RED-E-SET XL series are large panel supports from 24" to 60". Are used in the ML and GO! models. Reportedly reduce changeover times, improve quality, and eliminate component damage.

Production Solutions, www.production-solutions.com

Two PXI5396-DT/x JTAG digital I/O modules on PXI bus basis support structural JTAG/boundary scan tests and I/O operations up to 100MHz for functional test executions. Feature impedance-controlled VPC interface for direct coupling to signal-critical load boards or other verification environments. Can use one test hardware for both laboratory verification and in the production line with fixture-based systems. Are based on a two-component solution, consisting of a PXI-supported interface module and an offset desktop module. Separation of the modules can be up to 2m without loss of performance. Desktop module is equipped with front connector that permits the module to be connected directly to the test environment. Two variants are available that differ in the on-board memory depth of 72MB with the PXI 5396-DT and 144MB with the PXI 5396-DT/XM. Both variants provide 96 single-ended channels, configurable as input, output and tri-state. Signals are processed synchronously to the test bus operations in the JTAG mode. Dynamic I/O mode permits functional testing with programmable clock rates within the range of 500Hz to 100MHz. Include VarioCore technology.

Goepel electronic, www.goepel.com

Halogen-free flame retardant tapes are dimensionally stable, engineered tapes specifically designed to help prevent the propagation of flames in a variety of applications. Are tested to the UL94 standard. Use FlameGard technology, which combines chemical and physical mechanisms to control heat transfer, oxygen availability, material decomposition and the generation of flammable gasses. Flame retardant single coated tapes are available in 0.001" and 0.002" polyimide and 0.002" polyester films, and 0.002" aluminum foils. Adhesives and liners are offered with a combination flame retardant/static dissipative construction.

Polyonics, www.polyonics.com

SFX-9305/R is an I/O module within the frame of Scanflex boundary scan hardware. Provides five ports for the universal test of industrial interfaces, which can be electrically isolated per relays. Can combine functional test procedures for bus interfaces such as LAN, USB, CAN or LIN with vector-less working test methods. Provides five independent, freely configurable bus ports. Target is physically accessed by a selection of bus access cables. Current configuration is automatically identified, whereby BAC type and quantity are freely definable. Number of available bus ports is nearly unlimited. Supported interfaces are LAN (10/100/1000), USB 2.0 (Host/Slave), Bluetooth, CAN (high-speed/low-speed), LIN, RS232 and RS422/458. Additional interfaces are being developed. Available interface functions contain the step-wise handling of protocol layers, including bidirectional data transfer.

Goepel electronic, www.goepel.com 

891 and 893 64-position, 1mm pitch mezzanine connectors are for parallel board stacking interconnections. Surface mount connectors have a mated height of 10mm. Provide high-density packaging. Locating posts are incorporated into housing to promote accurate placement on the PCB. Are RoHS compliant and suitable for Pb-free reflow soldering processes. Packaging is tape and reel, per EIA-783 (56mm wide; 16mm pitch). Feature 30u" gold-plated contacts. Insulator housings are made of high-temperature glass-filled LCP, rated UL 94 V-0.  Meet EIA-700 AAAB specifications for IEEE 1386 applications. This standard can be found on VME, VME64 and VME64X boards, CompactPCI boards, Multibus I and II boards, desktop and portable computers and servers; can also be used as modular connectors for front panel and backplane I/O cards.

Mill-Max, www.mill-max.com/PR623

Through-hole connection system kits come in 0.8mm, 1mm and 1.2mm sizes. Involve a simple manual process for conductivisation of holes in circuit boards. Help achieve plated through-holes on PCBs without investing in an electroplating system. Ensure flat finish on both sides of the hole. Contain tooling and bails for 250 holes, one size per pack. Additional packs of 10 bail-bars are available. Operate by applying a conductive coating to the walls of a circuit board hole, while maintaining a flat surface on both sides. Holes are left with a solder-plated copper wall and a solder-filled barrel. If a through-hole is not required, top and bottom pads are soldered. Where a through-hole is necessary, the solder core is removed with a de-soldering tool or wick after soldering both sides. Holes are left with a tin-plated electrolytic-quality copper sleeve pressed into the hole walls. Bail-bars consist of lengths of solder wire, which have been electroplated with pure copper, then over-plated with tin and scored at intervals of approximately 2mm. Each bail-bar is divided into 25 bails. End of the bail-bar is inserted into the hole using an insertion tool; bail-bar is snapped off to leave one bail in the hole. An automatic snap punch is placed over the end of the bail and pressed down. Hole may be de-soldered if a clear through-hole is required. Components in kit: insertion tool; punch; 10 bail bars (250 holes); five appropriately sized drill bits, and anvil. 

