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Second-generation Condor 500 is now reportedly 30 % faster
- with integrated boundary scan and implemented soft landing tool.
Flying prober has unique drive technology via linear motor, to ensure
high speed and accuracy. The complete software allows fast test program
development directly out of the CAD data and the parts-lists. Off-line
simulation, panels and different versions of PCBs are also supported.
Allows ICT and functional test, opens check, memory test/and
programming, boundary scan and vision. Boundary-scan integration allows
the heads and further pins to be driven parallel to boundary-scan.Said
to improve throughput 3 to 5X over conventional flying prober systems.
Software has an integrated quality management system and paperless
repair, statistics and fault coverage reports.
Digitaltest GmbH, digitaltest.de or digitaltest.net
Booth A1, 365
Digitaltest GmbH, digitaltest.de or digitaltest.net
Booth A1, 365
With the same look and feel as the MG-1 (introduced at Apex), the MG-8 is equipped with a high-precision placement beam carrying three FNC heads, each carrying six nozzles, to handle components from 01005 to 55 x 100mm, with max. component height 25.5 mm. Precision z-force control delivers snap-in force for connectors and the delicate handling required to avoid cracking 01005s. Achieves accuracy ratings of 50 micron for chips and 30 micron for QFPs, and placement speed for ICs and QFPs of 7.5k cph. Accommodates 90 smart feeders along with stick, bulk and tray feeding solutions. A large component sequencer contains 60 pallets, with two in-line loading heads doubling the rate of delivery of components to the machine. An automatic tray stacker holds up to 30 trays in quick-change containers. Coplanarity system checks three components simultaneously, a e side viewing camera option verifies 01005 or 0201 presence at the nozzle. Has a nozzle cleaning system.
Assembléon, assembleon.com
Booth A4, 179
Assembléon, assembleon.com
Booth A4, 179
DRS 24 offers selective soldering and rework of SMD components including BGAs, QFPs, flip chips, CSPs and connectors. Has solid construction on a stable platform for precise, accurate movements. A 3500 W, underboard infra-red pre-heater, used with the 1000 W top heater, minimizes the temperature delta – crucial for the additional energy and control demanded by lead-free processes.
Soldering profiles are created with the user-friendly software and profile parameters are maintained within tight tolerances for repeatable results.
Ideal for repairs, prototyping, post-assembly and low-volume assembly of all devices using a new universal nozzle. Custom nozzles can also be supplied f.
Zevac AG, zevac.ch
Productronica Hall A3, Booth 177
Soldering profiles are created with the user-friendly software and profile parameters are maintained within tight tolerances for repeatable results.
Ideal for repairs, prototyping, post-assembly and low-volume assembly of all devices using a new universal nozzle. Custom nozzles can also be supplied f.
Zevac AG, zevac.ch
Productronica Hall A3, Booth 177
microme|x is a high resolution x-ray inspection system with a large scanning area (20 x 24"), a precise manipulation unit with 360° rotation axis and the approved ovhm technology for oblique views up to 70° at constant magnification. Operators can inspect large boards with mixed assemblies and acquire real-time oblique views under all angles.
Has board handling unit connection for fully automated loading of assembled boards in the production plant. In connection with the inspection software, XE², can perform a fully automated inspection and evaluation of BGA, CGA, QFP, THT and other solder joints. An interface for the CAD data import allows use of the original PCB layout to teach in the inspection routine. Inspection reports can be transferred to a rework station by the repair program quality. The SPC module allows statistical evaluation of the inspection results and the process supervision.
phoenix x-ray Systems + Services GmbH, phoenix-xray.com
Productronica Hall A2, Booth 277
Under a global OEM reselling agreement, Hover-Davis will offer Cogiscan's RFID hardware and software applications that mix with their tape feeders, label feeders and direct die feeders. Hover-Davis will now be able to provide intelligent feeding solutions that seamlessly integrate with existing equipment and information systems.
Hover-Davis’s intelligent feeders identify and track components and feeders with barcode and RFID and provide real-time visibility of all materials on the shop floor.
Rick Howe, Hover-Davis vice president of sales and marketing, said, "We are very excited about this new step in our partnership with Cogiscan. We feel that our customers will greatly benefit from our ever increasing range of feeding solutions, making it more and more compelling to integrate them with their manufacturing systems."
Francois Monette, Cogiscan vice president of sales and marketing, said, "This represents an important step in our vision of becoming the global standard for RFID-based material control in our industry."
Indium Corp. of America appointed Chimie Tech Services to distribute
its line of solder materials in France.
CTS will handle sales and service of Indium's solder pastes, wave solder fluxes, solder wire and solder preforms portfolio. The firm has experience in supplying consumable materials and equipment for the manufacture of active and passive components, Indium said.
Indium European managing director Brian Craig said, "CTS will be a great asset to Indium's presence in France. We are very excited to have them on the Indium team in Europe."
CTS will handle sales and service of Indium's solder pastes, wave solder fluxes, solder wire and solder preforms portfolio. The firm has experience in supplying consumable materials and equipment for the manufacture of active and passive components, Indium said.
Indium European managing director Brian Craig said, "CTS will be a great asset to Indium's presence in France. We are very excited to have them on the Indium team in Europe."
Press Releases
- Indium Corporation Technical Expert to Present at SiP Conference China
- Flex Announces Kevin Krumm as Chief Financial Officer
- Green Circuits Enhances Inspection Capabilities with New DAGE Quadra 5 Pro X-ray System
- Western Digital CEO David Goeckeler Elected Chair of Semiconductor Industry Association