Circuits Assembly Online Magazine - White Papers

Uncategorised

FLX2010 SMD pick-and-place has 190 feeders. Can place 5,000 cph, including 0201 or ultra-fine pitch 0.3 mm components, as well as condensators up to 15 mm, large connectors and 50 mm BGAs. Features laser and vision centering systems. Management system automatically recognizes feeders and pickup height. LEDs show the feeder status.

Essemtec, essemtec-usa.com, Booth 5438

Summit 1800 is for Pb-free rework for large components. A 65-mm alignment field of view with digital and optical zoom and split image ensure placement of large packages, sockets and connectors. Has programmable, motor-controlled top heater positioning and automatic prism shuttle. Incorporates independent, programmable motions for pick-up and top heater height.

VJ Electronix Inc., vjelectronix.com, Booth 5626

Harmony SPX multi-axis Cartesian robot selectively solders through-hole and odd-form components into surface-mount and mixed-technology PCBs. Suited for small or large lot quantities and a high product mix. Conveyor system expands 4 to 18" under program control. Rotation and tilt axis are built into the conveyor head. Can be configured with two 350 lb. solder pots. Permits up to six separate solder nozzles.

Tyco Electronics, automation.tycoelectronics.com, Booth 5438

MTS500 Condor flying probe tester features rapid program development, high throughput and handles large PCBs. Has four identical probes and over 1000 fixed pins. Has a SMEMA-compatible conveyor; tests boards up to 24 x 28". Test heads feature virtually maintenance-free x-y positioning on a frictionless air cushion system.

DigitalTest, digitaltest.net Booth 5220

AIM will highlight its lead-free soldering materials, including the SN100C lead-free alloy. A live lead-free selective soldering demonstration with the alloy is in booth 5437. SN100C, created by Nihon Superior in Japan, is comprised of tin, copper and a small amount of nickel. The nickel modifies its behavior so that in wave soldering it exhibits fluidity comparable with tin-lead solder. Excess solder drains easily off the joint, so bridges and icicles are avoided. Provides smooth, bright, well-formed fillets which make inspection easy. Does not contain silver or phosphorus, is less aggressive toward the copper of traces and pads or the stainless steel components of soldering equipment. Has a low dross rate.

AIM, aimsolder.com, Booth 5434

Siemens Logistics & Assembly Systems Inc. this month unveiled its first machine manufactured in Singapore, the SIPLACE HS-60 high-speed pick and placer. It’s the result of 14 months of development and technology sharing with the company’s Munich headquarters, and symbolizes a new path for the Germany-based equipment giant. Siemens L&A Americas product manager Tom Foley spoke with Circuits Assembly.

Start
Prev

Page 38 of 40

APRIL ISSUE

View the Digital
Edition Here!

Uncategorised

Essemtec's High-Mix Pick-and-Place

VJ Electronix's Rework Station

Tyco Electronics' High-Volume Selective Soldering

DigitalTest's 4-Probe Tester

AIM's Pb-Free Materials

It's A Small World, Siemens Finds

Press Releases

POPULAR

Uncategorised

Essemtec's High-Mix Pick-and-Place

VJ Electronix's Rework Station

Tyco Electronics' High-Volume Selective Soldering

DigitalTest's 4-Probe Tester

AIM's Pb-Free Materials

It's A Small World, Siemens Finds

Press Releases

POPULAR

Sign in to your account