Speedline Technologies and Agilent Technologies this week described results of a three-month design of experiment to understand and quantify variables in a lead-free manufacturing process.

The researchers found positional accuracy of the paste deposit relative to the pad to be the critical element in ensuring good fine pitch Pb-free assemblies, and is even more critical for some formulations than others. Solder volume can be readily managed across the supplier base with printer variables and stencil design. As with any solder pastes (Pb-free and Pb-bearing), the use of enclosed print heads such as the Rheometric pump will present advantages such as better aperture fill; however, it is not the determining factor for a high quality process. The atmosphere and profile of the reflow oven contribute substantially to the overall quality of the Pb-free assembly, the researchers found.

Coauthor Dr. Gerald Pham-van-Diep, director of advanced development at Speedline Technologies, said, “This study was undertaken to review the full potential for process needs as customers convert to Pb-free process technologies. It demonstrates that the process changes required in most situations to convert to Pb-free are not as daunting as some suppliers would have the industry believe. In essence, with appropriate process review, process development work and management of the variables available to the manufacturer, the switch to producing high-quality Pb-free assemblies is achievable.”

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DEK named Flash Electronics winner of its Combined Strength award, recognizing the EMS firm for its partnership and use of DEK's printing platforms.

Flash has been a DEK customer since 1994. The company has six locations worldwide.

Flash's  SMT engineering manager Long Pham said, "Since we often need to transfer product from our facilities in the Americas to locations in China, we must have a supplier partner that can provide us with global product consistency. Because of DEK's ability to repeat transfer product between their global facilities, partnering exclusively with them has eliminated these problems and allows us to ensure superior quality, cost efficiency and quick time to market."

DEK Americas general manager Neil MacRaild said, "The partnership has enabled product and process development on both sides: DEK has also gained from the shared knowledge of this relationship. The Flash and DEK teams have worked as one to find solutions to manufacturing challenges, add efficiency to global processes and help ensure high-yield, top quality products for Flash's well-known customers."

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The SMTA will consponsor the upcoming EMS China conference, the trade group announced this week.

The conference will be held Nov. 21-22, in Shanghai, in conjunction with the 66th China Electronics Fair and Asia Electronics Exhibition. The theme of the technical program is Benchmarking and Management of the OEM/EMS Relationship.

The conference lineup includes a workshop on optimizing the contract manufacturing partnership, and an EMS industry summit, during which presentations and discussions will address business partnerships in a global context.

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Michael Jansen, a principal manufacturing engineer at Lucent Technologies, today was awarded the Excellence in Service award by the SMTA.

The award is presented for exceptional dedication to the SMTA and leadership at the national, international or chapter level. The recipient must be an SMTA member for at least three years.

Jansen is a longtime member of the Boston chapter and has been heavily involved in a key round-robin study of lead-free soldering.