Uncategorised
RFID Smart Feeder Cart expands the concept of intelligent feeders from SMT placement machines and feeder banks to storage carts.
Benefits include:
Ability to track feeders and components offline.
Provide real-time inventory.
Eliminate human intervention.
Eliminate bar code scanning.
Reduce waste of time and materials.
Can be used in combination with Cogiscan software applications (Line Set-up Control, Traceability, Inventory Tracking, etc.) or with third-party software applications. It can enhance existing systems by eliminating manual barcode scanning.
Cogiscan, cogiscan.com
Booth A4, 380 (PB-Technik, Cogiscan’s local distributor in Germany)
Booth A5, 224 (Hover-Davis, Cogiscan technology partner)
Benefits include:
Ability to track feeders and components offline.
Provide real-time inventory.
Eliminate human intervention.
Eliminate bar code scanning.
Reduce waste of time and materials.
Can be used in combination with Cogiscan software applications (Line Set-up Control, Traceability, Inventory Tracking, etc.) or with third-party software applications. It can enhance existing systems by eliminating manual barcode scanning.
Cogiscan, cogiscan.com
Booth A4, 380 (PB-Technik, Cogiscan’s local distributor in Germany)
Booth A5, 224 (Hover-Davis, Cogiscan technology partner)
MVP will display its wire bond capability with the high-speed AutoInspector Ultra II. Defects such as wire trace conformity, bent wires, distance to adjacent wires, loop height, straightness tolerance, ball/wedge geometry and contamination can be detected with wire bond configuration.
3-D inspection and color camera solutions will also be presented for wire bond or other applications that benefit from color cameras. Flexible algorithms process the color image and enhance detection performance.
3-D inspection capability extends the AutoInspector Series defect coverage by adding 3-D coverage for paste inspection for the entire board or selected areas of the board, as well as for production sampling mode in which the system inspects 3-D based on a user-selected sampling rate. The modularity maximizes flexibility and provides for field upgrades capable for 0201s and microBGAs.
GEM Series Software version 5.0 is said to improve the overall ease of use of the system with a redesigned graphical interface for quick algorithm set-up and guidance in setting parameters. The software guides users on setting up the inspection parameters, for a significant improvement in productivity and reduction of training time. Enhancements include onscreen graphics, spreadsheet utilities, modular debug within each algorithm, and database and algorithm navigation tools.
Machine Vision Products Inc., sales@machinevisionproducts.com
Booth A2, 251
3-D inspection and color camera solutions will also be presented for wire bond or other applications that benefit from color cameras. Flexible algorithms process the color image and enhance detection performance.
3-D inspection capability extends the AutoInspector Series defect coverage by adding 3-D coverage for paste inspection for the entire board or selected areas of the board, as well as for production sampling mode in which the system inspects 3-D based on a user-selected sampling rate. The modularity maximizes flexibility and provides for field upgrades capable for 0201s and microBGAs.
GEM Series Software version 5.0 is said to improve the overall ease of use of the system with a redesigned graphical interface for quick algorithm set-up and guidance in setting parameters. The software guides users on setting up the inspection parameters, for a significant improvement in productivity and reduction of training time. Enhancements include onscreen graphics, spreadsheet utilities, modular debug within each algorithm, and database and algorithm navigation tools.
Machine Vision Products Inc., sales@machinevisionproducts.com
Booth A2, 251
Designed for the manufacturing floor, X1550 features large board x-ray inspection with automated motion control, measurement and analysis. Includes advanced solid-state detector-based inspection for lead-free assembly, choice of Image Intensifier and CMOS-based high-resolution detectors, full programmability with integrated motion control and image measurement analysis, and simple set up of program using 1-2-GO Interface. Reportedly low-maintenance, requiring minimum operator intervention.
Offers a 130 kV x-ray source, with a continuously variable field of view (up to 1.8" with zoom). Said to be easy to learn, use and maintain. Has large-board handling area (18 x 24"), magnification 700X, high MTBF, fully integrated compact system and image archiving in popular file formats.
