WS-820 is halide-free, Pb-free and water-soluble. Reportedly can print 0.012" features at both low and high relative humidity (20% to 65%), and its reflow process window handles straight ramp, short soak or long soak profiles in air. Meets IPC-7095 Class III resistance to voiding. Cleans with warm deionized water. Comes as SAC 305 and SAC 405 alloys and in Type 3 and 4 powder.

Cookson Electronics, www.alpha.cooksonelectronics.com

Zero-Ion g3 conducts Resistivity of Solvent Extract (ROSE) ionic contamination tests to determine final cleanliness of assemblies and bare boards. Intuitive tabbed display screens organize stored and real-time process data. Has built-in SPC data recording, and integrated SPC database lookup permits searches for desired data sets, including SPC results by date range, recipe name, board serial number, etc. Optional barcode scanner. Meets MIL-STD-2000A, MIL-P-28809, IPC-TM-650 and J-STD-001B. Submerged sprays provide agitation of the test solution, while eliminating test inaccuracies caused by carbon dioxide adsorption. Uses dynamic measurement technology. Performs tests at ambient temperature.

Aqueous Technologies, www.aqueoustech.com

This cleaning system is said to eliminate the need to manually scrape and wipe solder paste from hardware, such as squeegees and misprinted boards, and eliminates the need for saturated wipes. Permits users a “mini-car-wash” type function with push-button activation and no external spraying or chemical exposure. Is hermetically sealed to prevent vapors and discharge of unwanted materials in and around the SMT printer. Re-circulates the cleaning fluid and traps washed solder paste in a catch basin. Is lightweight, compact and portable. 

Transition Automation Inc., www.transitionautomation.com

ThQM helps OEMs and EMS firms characterize and verify the reflow or wave soldering process by providing specific checklists of information, including OEM requirements, machine recipe development and thermal profile verification. Helps to identify sensitive components, solder requirements, oven requirements, and other variables. Is said to be the first standardized way to for the OEM and volume EMS firm to approach each job.  

ECD, www.ecd.com