Vitronics Soltec has named Erik Tobiason president,
replacing Jeroen Schmits, who was named head of Universal Instruments
last month.
Vitronics and Universal are subsidiaries of Dover Technologies.
Tobiason was president of Graphics Microsystems Inc., also a Dover
Corp. subsidiary. He was also vice president of engineering and R&D
of GMI, and held positions in engineering and technology management
with front-end semiconductor companies in the Silicon Valley.
He has a bachelor's in physics from California Polytechnic, and a
masters in business from Santa Clara University. He is based in
the company's New Hampshire facility.
Panasonic Factory Solutions Co. of America has moved from Elgin, IL, to
a dedicated location in Buffalo Grove.
The new facility will house
three industrial market units: Welding and Robotics, Electronics
Assembly (EAG) and Microelectronics (MEG).
"We're continually growing as an independent industrial division of the
Panasonic family," said Tom Gebhardt, president. "This move is most
advantageous: the location's proximity to O'Hare and other industrial
corporations is far more convenient for customers visiting/training
with us. We have expanded our MEG clean room by 60%, and added lab
space specifically for metrology and solutions."
The company develops and supports innovative manufacturing processes
around the core of welding, robotic, software and circuit manufacturing
technologies.
Pro-Mation, a company specializing in PCB handling equipment, selective
robotic soldering, laser mark and technical workstations, has signed a
sales deal with Kintner Equipment Corp. to serve
customers in upstate New York and western Pennsylvania.
Gary Goldberg,
president of Pro-Mation, said, “Kintner Equipment is a premier capital
equipment sales organization with many years of experience in both SMT
and back-end manufacturing operations. Promation is delighted to have
secured this business relationship.”
AC-30L platform combines the throughput of the rotary
Lightning head with the flexibile AdVantis platform. Said to deliver high
utilization for top- and bottom-side applications, with high-speed placement of
large parts. Lightning head features a radial array of 30 modular, individually
controlled spindles for placement rates up to 30,000 cph.
Pb-Free suite of materials for electronics assembly includes no-clean
and water-wash solder pastes, solder preforms in tape and reel
packaging, wave solder flux, reworkable no-flow underfill, and rework
and repair materials.
Verifier HR high-resolution x-ray system
addresses failure analysis and manufacturing/rework quality assurance
applications for PCBs up to 16 x 18". A 90kV, 5 micron microfocus x-ray
source supplies power to penetrate shielded packages; high-definition imaging
train provides >650X magnification for microscopic interconnections. Cabinet
measures 32 x 34".