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The 1710 Universal Engineering Programmer combines ultra-fast programming technology, FX4 socket modules and support for more than 23,000 devices, including devices down to 1.5 V, including EPROM, EEPROM, Flash EPROM, Microcontrollers, PLD, CPLD, FPGA and antifuse FPGAs.
Can program devices with densities up to 4 Gbits, incorporates high-speed USB 2.0 standard bus for communications.
FX4 socket modules program up to four devices simultaneously on one programming site, making it ideal for low-volume production environments. The modules include three separate LEDs per socket.
Can use more than 2,000 standard manual and automated socket modules.
Supports all device packages, including DIP, SDIP, PLCC, TSOP, SSOP, PCMCIA, SOIC, LCC, QFP, PQFP, PGA, SIMM, CSP, BGA, microBGA, TQFP and TSSOP. Also guards against passing blank parts.
BP Microsystems, bpmicro.com
Booth A3 424
Can program devices with densities up to 4 Gbits, incorporates high-speed USB 2.0 standard bus for communications.
FX4 socket modules program up to four devices simultaneously on one programming site, making it ideal for low-volume production environments. The modules include three separate LEDs per socket.
Can use more than 2,000 standard manual and automated socket modules.
Supports all device packages, including DIP, SDIP, PLCC, TSOP, SSOP, PCMCIA, SOIC, LCC, QFP, PQFP, PGA, SIMM, CSP, BGA, microBGA, TQFP and TSSOP. Also guards against passing blank parts.
BP Microsystems, bpmicro.com
Booth A3 424
SP880avi 29" large-area inline printer uses a patented “look down, look down” approach to vision alignment. Twin roving cameras mounted on independent X/Y gantries ensure accurate, repeatable alignment.
Facilitates a unique “paste on stencil” inspection feature. Users can determine if there is adequate paste on the stencil before running the print cycle.
“Selective Auto-Paste Dispense” technology is fully programmable. The twin camera vision system analyzes the stencil to see where paste is required, and the dispenser deposits accordingly.
The user interface runs under a menu-driven, Windows XP application and is simple to operate. The software incorporates self-diagnostic capabilities, including production logging and automatic fault report generation. Data may be accessed remotely via a PC modem connection for on-the-fly trouble shooting.
Automatic stencil loading enables the operator to easily switch between 23 to 29" stencil frames at the touch of a button. Options include 2-D inspection, SPC and a vacuum assisted wet/dry under screen cleaner.
Speedprint Technology, speedprint-tech.com
Booth A4 121
Facilitates a unique “paste on stencil” inspection feature. Users can determine if there is adequate paste on the stencil before running the print cycle.
“Selective Auto-Paste Dispense” technology is fully programmable. The twin camera vision system analyzes the stencil to see where paste is required, and the dispenser deposits accordingly.
The user interface runs under a menu-driven, Windows XP application and is simple to operate. The software incorporates self-diagnostic capabilities, including production logging and automatic fault report generation. Data may be accessed remotely via a PC modem connection for on-the-fly trouble shooting.
Automatic stencil loading enables the operator to easily switch between 23 to 29" stencil frames at the touch of a button. Options include 2-D inspection, SPC and a vacuum assisted wet/dry under screen cleaner.
Speedprint Technology, speedprint-tech.com
Booth A4 121
Flexys-10 intelligent placement system is for low- to medium-volume
high-mix production. Rated at 10,000 cph, places 0201s to the largest
QFPs on the market and offers eight new turret positions.
The improved eight-position rotary head with on-the-fly vision helps maintain high throughput even for boards with a range of components. Has feeder capacity of 128 x 8 mm tapes.
Benefits include protection of investment, intelligent feeder technology and “smart” nozzles.
Offers speed of 10,000 cph and component range of 0201 to 50 x 50 mm standard (70 x 70 mm as an option), Flexys-10 has an accuracy of ±60 mm to ±100 mm at 4 Sigma depending on the component type. Features a minimum pitch of 0.4 mm and a tape size range of 8 to 88 mm. Can accommodate tape, stick or tray feeder types.
Available options: standalone or in-line conveyors, intelligent belt feeders, intelligent vibratory feeders, intelligent internal matrix tray, intelligent matrix tray sequencer, offline storage trolley, barcode reader, glue dispenser, fixed upward vision camera, component verification and software.
