VW-9000 high-speed microscope incorporates a built-in light source, LED monitor, analysis software and PC components. Can be used for standard high-speed applications and as a digital microscope for inspection and development work. Has a redesigned CMOS sensor; is capable of recording high-speed processes at up to 230,000 frames per sec.; can capture video for up to 13 hrs. Controller supports color and monochrome cameras. High-speed recording is automatically played back in slow motion. Motion graph function graphically displays changes in a target’s movement. Recorded footage can be edited and analyzed directly on the controller. Automatically tracks moving objects in recorded footage to quantify speed, acceleration, distance, angle and other measurements. Error monitoring function automatically analyzes repetitive movements to determine when an abnormal event occurs.

Keyence, www.digitalmicroscope.com/PRVW9

Halogen-free NC-560-HF Pb-free, no-clean solder paste reportedly increases process yields with ENIG, OSP, HASL and immersion silver boards. Delivers lot-to-lot stencil printing consistency, along with good print performance characteristics, including full pad and component wetting and good surface tension, eliminating aperture clogging for up to 20 prints; minimal residue that is non-conductive and non-corrosive; thermal stability at temperatures up to 300°C; viscosity of 650-850 Kcps +10%; low beading and anti-tombstoning; wide process windows with long stencil life, and initial tack value of 33g force. Complies with RoHS; meets highest IPC-7095 voiding performance classification. Is compatible with ICT and AOI.

Amtech, www.amtechsolder.com

Single and double row solder cup spring pin header strips are for wire termination in test and field applications where stackup tolerances or blind-mating can be a challenge. Each spring pin provides 0.0275" of mid-stroke compression (0.055" max. compression) and is rated for one million cycles. Solder cup is sized to accommodate up to a 22 AWG wire; has gold-plated brass components and beryllium copper springs. 824 and 826 series headers feature spring-loaded pins rated at 3A max. (2A continuous use), high-temperature Nylon 46 insulators; come in 2-64 positions single row and 4-64 double row.

Mill-max, www.mill-max.com/PR618

Renew eco-stencil AQ batch stencil cleaner is designed for ultrasonic and spray-in-air systems. Removes all types of solder paste (e.g. water-based, RMA, no-clean, Pb-free) and uncured adhesives from stencils and misprinted boards. Is a drop-in replacement for semiaqueous and aqueous cleaners. Compatible with frame, screen, stencil and adhesives. Is compliant with CARB (California Air Resource Board), REACH and WEEE.

Techspray, www.techspray.com  

Stand-up tip caps seal syringe barrel tips during storage and shipment. Have large, flat bottom surfaces that enable syringe barrel to stand upright. Existing entrapped air migrates to piston, to ease removal. Are molded from polypropylene resin; compatible with a range of dispensing fluids. Feature large knurled gripping surfaces for simple installation and removal. Come in packs of 50 and bulk packages of 1000.

Techcon Systems, www.techconsystems.com

ME-555 underfill encapsulant was developed for semiconductor packaging and assembly. Is comparable with underfills such as Henkel 4256; offers excellent flow characteristics, thermal cycling reliability and low coefficient of thermal expansion. Is a high purity, semiconductor-grade epoxy underfill material for the encapsulation of flip chip devices. Reduces warpage; handles over-molding processes. Can be used under CSP/BGAs and small dies with standoff heights as small as 25µm. Provides good adhesion to laminate, ceramic, solder mask and metal surfaces, as well as high Tg and high fracture toughness.

Lord Corp., www.lord.com

SI-F1000 series micro-head spectral-interference laser displacement sensor is designed to provide high-precision performance in a 2mm diameter sensor head. Is a low power optical system using fiber-optic detecting; measurements can be taken without electromagnetic effects or additional head to measurement system. External signal processing is eliminated. Controller models include built-in digital and analog data outputs. Includes onboard data storage and calculation functions. Applications include wafer thickness and warpage mapping; media thickness and surface characterization, and inline thickness measurement of transparent webs and coatings.

Keyence, www.keyence.com/PRSI

TMV (through mold via) 14mm board drop test Pb-free kit is designed for Amkor TMV component. Eight-layer test board is a 3x5 array with 15 component placements per board. Is 132 x 77mm and 1mm thick. Standard surface finish is OSP. Is designed for TMV 620 solder ball 0.4mm pitch bottom component and TMV 200 solder ball 0.5mm top component. Both have a daisy chain pattern through the substrate of the part; daisy chain pattern also runs through the test board.

Practical Components, www.practicalcomponents.com

Right-angle Q Rate 5mm body design connectors are for backplane and other high-speed applications with coplanar and perpendicular applications. Ground/power plane of QRM8-RA and QRF8-RA series permits contacts to be placed closer together without degrading signal performance. Equipped with ground/power plane and signal-integrity-optimized Edge Rate contacts. Surface of contacts increases wear life; minimizes effects of broadside coupling. Robust when mating and unmating; features a long contact wipe. 0.8mm pitch right-angle system is dual-row and available in 1, 2 or 3 banks, with up to 78 positions per row. Optional guideposts for blind mating are available. Also available in a vertical orientation with stack heights from 7 to 14mm.

Samtec, www.samtec.com

MT2168 provides short index time, fast loading and sorting, and high soak capacity. With no handler limitations, enhanced tester capabilities permit optimization of test cell throughput with shorter test times and the use of higher parallelism. Is optimized for single parameters (parallelism and speed) and synchronized internally with respect to the number of contact sites, as well as loading, soaking and sorting capacity.

Multitest, www.multitest.com

PA610 placement machine has an improved clamping system for printed circuit boards. As with PA510, the fixture of the board can be carried out without tools. Can be equipped with up to four stop angles. A vacuum table can be retrofitted at any time; a change between the PCBs and the placement of foils can be done within seconds. Placement head has been improved; a high-res direct encoder is used to decouple the placement head from influences caused by the drive, reportedly increasing rotation accuracy. Is equipped with placement tools with anti-contortion protection.

Fritsch, www.fritsch-smt.de

SCS AdPro Poly adhesion promotion technology enhances adhesion of Parylene coating with polyimide and other polymeric substrates. Has demonstrated improved stability at elevated temperatures; is reportedly excellent for harsh environment applications. Is biocompatible for medical device applications. 

Specialty Coating Systems, www.scscoatings.com