ME-555 underfill encapsulant was developed for semiconductor packaging and assembly. Is comparable with underfills such as Henkel 4256; offers excellent flow characteristics, thermal cycling reliability and low coefficient of thermal expansion. Is a high purity, semiconductor-grade epoxy underfill material for the encapsulation of flip chip devices. Reduces warpage; handles over-molding processes. Can be used under CSP/BGAs and small dies with standoff heights as small as 25µm. Provides good adhesion to laminate, ceramic, solder mask and metal surfaces, as well as high Tg and high fracture toughness.

Lord Corp., www.lord.com

SI-F1000 series micro-head spectral-interference laser displacement sensor is designed to provide high-precision performance in a 2mm diameter sensor head. Is a low power optical system using fiber-optic detecting; measurements can be taken without electromagnetic effects or additional head to measurement system. External signal processing is eliminated. Controller models include built-in digital and analog data outputs. Includes onboard data storage and calculation functions. Applications include wafer thickness and warpage mapping; media thickness and surface characterization, and inline thickness measurement of transparent webs and coatings.

Keyence, www.keyence.com/PRSI

TMV (through mold via) 14mm board drop test Pb-free kit is designed for Amkor TMV component. Eight-layer test board is a 3x5 array with 15 component placements per board. Is 132 x 77mm and 1mm thick. Standard surface finish is OSP. Is designed for TMV 620 solder ball 0.4mm pitch bottom component and TMV 200 solder ball 0.5mm top component. Both have a daisy chain pattern through the substrate of the part; daisy chain pattern also runs through the test board.

Practical Components, www.practicalcomponents.com

Right-angle Q Rate 5mm body design connectors are for backplane and other high-speed applications with coplanar and perpendicular applications. Ground/power plane of QRM8-RA and QRF8-RA series permits contacts to be placed closer together without degrading signal performance. Equipped with ground/power plane and signal-integrity-optimized Edge Rate contacts. Surface of contacts increases wear life; minimizes effects of broadside coupling. Robust when mating and unmating; features a long contact wipe. 0.8mm pitch right-angle system is dual-row and available in 1, 2 or 3 banks, with up to 78 positions per row. Optional guideposts for blind mating are available. Also available in a vertical orientation with stack heights from 7 to 14mm.

Samtec, www.samtec.com

MT2168 provides short index time, fast loading and sorting, and high soak capacity. With no handler limitations, enhanced tester capabilities permit optimization of test cell throughput with shorter test times and the use of higher parallelism. Is optimized for single parameters (parallelism and speed) and synchronized internally with respect to the number of contact sites, as well as loading, soaking and sorting capacity.

Multitest, www.multitest.com

PA610 placement machine has an improved clamping system for printed circuit boards. As with PA510, the fixture of the board can be carried out without tools. Can be equipped with up to four stop angles. A vacuum table can be retrofitted at any time; a change between the PCBs and the placement of foils can be done within seconds. Placement head has been improved; a high-res direct encoder is used to decouple the placement head from influences caused by the drive, reportedly increasing rotation accuracy. Is equipped with placement tools with anti-contortion protection.

Fritsch, www.fritsch-smt.de

SCS AdPro Poly adhesion promotion technology enhances adhesion of Parylene coating with polyimide and other polymeric substrates. Has demonstrated improved stability at elevated temperatures; is reportedly excellent for harsh environment applications. Is biocompatible for medical device applications. 

Specialty Coating Systems, www.scscoatings.com

BANNOCKBURN, IL — IPC has released a Swedish language version of J-STD-001E, Krav för Lödda Elektriska och Elektroniska Kretskort, the industry-consensus standard for soldering processes and materials.

No. 1002 is an electrically-heated, 500ºF cabinet oven used for various test procedures. Workspace dimensions measure 20" x 20" x 20". 8KW are installed in Incoloy sheathed tubular elements to heat the unit, while a 400CFM, 1/3-HP recirculating blower provides horizontal airflow across the load. Features 4" insulated walls throughout, Type 304, 2B stainless steel interior with continuously backwelded seam construction, stainless steel exterior with #4 brushed finish, heavy-duty door and door frame, three nickel-plated wire shelves and adjustable opposed louvers on supply and return ductwork. Is equipped with safety equipment for handling flammable solvents, including explosion-venting door hardware, powered forced exhauster airflow safety switch, purge timer and digital indicating temperature controller.  

The Grieve Corp., www.grievecorp.com

AutoVision includes Vision Hawk and Vision Mini smart cameras. Aim to simplify the setup and deployment of machine vision applications, while providing a tool set for high-performance inspection and identification. AutoVision machine vision software has real-time feedback during programming and device configuration; is available on Vision Mini and Vision Hawk hardware platforms. Smart cameras feature compact housings; can be operated by AutoVision interface or Visionscape. Applications include part identification and location, item traceability, and other automated inspection tasks. Vision Mini is for embedded identification and inspection applications. Has integrated lighting and autofocus lens; is 1.8 x 2.1 x 1". Features wide angle optics for close range machine vision tasks, such as component ID, color matching, data matrix reading, and part location. Vision Hawk is for assembly verification, part identification, and symbol decoding. Has liquid lens technology for unlimited autofocus. Includes integrated optics and lighting, industrial protocols, and plug-and-play connectivity.

Microscan, www.microscan.com

Speedprint SP700avi screen printer is for high-volume SMT production and high-mix, quick product setup and changeover. Has 6 Sigma alignment capabilities. Uses 1µm resolution linear encoders on all axes and intuitive software. Has a one-piece frame. Features look down/look down vision for board-to-stencil alignment; has 20µm performance at 2 Cpk. Includes auto stencil load/unload, vacuum-assisted stencil cleaner, and optical inspection of paste bead. 2-D post-print bridge detection and various tooling solutions are available as options.

Speedprint Technology, www.speedprint-tech.com

Traqu is a high-resolution digital 3-D inspection device used for measurement and analysis in processes such as solder paste inspection. Is a 3-D inspection system for process optimization, monitoring and sample control. Infrared-interferometric sensor scans any 3-D structure, independent of material and surface. Vertical resolution from 2-200nm and a horizontal resolution from 1-20µm. Applications are versatile. Is used for SPI and quality insurance for stencil printers. Measures coating thickness. Imports from DXF or Gerber data. Can be set to automatically scan all packages of the same type. Inspection area covers 300 x 400mm. Flexible magnetic holder is integrated for any substrate type.

Essemtec, www.essemtec.com