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BGA Solder Spheres for PBGA, CBGA, TBGA, CSP and flip chip assemblies are made using ultra micron technology from highly pure metals. Alloy compositions made using piezoelectric droplet jet technology for accurate diameter uniformity, bright shiny surface finishes and sphericity. Come in diameters of 0.75, 0.6, 0.5, 0.45, 0.3, 0.25, 0.1, 0.08, 0.07, 0.06 and 0.05mm.

Shenmao America, shenmao.com

EP3HTS-LO is a single-component epoxy for bonding, sealing and coating applications. Features silver filler; is electrically conductive with a resistivity of less than 0.001 ohm-cm. Has thermal conductivity of 12-15 BTU•in/(ft²•hr•°F). Is dimensionally stable and bonds well to metals, glass, composites, ceramics and many plastics. Withstands chemicals such as water, oils, fuels and cleaning agents. Is serviceable over the temperature range of -60°F to +400°F. Offers handling with no mixing and an unlimited working life at room temperature. Cure schedule is 45 to 50 min. at 250°F or 20 to 30 min. at 300°F. Passes ASTM E595 tests for NASA low outgassing. Is suited for use in the aerospace, electronics, microelectronics and optical industries.

Master Bond, www.masterbond.com

 

Mydata Agilis Feeder Repair Set converts any Agilis feeder to any of the four sizes to reduce overall feeder count and maximize production capabilities. Provides one kit for each of the sizes (3.7, 4.0, 4.7, and 5.4) for a single feeder ID. Also includes precision machined aluminum side cover plate with cover tape plow preinstalled; new spring; matching screws for re-assembly. All-aluminum construction provides greater strength and durability. Repairs feeders with broken finger tabs. All components are precision-machined replacements for the original parts. Can be installed onsite.COT MydataAgilisFeederRepairSet web

Count On Tools Inc., cotinc.com

AXP shadow moiré system now comes with optional Convection Reflow Emulation Module (CRE6) that allows mirroring of the thermal environment of a reflow oven while conducting warpage metrology. Features increased heating/cooling rates and improved temperature uniformity. Measures warpage on substrates up to 70mm (diameter) with sub-micron z-resolution in a convection reflow environment. Heating rates of up to 5⁰C/sec. allow measurements from 25⁰ to 275⁰C with convective heating and tightly controlled thermal uniformity.

Akrometrix, akrometrix.com

Apreo scanning electron microscope has a proprietary compound final lens design said to be capable of resolution down to 1.0nm at 1kV without the need for beam deceleration. Provides performance on nearly any sample, even if tilted or topographic. 

FEI Apreo

Offers backscatter detection at low beam currents, at any tilt angle, on sensitive samples and at TV-rate imaging, for strong contrast of materials. Detector segments can be individually addressed to optimize for angular contrast or for signal intensity and extract information that matters most. Low-vacuum capability with a chamber pressure of up to 500 Pa. Has ports for up to three energy dispersive x-ray spectrometry (EDS) detectors, coplanar EDS and electron backscatter diffraction (EBSD), analytics-compatible low-vacuum, and beam currents up to 400nA. Software provides user guidance and “point-and-click” navigation using an in-chamber camera. Load multiple samples quickly and easily without tools. 

FEI, fei.com/apreo

The redesigned RD2 Batch Vapor Phase Reflow System offers enhanced profiling capabilities with a convected preheat zone and three vapor preheat settings. Energy use reportedly has been reduced by 30% and the fluid fill requirement has realized a 40% reduction over the previous model. Features onboard working fluid filtration, as well as an auxiliary holding tank. Three-level password protection and a full graphics touch screen OIT have been integrated. Provides consistent, uniform and reliable heat transfer. Has a working envelope of 18" x 15" x 2.5"; features a palletized conveyor system that keeps the product horizontal throughout the process. Accommodates medium volume multi-shift production and medium to large sized products.

R&D VaporTech, www.rdvaportech.com  

 

R Series 4-axis system is designed specifically for automated fluid dispensing. Proprietary TeachMotion software offers a simplified user interface for faster setup and ease of use via a Teach Pendant, enabling programming of complex dispensing patterns, such as dots, lines, circles, arcs, compound arcs, and patterns on different planes, in minutes. Repeatability is +/-8 micron/micrometer), and has built-in tip recalibration, and true 3D motion control. NordsonEFD R Series web

Nordson EFD, http://www.nordsonefd.com

RF550 Rework Flux is a high-reliability, zero-halogen, no-clean rework flux designed for electronic component rework and repair applications. Has a gel-like consistency and is packaged in syringes. Can be dispensed onto specific areas that require flux. After being dispensed, it stays in place until soldering. Has excellent performance in applications requiring high reliability. Is reportedly ideal for QFP or BGA semi-automated rework applications and through-hole repair.

Kester, www.kester.com

 

NF372-TB Flux-Pen is a zero-halogen, no-clean, low solids flux for rework of conventional and surface mount printed circuit board assemblies. Passes IPC SIR testing in a raw or unheated state; can be used in rework applications, specifically those with high-reliability requirements. Residues are minimal, clear and non-tacky.  Is classified as ROL0 flux under IPC J-STD-004B.

Kester, www.kester.com

 

Squink desktop PCB printer now comes with Multilayer Package, a multilayer board option. Can inkjet-print conductive traces, dispense solder/glue and pick-and-place components on rigid or flexible substrates. Includes a new cartridge containing insulating ink and a curing lamp. The latter is placed on top of the circuit to cure insulating ink via UV light while protecting eyes and skin of users. Specially formulated ink is electrically insulating and compatible with existing Advanced Ink, and is printable on top of conductive traces or an insulating layer. Can also be used to improve printing on materials not easily compatible with advanced ink such as porous, stretchable or textile materials. Design using standard CAD tools such as Eagle, Altium and KiCad. Imports Gerber files.

BotFactory, botfactory.co

Quadra 5 offline x-ray is for 2D and 3D applications. Has 0.35μm feature recognition up to 10W of power, with optional 20W. Quadra 7 has 0.1μm feature recognition; comes equipped with two 4K UHD displays and 8 million pixels to show 50μm pixel pitch and 6.7Mp image size of Aspire FP detector. 4K UHD offers up to 4X detail compared to standard HD display screens and supports 68,000X total magnification.

Nordson Dage, www.nordsondage.com

Micro3Dslices produces superior laminography results and automatic analyzes the slice-by-slice images in less than 40 sec. per part. Uses virtual rotation axis to allow the region of interest to be chosen at any point on the large inspection area. Provides constant inspection results. For semiconductor and wafer inspection, 2D imaging and other inspection routines including QFN inspection.

Yxlon International, yxlon.com

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