Genesis GX-37D is a multipurpose surface-mount platform, placing chips at high-speed. Combines Series 2 Lightning placement head with InLine7 head for a component range of 01005 passives to 150mm sq. Handles odd-form components up to 25mm tall with 2.5kg grams of placement force. Features nozzle-changer support for gripper nozzles. Provides standalone prototyping solution, or a line balancer capable of taking on component placements from up-line or down-line machines.

Universal Instruments Corp., www.uic.com

Agilis Flex feeder is for larger components. Now covers any component on tape or stick, and reportedly cuts loading and unloading times to a fraction of that of conventional feeders. Is capable of handling component tapes from 8mm up to 152mm in width. Pocket depths accommodate the thickest, tallest components.

Mydata, www.mydata.com

A new function for PowerSelective compensates product or production-related warpage of assemblies to be processed. During program generation for the mini-wave soldering process, the operator specifies all board areas that are mechanically supported and gives a correct z-level. A reference point is defined. The operator specifies an arbitrary number of points on the soldering side of the assembly. A high-precision laser measuring system determines the distance of the PCB from the previously defined points prior to soldering. These values and the z height of the reference point are the basis for a precise calculation for modeling and illustrating an altitude profile. All points of the soldering program are set off against the modeled value. PCB warpage compensation, with the automatic PCB alignment based on fiducial recognition, guarantees reproducible xyz positioning.

SEHO Systems, www.seho.de

TR518 SII manufacturing defect analyzer includes up to 2,560 analog test points and TestJet technology. Has a 100V high voltage current source. Is backward compatible with TR518. Has Windows 7 system interface design and USB interface.

Test Research Inc., www.tri.com.tw