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iFlex SMT solution is designed to increase productivity in high product mix environments by more than 30%. Uses single‐pick/single‐place technology; reportedly has defect levels of less than 10 DPM. Features dual transport lanes, dual-sided feeding, internal buffer positions, and feeder and trolley exchanges during production. Is designed for high throughput. Uses ‘Independent Dual Lane’ concept to provide volume on one lane, while frequently changing jobs on the second. Can be configured to tailor assembly lines from one to more than eight modules. iFlex T4 suits chip and small IC shooting (4 placement robots, placement speed of 51,000 cph, 128 twin tape feeder positions); iFlex T2 is aimed at flexible placements (2 placement robots, placement speeds of 24,000 cph, 128 twin tape feeder positions); iFlex H1 is for ICs and fine pitch placements (1 placement robot, placement speed of 7,100 cph, max 146 twin tape feeder positions/max 30 tray positions).

Assembléon, www.assembleon.com

vVision operating software is for all Viscom AOI, AXI and SPI inspection systems. Has been installed on S3088 flex AOI system. Includes an optimizing function with 100% class separation. Displays specific areas of solder joints and components as good or bad (defect images). Slider for threshold value shift now provides an intuitively operated tool for program optimization and reduction of false alarms. Has a graphical interface using a touch screen similar to current models of phones.

Viscom AG, www.viscom.de

The explosion-proof heating and drying oven VFT 60/90 enables heat treatment and drying of materials with any solvents. Fulfills new 94/9/EC requirements for units and protection systems for intended use in explosion-proof areas. Drier is suitable for solvents of temperature classes T1, T2, T3, T4, and of the explosion groups II A and II B. Accurate temperature uniformity in the whole working chamber reportedly ensures reproducible drying results. Features easy-to-operate electronic controller, an interior casing made of stainless steel, and flexible arrangement of wire-mesh shelves by grid rails. Meets requirements of the coating and basic, electrical, electronics and chemical industry.

Vötsch Industrietechnik, www.voetsch.info

The 1300 bottom router PCB depaneling cell uses advanced linear motor technology to separate printed circuit board panels. Is designed for high volume, mass production. A clean cutting process that produces less dust has been incorporated. Software interface allocates required information for daily production. Options include PCB quality verification, bit height and diameter verification, CAD file download, and offline programming.

Cencorp Corp., www.cencorp.com

X3 inline x-ray inspection includes new 3D reconstruction software to generate slice images for solder joint analysis. Combines selective 3D analysis with high-speed transmission x-ray. Has compact AOI module; scanning speed up to 200 cm2/sec.; CyberOptics SIM technology; AOI application range with presence and polarity tests, and a link to MIPS inspection platform.

Matrix Technologies, www.m-xt.com

MRS-1000A modular rework system now includes a BH-2000 freestanding board holder and adjustable tool holder. Comes with array of nozzles, preheater, adjustable tool holder, board holder and light magnifier.

OK International, www.okinternational.com 

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