Uncategorised
Aquanox A4630, the latest aqueous electronics cleaning material, was
designed to clean lead-free materials while providing low cost of
ownership. Said to bring ambient temperatures and low concentrations
while exceeding industry standards for personnel and environmental
safety.
Typically used in aqueous spray-in-air equipment at 10 to 20% from ambient temperatures. Reportedly provides brilliant joints, pass after pass, without the use of sump side additives. Equally effective on all no-clean materials.
Is easy to use, people-safe and environmentally friendly. Is multi-metal safe for use on yellow metals, aluminum, ferrous and composites as well as most precious metals and some plastic, rubber, glass and ceramic substrates.
Kyzen, kyzen.com
Booth A4 323/2
Typically used in aqueous spray-in-air equipment at 10 to 20% from ambient temperatures. Reportedly provides brilliant joints, pass after pass, without the use of sump side additives. Equally effective on all no-clean materials.
Is easy to use, people-safe and environmentally friendly. Is multi-metal safe for use on yellow metals, aluminum, ferrous and composites as well as most precious metals and some plastic, rubber, glass and ceramic substrates.
Kyzen, kyzen.com
Booth A4 323/2
EnviroMark 907 (EM907) no-clean, lead-free solder paste is designed for the higher thermal demands of higher melting temperature lead-free alloys.
Said to feature a long stencil life and offer lead-free joints that resemble those achieved with Sn/Pb solder paste. Capable of extended downtimes in printing, maintains excellent print quality at print speeds up to 6 in/sec. (150 mm/sec.). Reportedly has excellent cold and hot slump behavior, thus preventing bridges and solder ball formation.
Has excellent solderability to a variety of board surface metallizations, including OSP, Ni/Au, Immersion Sn and Immersion Ag. Features solderability to an array of component metallizations, including Pd/Ag and Alloy 42. Flux chemistry offers bright solder joints, even in air reflow, an added benefit during inspection. Leaves only a light-colored residue and provides a stable tack life. Reflowable in air or nitrogen, prints down to 0201 pad sites and meets J-STD-004 Flux Classification ROL0.
Kester, kester.com
Said to feature a long stencil life and offer lead-free joints that resemble those achieved with Sn/Pb solder paste. Capable of extended downtimes in printing, maintains excellent print quality at print speeds up to 6 in/sec. (150 mm/sec.). Reportedly has excellent cold and hot slump behavior, thus preventing bridges and solder ball formation.
Has excellent solderability to a variety of board surface metallizations, including OSP, Ni/Au, Immersion Sn and Immersion Ag. Features solderability to an array of component metallizations, including Pd/Ag and Alloy 42. Flux chemistry offers bright solder joints, even in air reflow, an added benefit during inspection. Leaves only a light-colored residue and provides a stable tack life. Reflowable in air or nitrogen, prints down to 0201 pad sites and meets J-STD-004 Flux Classification ROL0.
Kester, kester.com
Booth A4 363
Finetech will co-sponsor and participate in the Lead-free Interactive Forum in booth A6.105 during Productronica.
The Forum is a daily hands-on experience with aspects of lead-free materials and production equipment. Participants will learn about current process experience in soldering, inspection, component requirements, printed board design/specification, product reliability and rework. The Forum will offer a mixture of free technical presentations, panel discussions and hands-on demonstrations in a live production environment.
As a Process Provider, Finetech will demonstrate advanced rework equipment, and will have a technical expert available to provide advice on how to implement and improve lead-free rework yields.
Each day during the show, a panel discussion will be held covering different aspects of the manufacturing process. Topics will deal with specific questions posed by registered visitors. Finetech’s Gunter Kuerbis will participate on the Friday panel covering inspection, test and rework.
The Forum is a daily hands-on experience with aspects of lead-free materials and production equipment. Participants will learn about current process experience in soldering, inspection, component requirements, printed board design/specification, product reliability and rework. The Forum will offer a mixture of free technical presentations, panel discussions and hands-on demonstrations in a live production environment.
As a Process Provider, Finetech will demonstrate advanced rework equipment, and will have a technical expert available to provide advice on how to implement and improve lead-free rework yields.
Each day during the show, a panel discussion will be held covering different aspects of the manufacturing process. Topics will deal with specific questions posed by registered visitors. Finetech’s Gunter Kuerbis will participate on the Friday panel covering inspection, test and rework.