Europlacer, europlacer.com
Booth A4 121
The improved eight-position rotary head with on-the-fly vision helps maintain high throughput even for boards with a range of components. Has feeder capacity of 128 x 8 mm tapes.
Benefits include protection of investment, intelligent feeder technology and “smart” nozzles.
Offers speed of 10,000 cph and component range of 0201 to 50 x 50 mm standard (70 x 70 mm as an option), Flexys-10 has an accuracy of ±60 mm to ±100 mm at 4 Sigma depending on the component type. Features a minimum pitch of 0.4 mm and a tape size range of 8 to 88 mm. Can accommodate tape, stick or tray feeder types.
Available options: standalone or in-line conveyors, intelligent belt feeders, intelligent vibratory feeders, intelligent internal matrix tray, intelligent matrix tray sequencer, offline storage trolley, barcode reader, glue dispenser, fixed upward vision camera, component verification and software.
Europlacer, europlacer.com
Booth A4 121
FLX2020-V flexible
pick-and-place system for high-mix production offers a large
application range and allows production changes without downtime. Modular
system features up to 310 feeders, graphical control software,
inventory control and traceability, and changeover without downtime.
Features off-line
production preparation, programming, intelligent
feeders and a large feeder capacity. Can accept nearly any kind of feeding system. Equipped
with a combination of laser and vision alignment systems, for chip shooting and ultra-fine-pitch placement. Has
a real-time database for traceability and stock management, which can
be linked to existing planning systems. Can be expanded for higher
throughput or more feeders.
ESSEMTEC, essemtec.com
Booths A5 477 and 478
ESSEMTEC, essemtec.com
Booths A5 477 and 478
Tyco will highlight a line of reel-to-reel RFID systems. Feature throughput to 9,000 cph, a 20" wide Web process capability and 12 mm placement repeatability at ± 3 Sigma.
Offers either passive or active designs, direct die pick from wafers to 0.008" and positive displacement dispense technology. Modular construction allows for future capacity expansion. Can place ancillary components such as batteries, capable of tape-and-reel die placement.
Uses a dispenser module with patented positive displacement pump technology, a placement system that has 12 mm repeatability and complete closed loop process control on the thermal compression station. The programmability provides control of the process. Cure station provides pressure control of each thermode, and real-time feedback provides statistical process control. Each module reports to the master controller during operation and this same master controller collects key process inputs, monitors system status, advances the web and alerts the operator to process issues. Is fully automatic.
Can handle either a straight die application or one that may change over time to use various methods of component presentation. Provides rapid changeover to facilitate using the system for prototype applications.
Tyco Electronics, tycoelectronics.com
Booth B6, 225
Offers either passive or active designs, direct die pick from wafers to 0.008" and positive displacement dispense technology. Modular construction allows for future capacity expansion. Can place ancillary components such as batteries, capable of tape-and-reel die placement.
Uses a dispenser module with patented positive displacement pump technology, a placement system that has 12 mm repeatability and complete closed loop process control on the thermal compression station. The programmability provides control of the process. Cure station provides pressure control of each thermode, and real-time feedback provides statistical process control. Each module reports to the master controller during operation and this same master controller collects key process inputs, monitors system status, advances the web and alerts the operator to process issues. Is fully automatic.
Can handle either a straight die application or one that may change over time to use various methods of component presentation. Provides rapid changeover to facilitate using the system for prototype applications.
Tyco Electronics, tycoelectronics.com
Booth B6, 225
Micro-Line Digital Dispensing Head consists of a high-speed liquid metering valve and a precision nozzle.
Applies conformal coatings in precise lines or dots down to 1 mm with the liquid flow rate set electronically with the Prism software. The coating is applied at a distance from 5 to 15 mm between the nozzle tip and the substrate. The technology is said to be more effective than conventional needle dispensing.
Ultrasonic Systems, ultraspray.com
Booth A4 158
Applies conformal coatings in precise lines or dots down to 1 mm with the liquid flow rate set electronically with the Prism software. The coating is applied at a distance from 5 to 15 mm between the nozzle tip and the substrate. The technology is said to be more effective than conventional needle dispensing.
Ultrasonic Systems, ultraspray.com
Booth A4 158
Press Releases
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