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SM320 achieves placement rates up to 18,500 cph with ±50 micron
accuracy and up to 5,500 cph at ±30 micron for QFPs and BGAs. Gantry
system features twin-servo motor design for stability. Slim format
feeders handle standard EIA 481 tape sizes, with a maximum of 120 8-mm
feeders. Handles components from 01005 to 55 mm2.
Dynatech Technology, dynatechsmt.com, Booth 5000
Dynatech Technology, dynatechsmt.com, Booth 5000
Liquid Lock “locks” atomized spray in the
wash chamber, eliminating chemical solution loss from atomized spray
mist exhaust. Said to reduce consumption of cleaning solution up to
75%. Also locks in heat, reducing energy required to heat the wash
tank.
Stoelting/TREK, stoelting.com, Booth 5010
Stoelting/TREK, stoelting.com, Booth 5010
The 2710 system combines 0.24 s/Mb programming technology, FX4 socket modules
and a concurrent programming system. Programs devices with densities up to 4
Gb, has a high-speed USB 2.0 standard bus for communications. Programs a 64 Mb
device in 15 sec. Can program up to 24 devices at the same time. Guards against
passing blank parts.
BP Microsystems, bpmicro.com, Booth 5635
Aquanox A4630 aqueous cleaner is for Pb-free materials. Typically used
in spray-in-air equipment at 10 to 20%, from ambient temperatures and
without sump side additives. Said to provide brilliant joints, pass
after pass, throughout an extended bath life.
Kyzen Corp., kyzen.com, Booth 5834
Kyzen Corp., kyzen.com, Booth 5834
Zestron America
will showcase its lead-free cleaning process solutions, and will also
feature its recent advances in PCB, stencil/misprint and maintenance cleaning
applications. The applications technology and sales team will be available
to answer precision cleaning questions.
Zestron America,
zestronusa.com, Booth 5609
MPM AccuFlex printing system will be part of the live, working
electronics assembly line. The printer is for moderate volume, high-mix
printing. Combines accuracy and flexibility in a compact footprint, the
printer offers a range of options for future expansion or advanced
processes. Designed for production of 8,000 boards/week, with two or
more product changeovers per shift.
MPM Accela printing system features parallel processing technology. Said to produce the most boards/hour of any industry printer – delivering raw throughput gains of 20 to 80% over competitors and generating more quality boards per hour. Designed for ease of use, features a new design and easy-to-use operator interface. Is positioned for lead-free assembly and complex boards.
Electrovert OmniExcel 7 is a lead-free capable, seven-zone, forced convection reflow oven. Features an advanced chamber design for balanced airflow with minimal turbulence, to improve heat transfer and reduce power and N2 consumption. Compared to other platforms, reportedly consumes up to 50% less power and 35% less nitrogen. Can be equipped with self-cleaning Flux Extraction Systems (FES), delivering a drop in maintenance intervals to once per month. OmniCheck monitoring system delivers a redundant check on process temperatures and conveyor belt, and provides both extensive data tracking and monitoring capabilities of the process parameters. In addition Speedline will exhibit its Electrovert Quick-Change Solder Module equipped with the new UltraFill Nozzle.
Speedline Technologies, speedlinetech.com, Booth 5710
MPM Accela printing system features parallel processing technology. Said to produce the most boards/hour of any industry printer – delivering raw throughput gains of 20 to 80% over competitors and generating more quality boards per hour. Designed for ease of use, features a new design and easy-to-use operator interface. Is positioned for lead-free assembly and complex boards.
Electrovert OmniExcel 7 is a lead-free capable, seven-zone, forced convection reflow oven. Features an advanced chamber design for balanced airflow with minimal turbulence, to improve heat transfer and reduce power and N2 consumption. Compared to other platforms, reportedly consumes up to 50% less power and 35% less nitrogen. Can be equipped with self-cleaning Flux Extraction Systems (FES), delivering a drop in maintenance intervals to once per month. OmniCheck monitoring system delivers a redundant check on process temperatures and conveyor belt, and provides both extensive data tracking and monitoring capabilities of the process parameters. In addition Speedline will exhibit its Electrovert Quick-Change Solder Module equipped with the new UltraFill Nozzle.
Speedline Technologies, speedlinetech.com, Booth 5710
Press Releases
- AIM to Present on High Reliability and Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA South China Expo & Tech Forum
- STI Electronics, Inc. Achieves ISO 13485:2016 Certification, Demonstrating Commitment to Quality in Medical Device Manufacturing
- Indium Corporation to Showcase Solder Products, New Flux-Cored Wire Formula at SMTA International
- Saki Strengthens Presence in India