Uncategorised
DDf, in the Direct Die Feeding product line, can feed
a range of bare die and flip chips, and can be mounted on almost every
placement machine. Performance is optimized around the handling of
small flip chips. Capable of feeding die to 0.5 mm sq. with a
throughput over 6,000 die/hr.
Hover-Davis, hoverdavis.com, Booth 6040
Hover-Davis, hoverdavis.com, Booth 6040
FLX2010 SMD pick-and-place has 190 feeders. Can place 5,000 cph, including 0201
or ultra-fine pitch 0.3 mm components, as well as condensators up to 15 mm,
large connectors and 50 mm BGAs. Features laser and vision centering systems.
Management system automatically recognizes feeders and pickup height. LEDs show
the feeder status.
Essemtec, essemtec-usa.com, Booth 5438
Summit 1800 is for
Pb-free rework for large components. A 65-mm alignment field of view with
digital and optical zoom and split image ensure placement of large packages,
sockets and connectors. Has programmable, motor-controlled top heater
positioning and automatic prism shuttle. Incorporates independent, programmable
motions for pick-up and top heater height.
VJ Electronix Inc., vjelectronix.com, Booth 5626
Harmony
SPX multi-axis Cartesian robot selectively solders through-hole and odd-form
components into surface-mount and mixed-technology PCBs. Suited for small or
large lot quantities and a high product mix. Conveyor system expands 4 to
18" under program control. Rotation and tilt axis are built into the
conveyor head. Can be configured with two 350 lb. solder pots. Permits up to
six separate solder nozzles.
Tyco Electronics, automation.tycoelectronics.com, Booth 5438
MTS500 Condor flying probe tester features rapid program development,
high throughput and handles large PCBs. Has four identical probes and
over 1000 fixed pins. Has a SMEMA-compatible conveyor; tests boards up
to 24 x 28". Test heads feature virtually maintenance-free x-y
positioning on a frictionless air cushion system.
DigitalTest, digitaltest.net Booth 5220
DigitalTest, digitaltest.net Booth 5220
AIM will highlight its lead-free soldering materials, including the
SN100C lead-free alloy. A live lead-free selective soldering
demonstration with the alloy is in booth 5437. SN100C, created by Nihon
Superior in Japan, is comprised of tin, copper and a small amount of
nickel. The nickel modifies its behavior so that in wave soldering it
exhibits fluidity comparable with tin-lead solder. Excess solder drains
easily off the joint, so bridges and icicles are avoided. Provides
smooth, bright, well-formed fillets which make inspection easy. Does
not contain silver or phosphorus, is less aggressive toward the copper
of traces and pads or the stainless steel components of soldering
equipment. Has a low dross rate.
AIM, aimsolder.com, Booth 5434
AIM, aimsolder.com, Booth 5434
Press Releases
- Pushed by glass core and high-end ICs substrates for AI, the advanced IC substrate market reaches $31 billion by 2030
- Pushed by glass core and high-end ICs substrates for AI, the advanced IC substrate market reaches $31 billion by 2030
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- Scanfil and Etteplan deepen their strategic partnership into production testing