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Pemstar Inc., a
provider of electronics manufacturing
services, has received full qualification
status for lead-free SMT processing. A third-party firm conducted the audit, company officials told CIRCUITS ASSEMBLY today.
In a statement, Roy Bauer, president and COO, said, "We have been working closely with our supply chain and with our OEM customers to proactively prepare for the new design and manufacturing requirements resulting from these environmental initiatives. This qualification milestone builds on the lead-free manufacturing processing that Pemstar has been providing to its customers over the past 15 months in its North America, Europe and Asia facilities."
Company facilities in North America, Europe and Asia passed Pb-free validation based on visual inspection per IPC-A-610D, cross-section and microscopic analysis for intermetallics, coating integrity and general defects, and for solder wetting and fillet quality, and vVoiding analysis on BGAs.
In a statement, Roy Bauer, president and COO, said, "We have been working closely with our supply chain and with our OEM customers to proactively prepare for the new design and manufacturing requirements resulting from these environmental initiatives. This qualification milestone builds on the lead-free manufacturing processing that Pemstar has been providing to its customers over the past 15 months in its North America, Europe and Asia facilities."
Company facilities in North America, Europe and Asia passed Pb-free validation based on visual inspection per IPC-A-610D, cross-section and microscopic analysis for intermetallics, coating integrity and general defects, and for solder wetting and fillet quality, and vVoiding analysis on BGAs.
Kester today announced the opening of a manufacturing and technical
center in Suzhou, China. The facility adds to Kester's distribution and
manufacturing operations, making it possible to supply the company's
full line of soldering products throughout the world.
In a statement, president and CEO Roger Savage said, “We are very excited about the new facility. We have been working towards strengthening our position in China for quite some time. This now allows us to service existing customers even better than before, as well as build new relationships with local Chinese customers.”
In a statement, president and CEO Roger Savage said, “We are very excited about the new facility. We have been working towards strengthening our position in China for quite some time. This now allows us to service existing customers even better than before, as well as build new relationships with local Chinese customers.”
Vitronics Soltec has named Erik Tobiason president,
replacing Jeroen Schmits, who was named head of Universal Instruments
last month.
Vitronics and Universal are subsidiaries of Dover Technologies. Tobiason was president of Graphics Microsystems Inc., also a Dover Corp. subsidiary. He was also vice president of engineering and R&D of GMI, and held positions in engineering and technology management with front-end semiconductor companies in the Silicon Valley.
He has a bachelor's in physics from California Polytechnic, and a masters in business from Santa Clara University. He is based in the company's New Hampshire facility.
Vitronics and Universal are subsidiaries of Dover Technologies. Tobiason was president of Graphics Microsystems Inc., also a Dover Corp. subsidiary. He was also vice president of engineering and R&D of GMI, and held positions in engineering and technology management with front-end semiconductor companies in the Silicon Valley.
He has a bachelor's in physics from California Polytechnic, and a masters in business from Santa Clara University. He is based in the company's New Hampshire facility.
Panasonic Factory Solutions Co. of America has moved from Elgin, IL, to
a dedicated location in Buffalo Grove.
The new facility will house three industrial market units: Welding and Robotics, Electronics Assembly (EAG) and Microelectronics (MEG).
"We're continually growing as an independent industrial division of the Panasonic family," said Tom Gebhardt, president. "This move is most advantageous: the location's proximity to O'Hare and other industrial corporations is far more convenient for customers visiting/training with us. We have expanded our MEG clean room by 60%, and added lab space specifically for metrology and solutions."
The company develops and supports innovative manufacturing processes around the core of welding, robotic, software and circuit manufacturing technologies.
The new facility will house three industrial market units: Welding and Robotics, Electronics Assembly (EAG) and Microelectronics (MEG).
"We're continually growing as an independent industrial division of the Panasonic family," said Tom Gebhardt, president. "This move is most advantageous: the location's proximity to O'Hare and other industrial corporations is far more convenient for customers visiting/training with us. We have expanded our MEG clean room by 60%, and added lab space specifically for metrology and solutions."
The company develops and supports innovative manufacturing processes around the core of welding, robotic, software and circuit manufacturing technologies.
Pro-Mation, a company specializing in PCB handling equipment, selective
robotic soldering, laser mark and technical workstations, has signed a
sales deal with Kintner Equipment Corp. to serve
customers in upstate New York and western Pennsylvania.
Gary Goldberg, president of Pro-Mation, said, “Kintner Equipment is a premier capital equipment sales organization with many years of experience in both SMT and back-end manufacturing operations. Promation is delighted to have secured this business relationship.”
Gary Goldberg, president of Pro-Mation, said, “Kintner Equipment is a premier capital equipment sales organization with many years of experience in both SMT and back-end manufacturing operations. Promation is delighted to have secured this business relationship.”
AC-30L platform combines the throughput of the rotary
Lightning head with the flexibile AdVantis platform. Said to deliver high
utilization for top- and bottom-side applications, with high-speed placement of
large parts. Lightning head features a radial array of 30 modular, individually
controlled spindles for placement rates up to 30,000 cph.
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