Continuous Film Calibration option for selective coating applications uniquely senses the entire coating pattern. Rather than move across a sensor seeking the film edges to determine pattern width, it quickly detects the entire film and feedbacks pattern width and any gaps or breaks in the film itself down to the pixel level. Proprietary user interface easily sets desired pattern width. Any variation in width during a routine verification will result in automatic recalibration of the fluid delivery system settings with no required operator intervention. Since the pattern is evaluated in its entirety and does not traverse over a stationary sensor to recalibrate, time and volume of coating required to recover to optimal pattern characteristics are reduced.

PVA (Precision Valve & Automation, Inc.), http://www.pva.net

CyberGage360 automated 3D scanning system facilitates quality assurance of incoming parts and in-process inspection of components on the manufacturing floor. Is designed for use in general purpose metrology. Applications include consumer electronics and industrial applications from automotive to aerospace. 360-degree automated 3D scan of high-tolerance parts can be generated in less than 3 min. Incorporates 3D multi-reflection suppression (MRS) technology that inhibits measurement distortions. Automatically generates inspection report, including a comparison to a CAD model.

CyberOptics, www.cyberoptics.com

PF606-XP LED dipping solder paste has great viscosity characteristics and stable tackiness, exhibiting uniform dipping volume and transfer rate.

Shenmao America, www.shenmao.com

PF606-P128 lead-free LED die bonding solder is available for dispensing in syringes in lower viscosity; exhibits excellent slump characteristics, consistent dispense ability, and stable tackiness.

Shenmao America, www.shenmao.com

PF606-P116 lead-free LED die bonding solder reportedly offers long stencil printing life, high tackiness (slump resistance), and consistent printability with excellent wetting characteristics for LED die bonding.

Shenmao America, www.shenmao.com

Supreme 45HTQ-4 two-component epoxy features silicon carbide filler, for high-performance bonding, sealing, coating and casting. Serviceable from -100° to +450°F, is capable of withstanding rigorous thermal cycling. Tensile lap shear of 1,400-1,600 psi, compressive strength of 24,000-26,000 psi and and tensile strength of 8,000-9,000 psi. Retains strength at elevated temperatures. Is dimensionally stable, with low shrinkage upon curing. Dielectric constant at 60Hz of 4.6 and volume resistivity exceeding 1014 ohm-cm. Mix ratio of 100 to 30 by weight and thixotropic paste consistency. Pot life of more than 12 hr. at room temperature for a 100g batch. Requires oven curing at 250°-300°F with various cure schedules. Bonds to a variety of substrates including metals, composites, ceramics and most plastics. Comes in 0.5 pint to 5gal. kits Shelf life of 6 mo. at ambient temperatures.

Master Bond, masterbond.com

MAWA-300A Pulsed Micro TIG Welder now features a touch-start that controls and identifies weld location. Pulsation feature is said to significantly reduce porosity. For welding small coils and terminals, bus bars, and covered wires.

Amada Miyachi America, amadamiyachi.com

Femto 2 die bonder, for advanced packaging and bonding, has a placement accuracy of ± 0.5µm @ 3 Sigma.

SA series automation feeders use SSF feeder technology to enable a range of interface and control capabilities, including ASCII communication protocol, lower profile form factor and optional SAFP robotic interface module for drop-in integration. Reportedly enable more integration flexibility and control options, particularly when smaller form factor or higher level of performance is required.

Hover-Davis, www.hoverdavis.com

Uflex modular automation platform facilitates user-level programming by leveraging a cloud-based library of predefined process strategies. Is built on high-performance base with 2G acceleration, 50μm accuracy and 8μm repeatability. Supports boards up to 630 x 500mm, components up to 38 x 127 x 50mm, and processes including pick-and-place, dispensing, screw driving, labeling, and test handling. Can be integrated into Lean assembly lines or configured inline.

Universal Instruments, uic.com

Flexbond hot bar bonding is for flex circuit applications. Incorporates up to 18 bond heads that are selectively active based on RFID designation of placements. Uses pulse heat technology, closed-loop temp control and programmable pressure settings. Combines with Fuzion for full-process integration, including flux transfer, high-accuracy placement and hot bar soldering.

Universal Instruments, uic.com

LAS 300.81-HFM054 ATEX-certified extraction and filtration unit is for extraction and filtration of dry dusts that occur during laser processing such as cutting, engraving or structuring. Is classified as a dust extractor according to filter class H, corresponding to dust technical approval tests and meeting DIN EN 60335-2-69.  

Suited for extraction and filtration of dry dust particles with TLV <0.1 mg/m³ (threshold limit value) as well as carcinogenic emissions. Features a combination of cartridge and storage filters. Filter elements’ material ensures efficient separation of various particulate matters. Main filtration module consists of two class M cartridge filters with optional Teflon coating, which are jet stream cleaned at regular intervals. Pneumatic dedusting is said to guarantee an extremely high endurance of main filter. HEPA filter H14 is utilized as a secondary filter, ensuring a separation rate significantly higher than 99.995%. Comes with stepless volume flow control, filter condition indicator and interface for control by means of external systems.

Ult, ult.de