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New Products

F377 SnPb solder paste is said to have wide print and reflow process windows, and has low sensitivity to humidity. Is no-clean, and voiding exceeds IPC Class 3 in typical applications. Has a reported 8-hr. stencil life.
 
F555 Water Wash solder paste, for thick-film hybrids, incorporates activators said to be compatible with the glass, resulting in superior adhesion. Comes in Sn62 and Sn63 alloys.
 
Japan Unix UM-118 Centrifugal Mixer/Defoamer can be used for solder paste, semiconductor materials, solar pastes, epoxies and other materials. Is programmable for duration, cycle profile and up to 1500 rpm centrifugal speed, as well as internal rotational speed. Mixing of materials and defoaming is said to have cycle times half those of conventional mixers. PC-controllable, and has traceability of every program.
 
Japan Unix/Christopher Associates, www.christopherweb.com
 
The Small Part Vacuum Tweezer Kit is for parts as small as 200 µm. Is a general-purpose vacuum handling tool that plugs directly into 110V 50/60 Hz (220V units available). Said to handle a variety of optics, ball lenses and SMT parts, including 0.008"-sized parts, without damage. Long-life diaphragm vacuum pump generates up to 10" of mercury with an open-air flow of 2.3 lpm. Connects to ground automatically with a three-wire power cord. Other features include a push-button release vacuum pickup handle, 5 ft. of coiled vacuum hose, rubber no-skid feet, and a side-mounted handle holder.
  
Virtual Industries Inc., www.vacuumtweezer.com, www.virtual-ii.com  
aSPIre-2 is a fully automated inline solder paste inspection system said to deliver 100% 3-D inspection quickly and accurately. Includes SPC Plus analytical tools and hardware. Processing speed is reportedly up to 50% faster than previous systems. Has 4-axis projection; 3-D volume measurement; short programming time; greater configurability and flexibility; enhanced PCB warpage compensation, and no PCB color sensitivity.
 
Koh Young Technology, www.kohyoung.com
The VT-X series x-ray inspection system is said to shorten tact time for inline, post-solder inspection of PCBs. Is reportedly the first dual-mode x-ray inspection system that combines CT scanning with tomosynthesis scanning. Shortens inspection time for four BGAs to 60 sec., depending on specific board layout. Was designed to inspect ball grid arrays, QFP heel or back fillets, components with gullwing and J-shape leads, and connectors on board sizes up to 10 x 13". Can be used with Qup-Navi software.
 
Omron Electronics, www.omron247.com   

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