Satcam, www.satcam.com

MDO4000 series oscilloscope has a built-in spectrum analyzer. Can capture time-correlated analog, digital and RF signals simultaneously. A single instrument correlates events in the frequency domain with the time domain phenomena that caused them. Provides system-level debugging of wireless-enabled designs; can be used for timing analysis for mixed domain designs and tracking the source of noise or interference.

Tektronix, www.tek.com

WaveMax 8000 is a woven glass fabric, combined with a high-temperature static dissipative epoxy resin.  Offers excellent mechanical strength at continuous operating temp. in excess of 180ºC. Designed for wave soldering and IR reflow applications; can endure temp. approaching 300ºC for short periods without adversely affecting the life of the material. Reportedly offers more uniform ESD properties and superior machining capabilities over other comparable materials. Has thin walls easily machined. Retains static dissipative properties.

Norplex-Micarta, www.norplex-micarta.com

Pneumatic Servo Dispensing system is a positive rod displacement metering system that reportedly eliminates the need for a servo drive motor or material flow meters. Integrates a pneumatic drive motor and servo package to provide precise metered volumes, accurate flow control and consistent bead profiles. Pneumatic cylinder and positive displacement meter are lightweight and assembled into a single compact metering module for floor, robot or pedestal mounting. Components are readily accessed and easy to maintain. Is operated by a PSD control panel or automation integrated controls with dispensing software. Is ideal for adhesive bonding, casting, filling, gasketing, molding, sealing, and other operations. Is designed to dispense adhesives and sealants such as one-part epoxies, mastics, silicones, urethanes and abrasive materials. Includes supply pumps and a dispense valve available in Tip-Seal, No-Drip and Snuf-Bak models.

Sealant Equipment & Engineering, www.SealantEquipment.com/PSD

XSD Series desiccant cabinets are oxidation-free drying and storage systems for moisture-sensitive devices. Are designed to exceed J-STD-033B.1 for MSD handling. Combine low humidity and mild temperatures to replace vacuum oven-baking of tape-on-reel components. Dry PCBs and other MSDs at high speeds, reportedly without oxidation and intermetallic growth. XSD 1400 and XSD 700 series cabinets employ a dual-wall insulated steel and glass design, and the U5002 Dynamic Series closed loop Zeolite dryer. Maintain humidity levels below 0.5%RH and vapor content less than 0.6g.m³. Energy consumption averages less than 30W/hr.

Totech Super Dry, www.superdry.info

DB-1580 series conductive stringer attach adhesives are for back contact applications in crystalline silicon solar modules. Are designed to make contact from vias or other conductors in the solar cells to the back contact sheet. Are stress absorbing and have excellent conductive stability to back contact metallizations during damp heat exposure. Are designed to cure through the encapsulant lamination and cure process. Fast cure versions are available for co-curing with fast laminating encapsulants.

Engineered Conductive Materials, www.conductives.com

A-Series Hybrid targets manufacturers in the semiconductor backend industry. Introduces parallel placement technology to applications like SiP, MCM manufacturing, and flip chip bonding. Includes programmable placement force control. Has fluxer dip station and high-accuracy cameras. Can bond flip chips at a repeatability of 10 µm, while placing at 2,500 components per hr. per single placement head. Die bonding speeds are 3,500 cph per head at 25 µm, while passives are placed at 8,000 cph at 40 µm. Can carry up to three specialized twin placement robots, holding two heads per robot, for a total flip chip bonding speed of 15,000 placements per hr. per machine. Can also carry conventional placement robots for chip shooting for passives as small as 01005.

Assembléon, www.assembleon.com