RDS 2100 and RDS 3000 drying systems for solar cell metallization consist of a combination of either five or seven IR zones and one central convection zone. Guarantee safe transport through the oven, either via mesh belt or with pin chain up to three lanes.  Conveyor of the heating zone can be separated from that of the cooling zone; reportedly no latent heat is carried into the cooling area. Have belt speeds up to 6 m./min. and throughputs of up to 5700 wph.

Rehm Thermal Systems, www.rehm-group.com

 

Model 765 needle valve is said to be ideally suited for non-reactive adhesives, silicone oils, inks and solvents. Can be used in processes such as device assembly, packaging, optics assembly and building PCBs. Offers low maintenance and precision flow control. Is easily integrated into process automation and robotics. Optimal operation is achieved using Model 345 valve controller.

Tridak, www.tridak.com

The Integrated Process and Stencil Support (iPASS) system targets defect reduction and Lean manufacturing principles. Is said to provide upfront design for manufacturability support; offers a spectrum of stencil technology and related tooling; provides comprehensive process management. Duplicates stencils and processes from one line to the next, and throughout global manufacturing network. Includes stencils, screens, blades and related tooling. Provides CAD services, including design review and check plots, design library standardization and management, and weekly reporting. Includes training, managed product rollout, order confirmation and on-time delivery, and data reporting.
 
Photo Stencil, www.photostencil.com

 

Universal Cover Tape 2688, Static Dissipative contains an antistatic coating designed to help prevent product damage and loss resulting from static charge causing components to stick to the cover tape. Also available is Universal Cover Tape 2680, Non-Conductive, for products not susceptible to static charge. Designed to seal electrical and electronics components into embossed carrier tape materials, including paper. Are said to be compatible with virtually all equipment and carrier tapes. Have pressure-sensitive adhesive, designed to create a strong bond to polycarbonate, polystyrene and paper carriers. Help reduce risk of component migration, flipping, vibration and chip sticking in feeders.

3M Electronic Solutions Division, www.3M.com/electronics