EP3UF one-component epoxy contains thermally conductive fillers with small particle sizes. Thermal resistance of 5-7 x 10-6 K•m²/W. Can be applied in bond lines as thin as 10-15µm. Thermal conductivity 9-10 BTU•in/ft²•hr•°F and volume resistivity exceeds 1014ohm-cm. Passes NASA low outgassing tests. For bonding and underfills in microelectronics packaging/assembly applications. Unlimited working life at room temperature and fast cures at temperatures down to 250°F. Tensile strength 5,000-7,000 psi and compressive strength 18,000-20,000 psi. Bonds to metals, composites, ceramics, and many plastics. Has low shrinkage upon curing. Is serviceable over temperature range of -60° to +250°F.

Master Bond, www.masterbond.com

ECM-1100 inline coating machine is used to spray coating liquid on printed circuit boards and mounted parts. Common uses include inhibiting leakage and short circuit due to humidity and contamination; inhibiting corrosion; improving fatigue life of solder joints to leadless packages, and providing mechanical support for small parts to prevent damages due to mechanical shock and vibration.

Eunil, www.eunil-ha.com

MultiEx VRSP-CN is an aqueous, alkaline broadband, multifunctional cleaning detergent suited for printed circuit boards, stencils, solder carriers and frames, and production tools. Contains organic inhibitor additives that form a thin, chemical bond layer to protect sensitive metals such as copper or nickel alloy from potential electromechanical deterioration. Has a mixing ratio of one part concentrate to three parts water.

Kolb Cleaning Technology, kolb-ct.com

Dickson Data’s TM325 Display Temperature and Humidity Logger is now available for all McDry cabinets. Has a remote probe, audio and visual alarms, and flash card data retrieval option. Other features include remote probe; USB-enabled downloading; flash memory data transfer capability; and jumbo display. A plug-in can be connected directly to logger probe, enabling data tracking and monitoring of RH levels and temperature. Download data when needed, with 24/7 feedback through min./max. and real-time display.

Seika Machinery, www.seikausa.com/
Dickson Data, www.dicksondata.com/products/TM325

GPC-R-114 nonflammable, solvent-based cleaning liquid is for manual cleaning applications such as PBA and maintenance cleaning. Dissolves post-soldering flux residues and evaporates quickly without leaving visible residues on substrates. Is compatible will most materials used in electronics assembly and cleaning processes. Noncorrosive. Easy-to-use spray gun applicator.

Balver Zinn Group, balverzinn.com

Gap Pad HC 5.0 thermal interface material is designed to manage heat generated by reduced form factor, high-power density components. Is a soft, compliant gap filling material; has a thermal conductivity of 5.0W/m-K and delivers outstanding thermal performance with low compression stress. Is reportedly ideal for applications that require minimal component or board stress during assembly, yet demand high heat transfer across the interface with very low thermal resistance.

Henkel Adhesive Technologies, www.henkel.com/brands-and-businesses/adhesive-technologies

XF-603 flame-retardant material is for automotive under-the-hood and interior labeling applications. Is UL94 VTM-0 rated and third-party tested to FMVSS 302 automotive burn standard. Thermal transfer and flexographic ink-printable. XF-603 is a high-temperature polyimide rated to the UL94 V0 standard, with low smoke and toxicity and an operational temperature of 260°C. Also comes in a low-cost polyester (PET) (XF-611) that operates at 150°C.

Polyonics, www.polyonics.com

AquaRose is an automated water-based batch printed circuit board cleaner and resistivity of solvent extract (ROSE) cleanliness tester. Is 1m x 1m and includes Earth Smart closed-loop DI and chemical wash process. Automatic ROSE ionic cleanliness verification can eliminate the need to pull a sample and run a separate test. Process control features provide limits to be set, monitored and recorded for product/process traceability. Uses high-energy fluid dynamics cleaning design. Product drying times reportedly have been shortened 50% with rotating head dryers.  

Austin American Technology, www.aat-corp.com

This inspection method for fan-out wafer level packaging compares the image acquisition of the dies on the reconstructed wafer with the CAD data used in fabricating the wafer.

Camtek, www.camtek.com

Hot crimping resistance welding systems are for joining insulated copper wire to cable shoes or terminals. Miyachi Peco weld head mechanically holds electrodes and feeds electrical current to them. Integrated water cooling system actively cools all components to prevent overheating during production. Welding process monitor guards and stores electrical parameters. No metal stripping or removal, for maximum strength. Unique weld-to-displacement feature permits the equipment to be programmed to reach the specified compression, after which the current flow and heating is switched off. This compensates for part-to-part variation, and lets users program a parameter that is closely related to joint quality.

Amada Miyachi Europe, amadamiyachi.eu

ELM-800 laser marker works inline machine to add QR, 1D, or 2D barcodes on PCBs. Marking data does not wear off over time. Minimizes marking cycle time by using a laser head with a moving X/Y axis robot and high-speed running conveyor. Optional integrated barcode scanner and data communication, which transfers marking data to production management systems. Other options include vision camera, PCB orientation verification, and fiducial mark. Compact machine length.

Eunil, eunil-ha.com

X Line 3D x-ray inspection system enables reliable inspection of THT and pin-in-paste solder joints in compliance with IPC quality standard through a combination of 3D AXI and 2D AOI. Max fault coverage at line cycle times reportedly can be achieved. By scanning image acquisition, time-efficient quality control is possible. Hole fill levels, pin and pad wetting, bridging and solder balls can be detected with one system. Is for safe testing double-sided assembled PCBs. Covers top and bottom sides within a continuous process. Basis is real-time multi-angle image acquisition, allowing a complete 3D capture of the assembly. Integrated reconstruction methods based on planarGT provide detailed evaluation of the PCB under test layer by layer.

Goepel electronic, www.goepel.com