Circuits Assembly Online Magazine - New Products

New Products

GerbTool scripts are automated macro programs designed to run within the GerbTool shell and designed to create complex SMT placement programs for PCB assembly. Permit offline programming from data sets. Entire programming environment is visual. Operate within GerbTool/VisualCAM software suites. Support metric and imperial codes.

JD Photo-Tools, www.jdphoto.co.uk

These latest range of adhesive tapes are designed for high-temperature applications. Reportedly can withstand up to 260°C without any impairment. Target applications include protection when soldering during PCB manufacture. Designed to dissipate static, or produce extremely low static charge during the un-wind and removal process. Some are water-soluble; others contain acrylic, a non-silicone adhesive.

3M, www.3M.com

Duralco 132 thermally conductive adhesives combine high-temperature resins with highly conductive fillers and continuous service up to 500ºF. Are said to be ideal for any industrial, electrical or electronic high-power application. Reportedly offer excellent resistance to chemicals solvents and moisture. 100% solids formulations. No volatiles. No VOCs. Are commonly used as heat-tracing adhesives to bond heating or cooling tubing to equipment.

Cotronics, www.cotronics.com

These hot bar soldering systems are designed to bond unlikely materials to PCBs, such as flex circuits, ribbon cables, wires and edge connectors. Are semi-automatic pulse bonders that employ thermode technology to generate rapid reflow by pulse heating. Reportedly permit materials with low-temperature resistance to be soldered at Pb-free-compatible high temperatures without damage to the devices being permanently attached to circuit boards. System PBS212 offers an in/out shuttle that moves processing linearly; system PBS213 does it with an in/out 180º rotating table. Both perform the bonding process automatically. Soldering profile is programmable, including pressure, temperature, heat-up and cool-down times. Processing duration ranges 12 to 15 sec.

Manncorp, https://www.manncorp.com/hot-bar-soldering/hot-bar-soldering/

RO-VARIO reflow and curing oven is expandable up to 14 zones. Is designed in modular system. Can be used as full convection reflow oven, IR curing oven with special slow forward feed, or UV hardness system. Optional transport systems. A mesh belt has an operation width of 600 mm; can be configured with pin chain drive or as chain over belt. Up to five separate tracks can be fed through the oven at the pin chain drive. Chain profiles can be configured as center supports. All tracks and/or center supports adjusted individually and automatically to various transportation widths. Parallelism of the individual tracks reportedly is ensured for 14 zone ovens. Heating chambers have been redeveloped and are floating mounted.

Essemtec, www.essemtec.com

Sarcon SPG-15A form-in-place thermal interface compound now comes in 30 and 50cc pneumatic syringes, said to permit faster and more accurate dispensing. The single-component gap filler compound offers near-zero compression force with conformability. Is reportedly ideal for filling gaps around PCB solder points. Requires no heat curing; will not cause corrosion on metal surfaces, and maintains all initial properties across a temperature range of -40° to + 150°C.

Fujipoly America Corp., www.fujipoly.com