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microme|x is a high resolution x-ray inspection system with a large scanning area (20 x 24"), a precise manipulation unit with 360° rotation axis and the approved ovhm technology for oblique views up to 70° at constant magnification. Operators can inspect large boards with mixed assemblies and acquire real-time oblique views under all angles.

 
Has board handling unit connection for fully automated loading of assembled boards in the production plant. In connection with the inspection software, XE², can perform a fully automated inspection and evaluation of BGA, CGA, QFP, THT and other solder joints. An interface for the CAD data import allows use of the original PCB layout to teach in the inspection routine. Inspection reports can be transferred to a rework station by the repair program quality. The SPC module allows statistical evaluation of the inspection results and the process supervision.

 
phoenix x-ray Systems + Services GmbH, phoenix-xray.com

Productronica Hall A2, Booth 277

Under a global OEM reselling agreement, Hover-Davis will offer Cogiscan's RFID hardware and software applications that mix with their tape feeders, label feeders and direct die feeders. Hover-Davis will now be able to provide intelligent feeding solutions that seamlessly integrate with existing equipment and information systems.

Hover-Davis’s intelligent feeders identify and track components and feeders with barcode and RFID and provide real-time visibility of all materials on the shop floor.

Rick Howe, Hover-Davis vice president of sales and marketing, said, "We are very excited about this new step in our partnership with Cogiscan. We feel that our customers will greatly benefit from our ever increasing range of feeding solutions, making it more and more compelling to integrate them with their manufacturing systems."

Francois Monette, Cogiscan vice president of sales and marketing, said, "This represents an important step in our vision of becoming the global standard for RFID-based material control in our industry."

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Indium Corp. of America appointed Chimie Tech Services to distribute its line of solder materials in France.

CTS will handle sales and service of Indium's solder pastes, wave solder fluxes, solder wire and solder preforms portfolio. The firm has experience in supplying consumable materials and equipment for the manufacture of active and passive components, Indium said.

Indium European managing director Brian Craig said, "CTS will be a great asset to Indium's presence in France. We are very excited to have them on the Indium team in Europe."
Speedline Technologies and Agilent Technologies this week described results of a three-month design of experiment to understand and quantify variables in a lead-free manufacturing process.

The researchers found positional accuracy of the paste deposit relative to the pad to be the critical element in ensuring good fine pitch Pb-free assemblies, and is even more critical for some formulations than others. Solder volume can be readily managed across the supplier base with printer variables and stencil design. As with any solder pastes (Pb-free and Pb-bearing), the use of enclosed print heads such as the Rheometric pump will present advantages such as better aperture fill; however, it is not the determining factor for a high quality process. The atmosphere and profile of the reflow oven contribute substantially to the overall quality of the Pb-free assembly, the researchers found.

Coauthor Dr. Gerald Pham-van-Diep, director of advanced development at Speedline Technologies, said, “This study was undertaken to review the full potential for process needs as customers convert to Pb-free process technologies. It demonstrates that the process changes required in most situations to convert to Pb-free are not as daunting as some suppliers would have the industry believe. In essence, with appropriate process review, process development work and management of the variables available to the manufacturer, the switch to producing high-quality Pb-free assemblies is achievable.”

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DEK named Flash Electronics winner of its Combined Strength award, recognizing the EMS firm for its partnership and use of DEK's printing platforms.

Flash has been a DEK customer since 1994. The company has six locations worldwide.

Flash's  SMT engineering manager Long Pham said, "Since we often need to transfer product from our facilities in the Americas to locations in China, we must have a supplier partner that can provide us with global product consistency. Because of DEK's ability to repeat transfer product between their global facilities, partnering exclusively with them has eliminated these problems and allows us to ensure superior quality, cost efficiency and quick time to market."

DEK Americas general manager Neil MacRaild said, "The partnership has enabled product and process development on both sides: DEK has also gained from the shared knowledge of this relationship. The Flash and DEK teams have worked as one to find solutions to manufacturing challenges, add efficiency to global processes and help ensure high-yield, top quality products for Flash's well-known customers."
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The SMTA will consponsor the upcoming EMS China conference, the trade group announced this week.

The conference will be held Nov. 21-22, in Shanghai, in conjunction with the 66th China Electronics Fair and Asia Electronics Exhibition. The theme of the technical program is Benchmarking and Management of the OEM/EMS Relationship.

The conference lineup includes a workshop on optimizing the contract manufacturing partnership, and an EMS industry summit, during which presentations and discussions will address business partnerships in a global context.


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