New Products
Duralco 132 thermally conductive adhesives combine high-temperature resins with highly conductive fillers and continuous service up to 500ºF. Are said to be ideal for any industrial, electrical or electronic high-power application. Reportedly offer excellent resistance to chemicals solvents and moisture. 100% solids formulations. No volatiles. No VOCs. Are commonly used as heat-tracing adhesives to bond heating or cooling tubing to equipment.
Cotronics, www.cotronics.com
These hot bar soldering systems are designed to bond unlikely materials to PCBs, such as flex circuits, ribbon cables, wires and edge connectors. Are semi-automatic pulse bonders that employ thermode technology to generate rapid reflow by pulse heating. Reportedly permit materials with low-temperature resistance to be soldered at Pb-free-compatible high temperatures without damage to the devices being permanently attached to circuit boards. System PBS212 offers an in/out shuttle that moves processing linearly; system PBS213 does it with an in/out 180º rotating table. Both perform the bonding process automatically. Soldering profile is programmable, including pressure, temperature, heat-up and cool-down times. Processing duration ranges 12 to 15 sec.
RO-VARIO reflow and curing oven is expandable up to 14 zones. Is designed in modular system. Can be used as full convection reflow oven, IR curing oven with special slow forward feed, or UV hardness system. Optional transport systems. A mesh belt has an operation width of 600 mm; can be configured with pin chain drive or as chain over belt. Up to five separate tracks can be fed through the oven at the pin chain drive. Chain profiles can be configured as center supports. All tracks and/or center supports adjusted individually and automatically to various transportation widths. Parallelism of the individual tracks reportedly is ensured for 14 zone ovens. Heating chambers have been redeveloped and are floating mounted.
Essemtec, www.essemtec.com
Essemtec, www.essemtec.com
Sarcon SPG-15A form-in-place thermal interface compound now comes in 30 and 50cc pneumatic syringes, said to permit faster and more accurate dispensing. The single-component gap filler compound offers near-zero compression force with conformability. Is reportedly ideal for filling gaps around PCB solder points. Requires no heat curing; will not cause corrosion on metal surfaces, and maintains all initial properties across a temperature range of -40° to + 150°C.
Fujipoly America Corp., www.fujipoly.com
Fujipoly America Corp., www.fujipoly.com
XSD Series desiccant cabinet is said to reduce device drying times by as much as 75%. Deploy self-regenerating desiccant. Zeolite drying unit is said to achieve humidity levels under 0.5% RH. Cabinets are heavily insulated, reportedly consume a fraction of the energy of baking or vacuum ovens, and are equipped with precision measurement, 24/7 data logging and an ergonomic touch-screen operator interface. Is reportedly proven to dry components at speeds competitive with traditional methods, without oxidation problems associated with traditional baking. Designed to exceed J-STD-033B requirements for handling moisture sensitive devices.
Totech Super Dry, www.superdry.info
Totech Super Dry, www.superdry.info
HM-2520 is a neutral-cure, low-VOC sealant that enables parts to be moved immediately upon application. Has a tensile strength of 700 psi and service temperatures ranging from -50° to 300°F (-45° to 150°C). Is formulated for automated assembly. Is said to combine the immediate green strength of a hot melt adhesive with the long-term performance of a reactive silicone sealant and improved resistance to movement during cure and at high temperatures under load.
Dow Corning, www.dowcorning.com
Dow Corning, www.dowcorning.com