Provides high-contrast resolutio, has integrated motion control and image measurement analysis.
Incorporates a manipulator design that is said to provide fast, accurate, repeatable sample positioning; Nexus 300 software with 1-2-GO interface and onscreen sample representation for easy maneuverability; and CMOS-based 12 bit solid-state detectors.
Comes with an advanced image processor and a complete library of measurement and analysis tools. NEXUS 300 software has: advanced 1-2-GO based operator interface for easy programming in minutes; automated BGA analysis module (# of balls, void size, # of voids, ball size, pitch and circularity); percent void measurement module (user definable pass/fail thresholds); onscreen representation of sample; drill offset measurement module (deviation measurements, etc.); dimensional measurement module; wire sweep measurement module; quad-view display; Advanced Defect Enhancement (ADE) module; histogram analysis tools (gray-level analysis); image filtering (3-D rendering, sharpen, relief, etc.) ; and pseudo color pallet manipulation.
VJ Electronix, vjelectronix.com
Comes with an advanced image processor and a complete library of measurement and analysis tools. NEXUS 300 software has: advanced 1-2-GO based operator interface for easy programming in minutes; automated BGA analysis module (# of balls, void size, # of voids, ball size, pitch and circularity); percent void measurement module (user definable pass/fail thresholds); onscreen representation of sample; drill offset measurement module (deviation measurements, etc.); dimensional measurement module; wire sweep measurement module; quad-view display; Advanced Defect Enhancement (ADE) module; histogram analysis tools (gray-level analysis); image filtering (3-D rendering, sharpen, relief, etc.) ; and pseudo color pallet manipulation.
VJ Electronix, vjelectronix.com
Booth A1 339
RoHS Compliant SuperM.O.L.E. Gold thermal profiler contains no lead or the other banned substances in the board finish, components or hardware.
Companies that are or will manufacture lead-free electronics products can specify a RoHS Complaint thermal profiler for developing and managing their soldering recipes.
ECD, ecd.com
Booth A4 240
Companies that are or will manufacture lead-free electronics products can specify a RoHS Complaint thermal profiler for developing and managing their soldering recipes.
ECD, ecd.com
Booth A4 240
Coming Soon...
Aquanox A4630, the latest aqueous electronics cleaning material, was
designed to clean lead-free materials while providing low cost of
ownership. Said to bring ambient temperatures and low concentrations
while exceeding industry standards for personnel and environmental
safety.
Typically used in aqueous spray-in-air equipment at 10 to 20% from ambient temperatures. Reportedly provides brilliant joints, pass after pass, without the use of sump side additives. Equally effective on all no-clean materials.
Is easy to use, people-safe and environmentally friendly. Is multi-metal safe for use on yellow metals, aluminum, ferrous and composites as well as most precious metals and some plastic, rubber, glass and ceramic substrates.
Kyzen, kyzen.com
Booth A4 323/2
Typically used in aqueous spray-in-air equipment at 10 to 20% from ambient temperatures. Reportedly provides brilliant joints, pass after pass, without the use of sump side additives. Equally effective on all no-clean materials.
Is easy to use, people-safe and environmentally friendly. Is multi-metal safe for use on yellow metals, aluminum, ferrous and composites as well as most precious metals and some plastic, rubber, glass and ceramic substrates.
Kyzen, kyzen.com
Booth A4 323/2
Press Releases
- NEOTech Significantly Improves Wire Bond Pull Test Process
- Sat Nusapersada Chooses Siemens' Process Preparation Software to Boost NPI and SMT Line Efficiency
- SIA Praises Finalization of CHIPS Investments for GlobalFoundries Manufacturing Projects
- KYZEN to Spotlight KYZEN E5631, AQUANOX A4618 and Process Control at SMTA Silicon Valley Expo and Tech Forum