U9401B Medalist i1000D in-circuit tester now includes external applications integration; performs current measurement and analysis of LED tests. Other application areas include integrity tests for automotive and consumer electronics boards. Has customizable post-test actions; can be programmed to provide customized follow-up actions based on the pass/fail test results of the printed circuit board assembly under test. Automatic board handler.
Agilent Technologies Inc., www.agilent.com
Cascon Mission Assist is a graphical user interface for System Cascon JTAG/boundary scan software. Enables graphical project development based on predefined mission targets, while automating the context sensitive adaptation of all system tools and process controls. Provides support for various access technologies, such as boundary scan, processor emulation test, chip-embedded instruments, in-system programming, and core-assisted programming. Offers optimized test coverage and throughput provided by a definition of mixed test and programming strategies. Visualizes entire project development workflow based on a selected mission target, including automated process scripting and complete management of centralized project data.
Goepel electronic, www.goepel.com
Positive cavity displacement "H" series pumps provide volumetric dispensing and are compatible with epoxies, thermal greases, underfills, oils, silicones and UV encapsulants, and other non-electronics materials. Is for GPD Global platforms, and may be used with other robots or tabletop operations.
GPD Global, www.gpd-global.com
SN100C (551CT) fluxed-cored solder wire combines the benefits of a eutectic lead-free alloy with a robust, high-temperature capable cored flux for high-speed sequential soldering. Formulated for soldering tip temperatures up to 380°C with good tip separation for reduced icicles, permitting fast wetting and high spreadability. Ag-free stable microstructure accommodates long-term and impact strains. For high-speed robotic soldering. Good wetting and high spread factor.
Nihon Superior, www.nihonsuperior.co.jp/english/
MUST camera system, for MUST III solderability testers, enhances small component alignment and inspection. Provides high magnification and a precision view of part-to-solder alignment; enables monitoring of solderability testing process. Includes 1/3" CMOS color camera with 3.3x MP macro zoom lens. Features include up to 744 x 480 pixel resolution; up to 150 FPS; color to mono switching; and close-up viewing of micro components. Is retrofittable to any existing MUST system. Captures live images into various formats; captures a timed sequence of images at set intervals; zooms from 10% to 200%, rotates images, and enables AVI recording for a defined period.
GEN3 Systems, www.gen3systems.com