TS6500CIM Techkit Mixer features a redesigned plunger assembly that encloses the magnet used to sense the position of the plunger. Guarding encloses the magnet to prevent it from being knocked out of position. Incorporates a two-hand start, a strengthened metal door with acrylic windows fitted with a safety interlock, and an emergency stop button. Includes pressure relief valve; plunger assembly depressurizes when the safety door is opened. Applies pressure on rear of cartridge plunger to prevent air from entering the cartridge during the mixing process. Has adjustable automatic injection rod and automatic precision level sensing. Automatically mixes two-component materials filled inside a cartridge kit.

Techcon Systems, www.techconsystems.com

RoadRunner3 automated inline programmer is said to eliminate errors through its connection to manufacturing execution system (MES) or other shop-floor control and enterprise resource planning (ERP) software. Feeder mounts directly onto an SMT machine without consuming additional floor space or altering the production line; integrates into existing SMT processes. Programs four devices in parallel and delivers the programmed parts to the pickup point of the placement machine. Configurable tape-in module adjusts for tape widths from 16 to 44mm. Has FIS modules, FIS remote and FIS track. Features FlashCORE III.

Data I/O Corp., www.dataio.com

Resin Remover Solvent and Conformal Coating Remover Gel have been developed to work without the use of dichloromethane; has been replaced with a safer alternative solvent blend. RRS is designed to swell and soften, and dissolve cured coatings, as well as epoxy and polyurethane resins. CCRG thixotropic gel is formulated to remove solvent-resistant coatings (including DCA, DCB and DCR). Both will be available in November.

Electrolube, www.electrolube.com

DB-1541-LTC low-temperature curing conductive adhesive is for use in organic solar modules or other temperature-sensitive photovoltaic devices. Optimized for excellent conductivity and stability on various substrates when cured at 100°C. Has a dispensing work life greater than 48 hrs. (measured as a 25% increase in viscosity), while maintaining optimized rheology for dispensing and excellent damp heat resistance and conductivity stability on tin, tin-silver and silver-plated ribbons. Is reportedly ideal for flexible photovoltaic applications with high peel strength. Can be fast cured at elevated temperatures (1 min. at 180°C).

Engineered Conductive Materials, www.conductives.com

Single coated engineered tapes are designed to solve static dissipative, halogen-free flame-retardant and high-temperature applications. Are REACH and RoHS compliant and available in a variety of polyimide, polyester and aluminum constructions. Include an array of liners for hand or die-cutting.

Polyonics, www.polyonics.com

Aquanox A4638 is an electronics assembly and advanced packaging cleaning agent. Is designed to remove flux residue from flip chip and low clearance components; removes water-soluble polar flux residues at low concentrations. Is a nonhazardous, biodegradable aqueous solution. Contains no CFCs or HAPs; is RoHS-compliant, and Halogen-, Halide- and Hexane-free. Is compatible with all materials commonly used in electronics assembly manufacturing and cleaning processes.

Kyzen, www.kyzen.com

Flight Status Board Tracking System tracks the progress of circuit boards throughout the manufacturing process. Can see defects in real-time. Is visible for employees to track the status of orders at any point in the manufacturing process. Touch-screen displays present a list of projects and board counts within specific process centers, including the quantity of boards in previous and subsequent process centers. Can see enforced route and contact information of specific project. Can see when nearing the end of the quantity of boards for current run.

ACD, www.ACDUSA.com

The free, illustrated 2011-2012 Dummy Component Catalog is now available. Features dummy components that have the same materials and are made on the same production lines as live components, as well as standards and future technology needed. New sections in the catalog include an expanded selection of flip chips and flip chip test kits; Quick-Pak open-molded quad flat pack no leads; FusionQuad board and kits; IPC A620 compliant wire harness kit; IPC PCB-J-STD compliant hand solder kit; PCB-B-25A standard test board; PCB-B-24 standard test board, and PCB-B-36 standard test assembly. Numerous product revisions also are included. Additional technology includes Amkor’s TMV package; WLP Wafer Chip Size Packages’ finished package, and a Dummy Component Sample Case.

Practical Components, http://www.practicalcomponents.com/catalog.htm

MFR-1300 standalone desoldering equipment builds on existing MFR technology. New design permits hand piece to be used in two configurations. Can swap grip on hand piece from standard pencil grip to pistol grip. Power supply features internal pump that provides 0.7 bar (21" Hg) of vacuum suction force, combined with Smartheat technology. Has dual switchable output; can operate one or two different hand pieces. Includes replaceable collection chamber. Solder collection capabilities reportedly have been increased 40% from previous MFR desoldering systems.

OK International, www.okinternational.com

DT85M Series 3 Data Logger is for remote monitoring. Features cellular modem. Backlit LCD display shows channel data, alarms, and system status, navigable with six-button keypad. Features temperature operating range of -30°C to 70°C and up to 85% RH. Construction is powder-coated steel and anodized aluminum. Design (peak power 12W) permits use of a smaller solar panel. Enables automatic data delivery. Can send logged data to an FTP server. Internal storage capacity is 128MBs; has removable USB storage device support. Configurable alarm conditions can be used to trigger data delivery and send alarm messages to multiple email addresses or mobile phones. Features 16 analog input channels, expandable up to 320 channels and 960 analog points using optional CEM20 modules, as well as 12 flexible digital channels. Has up to 48 analog sensor inputs with two serial smart sensor ports. Fundamental inputs include voltage, current, resistance and frequency. Supports thermocouples, RTD, thermistors, monolithic temperature sensors, and 4-20mA. Maximum sample speed is 25Hz with 18 bits of effective resolution. Modbus is supported for SCADA connection, as well as multiple SDI-12 interfaces for environmental sensors. dEX graphical interface comes preinstalled.

CAS DataLoggers, www.DataLoggerInc.com

C245 Super Cartridges are for high thermal efficiency. Permit T245 hand piece station to supply the most power possible to the solder joint. Bottleneck is usually the tip of the cartridge.

JBC Tools, www.jbctools.com

OptiCon X-Line 3D x-ray inspection system enables a safe quality control of solder joints on opposed mounted BGA components, such as in double-sided equipped DDR-RAM modules. Single-sided and double-sided equipped PCBs can be inspected within one test run. Can analyze both top and bottom sides of boards and all layers in between layer by layer. Each BGA solder ball is localized in x/y-direction, as well as z-direction. Relevant parameters of each solder joint are determined in three layers. Open solder joints and wetting defects can be detected; voids can be determined in size and z-position within a solder joint. Is able to detect solder connections at IC pins and two-pin components, as well as THT components. Uses GigaPixel image technology. Real-time multi-angle image recording enables a test speed of 40cm²/s for full 3D PCB capturing. Integrated reconstruction methods, based on digital tomosynthesis, allows defined evaluation of single layers.

Goepel electronic, www.goepel.com