LBT210-HD (heavy duty) solderability tester reportedly accommodates heavier or larger parts that do not fit existing testers.

Model XSDC 601 solder paste storage controls temperature and has Industry 4.0 traceability.

TS8100-200 positive displacement PC pump has higher output than TS8100-100.

MasterSil 157 two-component silicone system features low viscosity and low exotherm. It has superior electrical insulation properties and can cure in sections beyond 1" thick. Is serviceable over temperature range of -175° to +500°F (-115° to +260°C). Formulated for applications requiring a silicone to operate under low temperatures. Elongation of 110-140%, refractive index of 1.43, excellent optical clarity, and transmits light from 220-2,500nm. Addition cured system does not require exposure to air for complete cross-linking. Mix ratio is 10:1 by weight and will not outgas while curing. Pot life of 2-4 hr. at room temperature for a 100g mass. Can be used to encapsulate LEDs and for optoelectronic and specialty OEM products.

Master Bond

www.masterbond.com/applications/potting-and-encapsulation

DataMan 70 series delivers high read rates for 1D and 2D label-based barcodes in a compact fixed-mount form factor small enough to fit in the palm of a hand.

Deutsch 369 series connectors include two new versions enabling integration directly to printed circuit boards.

Flying Vision Verification to SM Plus component mounters uses on-the-head, upward-looking camera systems to verify presence of multiple components simultaneously following pickup.

vVision and SI software use 3D solder joint measurement.

DF40GL series low-profile flexible printed circuit connector supports FPC applications in a small package and operates at USB 3.1 gen 2 speeds up to 10Gbps.

3D•EyeZ sensor system permits measurement of the press-in depth of press-fit connectors mounted on PCBs.

XM Bond high-resolution camera is for inline wire bond inspection.

SPS Smart reflow profiler is for thermal process data collection. Collects profile data and compares it to process specifications.