C-SAM model DF2400Z automated acoustic micro imaging system images and analyzes IGBT module defects. Incorporates inverted transducer. Once a recipe for scanning has been defined, the factory automation interface controls the operation.  A conveyor loads two IGBT modules onto the two system stages. Two ultrasonic transducers raster-scan each module. Ultrasound is pulsed into the module. Echo signals are received from gap-type defects. Accepts and rejects are stacked in separate locations. Accept/reject criteria are written by the user. Acoustic images reveal what type of rework is needed. Finds gap-type defects. Can image tilting and warping of module elements such as rafts.

Sonoscan, www.sonoscan.com

Tension stainless steel is designed for surface mount stencil printing. Is hardened to withstand high-tension applications, as well as traditional and frameless mounting.  Reportedly rivals cutting and print performance of FG alloy.

Datum Alloys, www.datumalloys.com

OM-535 is a low-temperature solder paste designed to enable a single reflow application for assembly of double-sided printed circuit boards. Has excellent no-solder drip during reflow. With SBX02 alloy and a melting point below 140°C, it has been used with peak reflow profiles between 155°C and 190°C. Flux residue provides excellent electrical resistivity. Eliminates extra wave or selective wave soldering process when temperature-sensitive through-hole components are used. Eliminates need for managing bar solder, wave soldering flux supplies, and pallets. Allows desired obsolescence of an extra SMT process.

Alpha, http://alpha.alent.com/

Has thermal conductivity of more than 10 BTU in/ft²•hr•°F with excellent electrical insulation properties. Is for potting, bonding, sealing and coating applications. Can be used in larger potting applications; has low exotherm when curing. Low coefficient of thermal expansion (CTE), enhanced dimensional stability, a high modulus and superior compressive strength properties.

Master Bond, www.masterbond.com