strength of devices during mechanical stress. Reportedly does not compromise thermal cycle performance. Can be reworked, and used in high-volume assembly. Provides void-free underfill of area array devices; has snap-curable properties. Typical curing times of 35-40 min. at 90°C or 3 min. at 150°C.
Electrolube, www.electrolube.com
Component counters are said to handle all part sizes, including 01005s. Detect missing parts while deducting them from the total. Include handheld and motorized versions. Handles surface-mount and through-hole (axial and radial leaded) components. Another model includes a barcode reader and scanner, plus a label printer that outputs quantity, lot number, company name and barcode. Software counts SMDs directly on the pick-and-place machine.
Manncorp, www.manncorp.com
Press Releases
- OKI Develops Ultracompact Photonic Integrated Circuit Chip Using Silicon Photonics Technology to Realize Various Optical Sensors
- AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Silicon Valley Expo & Tech Forum
- Occam Strengthens Leadership Team with Addition of PCB Expert Dana Korf
- ITW EAE Expands Partnership with Etek Europe to Represent Despatch Products in the UK and Ireland.