Finetech, finetechusa.com
KIC will co-sponsor and participate in the Lead-free Interactive Forum in booth A6.105 at Productronica.
As a Process Provider, KIC will demonstrate thermal profiling systems, process optimization tools, as well as continuous process monitoring and traceability systems. KIC will have a technical expert available to provide advice on how to implement and improve lead-free manufacturing process yields.
Each day during the show, a panel discussion will be held covering different aspects of the manufacturing process. Topics will deal with specific questions posed by registered visitors. KIC’s MB Allen will participate on the Thursday panel covering soldering processes.
KIC, kicthermal.com
As a Process Provider, KIC will demonstrate thermal profiling systems, process optimization tools, as well as continuous process monitoring and traceability systems. KIC will have a technical expert available to provide advice on how to implement and improve lead-free manufacturing process yields.
Each day during the show, a panel discussion will be held covering different aspects of the manufacturing process. Topics will deal with specific questions posed by registered visitors. KIC’s MB Allen will participate on the Thursday panel covering soldering processes.
KIC, kicthermal.com
The 1710 Universal Engineering Programmer combines ultra-fast programming technology, FX4 socket modules and support for more than 23,000 devices, including devices down to 1.5 V, including EPROM, EEPROM, Flash EPROM, Microcontrollers, PLD, CPLD, FPGA and antifuse FPGAs.
Can program devices with densities up to 4 Gbits, incorporates high-speed USB 2.0 standard bus for communications.
FX4 socket modules program up to four devices simultaneously on one programming site, making it ideal for low-volume production environments. The modules include three separate LEDs per socket.
Can use more than 2,000 standard manual and automated socket modules.
Supports all device packages, including DIP, SDIP, PLCC, TSOP, SSOP, PCMCIA, SOIC, LCC, QFP, PQFP, PGA, SIMM, CSP, BGA, microBGA, TQFP and TSSOP. Also guards against passing blank parts.
BP Microsystems, bpmicro.com
Booth A3 424
Can program devices with densities up to 4 Gbits, incorporates high-speed USB 2.0 standard bus for communications.
FX4 socket modules program up to four devices simultaneously on one programming site, making it ideal for low-volume production environments. The modules include three separate LEDs per socket.
Can use more than 2,000 standard manual and automated socket modules.
Supports all device packages, including DIP, SDIP, PLCC, TSOP, SSOP, PCMCIA, SOIC, LCC, QFP, PQFP, PGA, SIMM, CSP, BGA, microBGA, TQFP and TSSOP. Also guards against passing blank parts.
BP Microsystems, bpmicro.com
Booth A3 424
SP880avi 29" large-area inline printer uses a patented “look down, look down” approach to vision alignment. Twin roving cameras mounted on independent X/Y gantries ensure accurate, repeatable alignment.
Facilitates a unique “paste on stencil” inspection feature. Users can determine if there is adequate paste on the stencil before running the print cycle.
“Selective Auto-Paste Dispense” technology is fully programmable. The twin camera vision system analyzes the stencil to see where paste is required, and the dispenser deposits accordingly.
The user interface runs under a menu-driven, Windows XP application and is simple to operate. The software incorporates self-diagnostic capabilities, including production logging and automatic fault report generation. Data may be accessed remotely via a PC modem connection for on-the-fly trouble shooting.
Automatic stencil loading enables the operator to easily switch between 23 to 29" stencil frames at the touch of a button. Options include 2-D inspection, SPC and a vacuum assisted wet/dry under screen cleaner.
Speedprint Technology, speedprint-tech.com
Booth A4 121
Facilitates a unique “paste on stencil” inspection feature. Users can determine if there is adequate paste on the stencil before running the print cycle.
“Selective Auto-Paste Dispense” technology is fully programmable. The twin camera vision system analyzes the stencil to see where paste is required, and the dispenser deposits accordingly.
The user interface runs under a menu-driven, Windows XP application and is simple to operate. The software incorporates self-diagnostic capabilities, including production logging and automatic fault report generation. Data may be accessed remotely via a PC modem connection for on-the-fly trouble shooting.
Automatic stencil loading enables the operator to easily switch between 23 to 29" stencil frames at the touch of a button. Options include 2-D inspection, SPC and a vacuum assisted wet/dry under screen cleaner.
Speedprint Technology, speedprint-tech.com
Booth A4 121
