FLX2020-V flexible pick-and-place system for high-mix production offers a large application range and allows production changes without downtime. Modular system features up to 310 feeders, graphical control software, inventory control and traceability, and changeover without downtime. Features off-line production preparation, programming, intelligent feeders and a large feeder capacity. Can accept nearly any kind of feeding system. Equipped with a combination of laser and vision alignment systems, for chip shooting and ultra-fine-pitch placement. Has a real-time database for traceability and stock management, which can be linked to existing planning systems. Can be expanded for higher throughput or more feeders.
 
ESSEMTEC, essemtec.com
Booths A5 477 and 478

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Tyco will highlight a line of reel-to-reel RFID systems. Feature throughput to 9,000 cph, a 20" wide Web process capability and 12 mm placement repeatability at ± 3 Sigma.
 
Offers either passive or active designs, direct die pick from wafers to 0.008" and positive displacement dispense technology. Modular construction allows for future capacity expansion. Can place ancillary components such as batteries, capable of tape-and-reel die placement.
 
Uses a dispenser module with patented positive displacement pump technology, a placement system that has 12 mm repeatability and complete closed loop process control on the thermal compression station. The programmability provides control of the process. Cure station provides pressure control of each thermode, and real-time feedback provides statistical process control. Each module reports to the master controller during operation and this same master controller collects key process inputs, monitors system status, advances the web and alerts the operator to process issues. Is fully automatic.
 
Can handle either a straight die application or one that may change over time to use various methods of component presentation. Provides rapid changeover to facilitate using the system for prototype applications.
 
Tyco Electronics, tycoelectronics.com
Booth B6, 225

Micro-Line Digital Dispensing Head consists of a high-speed liquid metering valve and a precision nozzle.
 
Applies conformal coatings in precise lines or dots down to 1 mm with the liquid flow rate set electronically with the Prism software.  The coating is applied at a distance from 5 to 15 mm between the nozzle tip and the substrate.  The technology is said to be more effective than conventional needle dispensing.
 
Ultrasonic Systems, ultraspray.com
Booth A4 158

The Semiconductor Feeding Solutions Group of Hover-Davis will highlight the latest addition of its Direct Die Feeding product line ¾ the DDf Ultra.
 
Is capable of feeding a range of bare die and flip chips with high throughput, and can be mounted on almost every placement machine.
 
Performance is optimized around the handling of small flip chips. Can feed die down to 0.5 mm sq. with a throughput exceeding 6,000 die/hr. ¾ with smaller die sizes and higher throughputs planned.
 
Roland Heitmann, director of the Semiconductor Feeding Solutions Group, said, “We have seen a rapid expansion in the number of applications requiring volume assembly of die below 1 mm sq., driven by RFID and LED technologies. These potential customers require very low assembly costs and have very high volumes. By combining our DDf Ultra with an SMT chip shooter, we can create a “die shooter” or “flip chip shooter,” which is essentially new class of die assembly solution.”
 
Hover-Davis, hoverdavis.com
Booth A5 224

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