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The Semiconductor Feeding Solutions Group of Hover-Davis will highlight the latest addition of its Direct Die Feeding product line ¾ the DDf Ultra.
 
Is capable of feeding a range of bare die and flip chips with high throughput, and can be mounted on almost every placement machine.
 
Performance is optimized around the handling of small flip chips. Can feed die down to 0.5 mm sq. with a throughput exceeding 6,000 die/hr. ¾ with smaller die sizes and higher throughputs planned.
 
Roland Heitmann, director of the Semiconductor Feeding Solutions Group, said, “We have seen a rapid expansion in the number of applications requiring volume assembly of die below 1 mm sq., driven by RFID and LED technologies. These potential customers require very low assembly costs and have very high volumes. By combining our DDf Ultra with an SMT chip shooter, we can create a “die shooter” or “flip chip shooter,” which is essentially new class of die assembly solution.”
 
Hover-Davis, hoverdavis.com
Booth A5 224 Read more ...
Elektrobit is exhibiting a complete JOT Automation line, featuring a Bare Board Unstacker, Laser Marker, Segment Conveyor, the new High-Speed Router and a Single Flat Belt Conveyor.
 
J904-033 Tray Feeder Vivian Ultra features fast tray feeding using two shuttles and a compact tray feeder to enhance tray transportation to and from the robot working area. Tray dimensions and tray feeding height are adjustable.
 
J501-44 High-Speed Router uses grippers to hold the panel in place, ensuring short cycle duration. Cutting speed is up to 60 mm/s, depending on the layout and material of routed product, with a cutting accuracy of ±0.15 mm.
 
J401-11 Tiny Test Handler is being shown with display tester software for small LCD displays, keyboards and housings of electronics equipment. Caimsto offer high accuracy display defect detection and high immunity to significant variations in illumination, part orientation and the display’s protection tape.
 
J501-41 Stand Alone Mini-Router is a stand alone desktop router for topside routing. Small footprint offers flexibility for accurate, clean-cut routing. 

Elektrobit Group Plc., elektrobit.com
Booth A4, 316
 
Ultrasonic stencil cleaners require stencils to be immersed vertically into tall tanks from above the machine. Large stencils are placed in heavy metal baskets and manually lifted, causing difficulty and potential injury to the operator. Step platforms used to reduce lifting height occupy valuable floor space and present potential hazard to foot traffic.
 
ErgoSonic Stencil Cleaner combines the cleaning efficiency of ultrasonics with the convenience and ease of front-loading. Unconventional lifting, awkward loading platforms and heavy stencil baskets are eliminated.
 
Smart Sonic Corp., smartsonic.com
Booth A4, 419
Second-generation Condor 500 is now reportedly 30 % faster  - with integrated boundary scan and implemented soft landing tool. Flying prober has unique drive technology via linear motor, to ensure high speed and accuracy. The complete software allows fast test program development directly out of the CAD data and the parts-lists. Off-line simulation, panels and different versions of PCBs are also supported. Allows ICT and functional test, opens check, memory test/and programming, boundary scan and vision. Boundary-scan integration allows the heads and further pins to be driven parallel to boundary-scan.Said to improve throughput 3 to 5X over conventional flying prober systems. Software has an integrated quality management system and paperless repair, statistics and fault coverage reports.

Digitaltest GmbH, digitaltest.de or digitaltest.net
Booth  A1, 365 Read more ...
With the same look and feel as the MG-1 (introduced at Apex), the MG-8 is equipped with a high-precision placement beam carrying three FNC heads, each carrying six nozzles, to handle components from 01005 to 55 x 100mm, with max. component height 25.5 mm. Precision z-force control delivers snap-in force for connectors and the delicate handling required to avoid cracking 01005s. Achieves accuracy ratings of 50 micron for chips and 30 micron for QFPs, and placement speed for ICs and QFPs of 7.5k cph. Accommodates 90 smart feeders along with stick, bulk and tray feeding solutions.  A large component sequencer contains 60 pallets, with two in-line loading heads doubling the rate of delivery of components to the machine. An automatic tray stacker holds up to 30 trays in quick-change containers. Coplanarity system checks three components simultaneously, a e side viewing camera option verifies 01005 or 0201 presence at the nozzle. Has a nozzle cleaning system.  


Assembléon, assembleon.com
Booth A4, 179
DRS 24 offers selective soldering and rework of SMD components including BGAs, QFPs, flip chips, CSPs and connectors.  Has solid construction on a stable platform for precise, accurate movements. A 3500 W, underboard infra-red pre-heater, used with the 1000 W top heater, minimizes the temperature delta – crucial for the additional energy and control demanded by lead-free processes. 
 
Soldering profiles are created with the user-friendly software and profile parameters are maintained within tight tolerances for  repeatable results.
 
Ideal for repairs, prototyping, post-assembly and low-volume assembly of all devices using a new universal nozzle. Custom nozzles can also be supplied f.
 
Zevac AG, zevac.ch
Productronica Hall A3, Booth 177

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