AgIC Pen draws electrical circuits on a sheet of paper. Circuits have the capability to conduct electricity. Tracing connects and transforms different forms in 3D miniatures, such as small paper cities. Creates fully lit scenes.

Kandenko, https://www.kandenko.co.jp/en/

640-35 (dam) and 640-46 (fill) dam and fill UV-cured chip encapsulants, for chip-on-board smart card applications, protect wire bonds and reduce stresses associated with thermal cycling. Cure rapidly when exposed to intense UV light centered at 365nm. Are for encapsulating small chips in smart card applications where fast processing is required. Reportedly withstand circuit board reliability test criteria.

Engineered Material Systems, conductives.com

HighDensity module is for inspecting conformal coatings. This orthogonal camera technology for S3088 CCI inspection system is recommended for inspecting nano-plasma coatings. Can inspect temperature-resistant silicone-based coatings used to make smartphones resistant to moisture. Includes high-power LEDs attached around the camera. Can be additionally equipped with four or eight angled cameras. Is reportedly ideal for silicone or thin coatings.

Viscom, www.viscom.com

Nanolaminate coating conducts heat away from an electronics device interior, decreasing its temperature up to 20 degrees. Heat is distributed through the casing of the device, along its surface. Can be applied at low temperatures in volume.

Picosun, picosun.com

Spectra ultraviolet light curing system is an upgrade from UV1000 and UV2000. Features Unitronics PLC controller with touchscreen interface, enclosed workspace, and large access doors. Has increased conveyor height adjustment and larger component clearance. Includes inlet, outlet shutters, and lamp shutters for the top and bottom lamps. Up to 30 available profiles for programming. Each profile stores speed, mode, width, etc. of a different program. Has four different processing modes.

PVA, www.pva.net

Area Ratio Calculator mobile app provides calculations for predicting paste release, solder volumes, and solder paste powder recommendation. Once shape is selected, it takes dimensions of a specific aperture and allows user to select foil thickness. Algorithm displays area ratio, with color identifiers that infer solder paste transfer efficiency. Provides supplemental data such as aspect ratio, solder paste volume, and suggested solder powder type. Free app works for both Android and iOS platform and works on smartphone or tablet.

Beam On Technology, www.beamon.com  
 

tensoRED master tensioning frame is designed to provide a higher and more even tension compared to Alpha Tetra frame. No air pressure on the frame is needed. Reportedly delivers less paste smearing, reduced variation in volume deposits, and improved positional alignment compared to Tetra frames.

Alpha Assembly Solutions, www.AlphaAssembly.com

ProFlow 1K progressive cavity pump is designed to apply small volume lines or dots in applications requiring a high level of volumetric control. Employs auger-like rotor that couples with a rubberized seal to displace fluid with continuous, pulse-free flow. Sealing mechanism provides drip-free operation. Flow rates range from 0.03 - 3.60ml/min, 0.05 - 6.00ml/min, and 0.15 - 18.00ml/min. Each pump has displacement precision of +/-1%, a viscosity range of 1 - 100,000cps and works well with filled or unfilled chemistries. Common applications include thermal grease, epoxy encapsulants, underfill, dam and fill, gasketing, optical display bonding, and single component potting.

PVA, pva.net

Optical modulation analyzer (OMA) software can evaluate multi-channel coherent modulation schemes using a single measurement system. Can calibrate and control multiple OMAs to acquire and analyze simultaneous data from multiple channels such as different wavelengths or fiber cores. Includes visual OMA setup tool that facilitates reconfiguration of oscilloscopes and coherent receiver frontends, so the same hardware can be used for different applications, like PAM4 research or increased channel count in DP-QPSK testing.

Tektronix, www.tek.com

2900 Universal Production Programming System offers fast programming speeds and true universal device support. Programming speed of up to 100MBytes/s for MCUs, eMMC, NAND, NOR and serial flash. Downloads image files up to 25MB/s to all programmers simultaneously. Memory support of 512Gb. Connects up to 15 units in one job session, for high-density volume production. Features 240 pin drivers, to support a range of devices on the same socket. Ultra universal site and socket technology streamlines first-article and production programming. Is compatible with existing 7TH and 8THGEN socket cards and algorithms.

BPM Microsystems, bpmmicro.com/pr

ogrammers/manual-programmers/2900-2/

QuickLink twist-to-lock compression mount connector replaces surface mount connectors that require a receptacle on the PCB. Mounts directly to the PCB with a twist-to-lock footprint design that requires two small through-holes and a gold pad for the connector to land on. Footprints reportedly can be placed anywhere on the board to permit access to any channels from the device without having to solder on SMA or SMP surface mount receptacles. Low loss to 70GHz; meets bandwidth requirements of PAM4 signaling and Ka/Ku band applications. No threading or tools required.

Ardent Concepts, ardentconcepts.com

PanaCIM Enterprise edition 10 software has new features that bring greater control and functionality to line or floor levels to eliminate single points of failure, permit line-by-line upgrades of equipment and software, and add versatility because they are hot-swappable. Additional advantages include new data storage options, expansive asset maintenance management, process connectivity for factory-wide work-in-process control, digital documents to complement labor skill sets, and a dynamic knowledge base for easier recovery.

Panasonic Factory Solutions Co. of America, www.panasonicfa.com