SMP200 Screen Printer includes precision stencil-to-board vision alignment for paste deposition and automatic PCB conveyor width adjustment to reduce setup and changeover time. A PCB alignment and clamping system coupled with advanced stencil separation control compliment the auto-leveling squeegee head system. Is said to have three-sigma accuracy. Has integrated under-stencil stencil wiping system with wet/dry/vacuum capability and second post-print inspection system.

Samsung Techwin, www.samsungtechwin.com

Dynatech Technology, www.dynatechsmt.com

LE40V automated pick-and-place machine is for prototyping and short run, high-mix manufacturing. Uses Cognex Vision. Provides on-the-fly component centering with top and bottom cameras, fiducial correction, bad board mark and pattern recognition. Reportedly provides accurate placement of 0201s, µBGAs, CSPs and 0.015 fine pitch QFPs at up to 3000 cph with ±0.001" placement accuracy. Includes self-contained vacuum.

APS Novastar, www.apsgold.com

SS4/ST4 series narrow body, super fine pitch low-profile board-level interconnects have a 4 mm wide socket strip and 5 mm wide terminal strip, with 0.4 mm pitch. Standard mated stack height is a low profile 4 mm from board-to-board with a choice of applications specific heights from 4.5 mm to 6 mm. Available with up to 40 positions per row in a double row design and rated at 7 GHz in single-ended and 4.5 GHz in differential pair configurations when mated.

Samtec, www.samtec.com

FMPS/FMPT is a hinged, 25A version of the PowerStrip/25 family. Is for blind mating or tight PCB real estate applications. Permits 90° or horizontal (planar) board-to-board interfaces and a 90° mating radius. Can be mated at an angle convenient for production and rotated to the permanent required orientation. Comes with up to 8 power pins on 0.200" and achieves a current rating up to 25A per contact at 75°C. Locking clips and screw down configuration for the socket are optional.

Samtec, www.samtec.com